Method and apparatus for components with a reduced average roughness
View Patent ↗In an exemplary embodiment of the present invention: A series of U-shaped nickel-iron components are plated onto a rough or roughened semiconductor package or printed circuit board material. The horizontal base of the U-shaped component has a surface roughness of the semiconductor package material. The vertical surfaces of the U-shape have a surface roughness derived from the dry film. The large smooth vertical surface allows the U-shaped nickel-iron components to have a low average roughness. The lowered average roughness reduces the path length the U-shaped nickel-iron components provide for magnetic flux while the roughness of the horizontal portion of the U-shape allows for increased mechanical bonding to occur.
1 . A component material layer stack, comprising: a magnetic core material with a U-shape cross-section, a portion of an outer surface of the magnetic core material with a U-shape cross-section having a rough contoured surface, the rough contoured surface of the magnetic core material operably bonded to a roughened portion of a base layer.
2 . The component material layer stack of claim 1 , wherein the rough contoured surface of the magnetic core material with a U-shape cross-section is operably bonded to the rough portion of the base layer by utilization of an intermediary seed.
3 . The component material layer stack of claim 1 , further comprising a semiconductor packaging encapsulating the magnetic core material with a U-shape cross-section.
4 . The component material layer stack of claim 1 , wherein an average total surface roughness Ra of the magnetic core material with a U-shape cross-section is less than 5 microns.
5 . The component material layer stack of claim 1 , wherein the magnetic core material with a U-shape cross-section is nickel-iron.
6 . The component material layer stack of claim 1 , further comprising at least one additional layer of magnetic core material with a U-shaped cross-section arranged in a vertical stack on the magnetic core material with a U-shape cross-section.
7 . The component material layer stack of claim 6 , wherein a first and a last pillar of each at least one additional layer of magnetic core material with a U-shaped cross-section are operationally connected to a first pillar and a last pillar, respectively, of an adjacent layer of magnetic core material with a U-shaped cross section.
8 . The component material layer stack of claim 7 , wherein each at least one additional layer of magnetic core material with a U-shaped cross-section is operably separated from the adjacent layer by a seed layer.
9 . The component material layer stack of claim 8 , wherein each at least one additional layer of magnetic core material with a U-shaped cross-section is operably separated from the adjacent layer by an additional component layer.