Dielectric waveguide filter and communication device
A dielectric waveguide filter includes a dielectric body including a first and a second surfaces. The dielectric waveguide filter includes a metal plating covering an outer surface of the dielectric body. The dielectric waveguide filter includes a coupling structure formed a portion of the second surface. The coupling structure includes a coupling groove extending from the second surface into the dielectric body and including a coupling surface parallel to the second surface. The coupling structure includes an inner conductor at an annular center of the coupling groove that surrounds the inner conductor and separates the dielectric body into the inner conductor and an outer conductor. The inner conductor in the coupling groove includes a metal surface on the second surface. A distance between the coupling surface and the second surface is related to a coupling degree of the coupling structure.
1 . A dielectric waveguide filter comprising:
a dielectric body comprising a first side and a second side that is opposite to the first side;
a metal plating covering at least a portion of an outer side of the dielectric body; and
a coupling structure formed at the second side and comprising a coupling groove extending from the second side into the dielectric body and comprising a coupling side parallel to the second side,
wherein the coupling groove has an inner side wall having an inner conductor and an outer side wall having an outer conductor,
wherein the metal plating covers the second side,
wherein at least a portion of the coupling side is not covered with a metal layer, and
wherein a distance between the coupling side and the second side is related to a coupling degree of the coupling structure.
2 . The dielectric waveguide filter of claim 1 ,
wherein the outer side wall is perpendicular to the second side and extends into the dielectric body,
wherein the outer side wall is covered with the metal plating, and the outer conductor comprises the metal plating covering the outer side wall,
wherein the inner side wall is perpendicular to the second side and extends into the dielectric body, and the inner side wall is symmetrically spaced from the outer side wall,
wherein the inner side wall is covered with the metal plating, and the inner conductor comprises the metal plating covering the inner side wall,
wherein the coupling side is connected to top ends of the outer side wall and the inner side wall, and
wherein a diameter size of the outer side wall is larger than a diameter size of the inner side wall.
3 . The dielectric waveguide filter of claim 1 , wherein the coupling groove further comprises a first chamfer connected downwardly between a top end of the outer side wall and an outer edge of the coupling side.
4 . The dielectric waveguide filter of claim 3 , wherein a side of the first chamfer is covered with a metal plating.
5 . The dielectric waveguide filter of claim 3 , wherein a side of the first chamfer is not covered with a metal plating.
6 . The dielectric waveguide filter of claim 1 , wherein the coupling groove further comprises a first chamfer connected downwardly between the second side and an outer edge of the coupling side.
7 . The dielectric waveguide filter of claim 1 , wherein the coupling groove further comprises a second chamfer connected downwardly between a top end of the inner side wall and an inner edge of the coupling side.
8 . The dielectric waveguide filter of claim 7 , wherein a side of the second chamfer is covered with a metal plating.
9 . The dielectric waveguide filter of claim 7 , wherein a side of the second chamfer is not covered with a metal plating.
10 . The dielectric waveguide filter of claim 1 , wherein the coupling groove further comprises a second chamfer connected downwardly between the second side and an inner edge of the coupling side.
11 . The dielectric waveguide filter of claim 1 , wherein the outer side wall is at least one of circular, triangular, or rectangular in cross-sectional shape along a direction parallel to the second side, and
wherein a spacing between the inner side wall and the outer side wall is constant.
12 . The dielectric waveguide filter of claim 1 , wherein the inner conductor further comprises a coupling blind hole that is recessed from the second side into the dielectric body, and
wherein a depth of the coupling blind hole is related to the coupling degree of the coupling structure.
13 . The dielectric waveguide filter of claim 12 , wherein the depth of the coupling blind hole is greater than or equal to the distance between the coupling side and the second side.
14 . The dielectric waveguide filter of claim 13 , further comprising a frequency blind hole that is recessed from the first side into the dielectric body,
wherein the frequency blind hole and the coupling side comprise a first spacing therebetween.
15 . The dielectric waveguide filter of claim 14 , wherein the coupling side is staggered with the frequency blind hole.
16 . The dielectric waveguide filter of claim 1 , wherein the coupling groove is cylindrical in shape.
17 . A communication device comprising:
a dielectric waveguide filter comprising:
a dielectric body comprising a first side and a second side that is opposite to the first side,
a metal plating covering at least a portion of an outer side of the dielectric body, and
a coupling structure formed at the second side; and
a printed circuit board electrically coupled to a portion of the metal plating corresponding to the second side,
wherein the coupling structure comprises a coupling groove extending from the second side into the dielectric body and comprising a coupling side parallel to the second side,
wherein the coupling groove has an inner side wall having an inner conductor and an outer side wall having an outer conductor,
wherein the metal plating covers the second side,
wherein at least a portion of the coupling side is not covered with a metal layer, and
wherein a distance between the coupling side and the second side is related to a coupling degree of the coupling structure.
18 . The communication device of claim 17 ,
wherein the outer side wall is perpendicular to the second side and extends into the dielectric body,
wherein the outer side wall is covered with the metal plating, and the outer conductor comprises the metal plating covering the outer side wall,
wherein the inner side wall is perpendicular to the second and extends into the dielectric body, and the inner side wall is symmetrically spaced from the outer side wall,
wherein the inner side wall is covered with the metal plating, and the inner conductor comprises the metal plating covering the inner side wall,
wherein the coupling side is connected to top ends of the outer side wall and the inner side wall, and
wherein a diameter size of the outer side wall is larger than a diameter size of the inner side wall.
19 . The communication device of claim 17 , wherein the coupling groove further comprises a first chamfer connected downwardly between a top end of the outer side wall and an outer edge of the coupling side, and
wherein the coupling groove further comprises a second chamfer connected downwardly between a top end of the inner side wall and an inner edge of the coupling side.
20 . The communication device of claim 17 , wherein the portion of the metal plating corresponding to the second side is soldered with the printed circuit board.