Ceramic electronic component with carrier substrate, mounting structure of ceramic electronic component, and electronic component array
A ceramic electronic component with a carrier substrate includes a ceramic electronic component including first and second principal surfaces, first and second end surfaces, first and second side surfaces, and at least two external electrodes on an outer surface of the ceramic electronic component, and a carrier substrate attached to the second principal surface of the ceramic electronic component, wherein a first adhesive layer is on the first principal surface of the ceramic electronic component.
1 . A ceramic electronic component comprising:
a ceramic electronic component including a first principal surface and a second principal surface, a first end surface and a second end surface, a first side surface and a second side surface, and at least two external electrodes on an outer surface of the ceramic electronic component; and
a carrier substrate attached to the second principal surface of the ceramic electronic component; wherein
a first adhesive layer is on the first principal surface of the ceramic electronic component;
the second principal surface of the ceramic electronic component and the carrier substrate are attached to each other by a second adhesive layer between the second principal surface and the carrier substrate, the second adhesive layer is in contact with the carrier substrate, and the second adhesive layer is in contact with only the second principal surface of the ceramic electronic component;
the ceramic electronic component and the second adhesive layer are identical or substantially identical in shape to each other when viewed from above; and
the ceramic electronic component and the carrier substrate are identical or substantially identical in shape to each other when viewed from above.
2 . The ceramic electronic component according to claim 1 , wherein the first adhesive layer has a larger adhesive force than the second adhesive layer.
3 . The ceramic electronic component according to claim 1 , wherein the carrier substrate is made of resin.
4 . The ceramic electronic component according to claim 1 , wherein
the external electrodes are on at least the first principal surface; and
the first adhesive layer is on the first principal surface at a location at which the external electrodes are not provided.
5 . The ceramic electronic component according to claim 1 , wherein the first adhesive layer is provided on an entirety or substantially an entirety of the first principal surface.
6 . The ceramic electronic component according to claim 1 , wherein the ceramic electronic component is a multilayer ceramic electronic component including a plurality of ceramic layers and a plurality of internal electrodes are laminated.
7 . A mounting structure of a ceramic electronic component, the mounting structure comprising:
a board; and
the ceramic electronic component according to claim 1 ; wherein
the ceramic electronic component is attached to a principal surface of the board by the first adhesive layer.
8 . The mounting structure according to claim 7 , wherein the first adhesive layer has a larger adhesive force than the second adhesive layer.
9 . An electronic component array comprising:
an elongated tape including a plurality of storage portions in one principal surface thereof; and
at least one ceramic electronic component according to claim 1 ; wherein
an adhesion prevention layer is on at least a portion of an inner surface of each of the storage portions to prevent the first adhesive layer from adhering to the portion of the inner surface of each of the storage portions; and
the ceramic electronic component with a carrier substrate is stored in each of the plurality of storage portions.
10 . The electronic component array according to claim 9 , wherein the first adhesive layer has a larger adhesive force than the second adhesive layer.