Connector and electronic device
The present disclosure provides a connector that includes a substrate and M conductive terminals, where the substrate is provided with M through holes, and the M conductive terminals are disposed to penetrate through the M through holes in a one-to-one correspondence. The conductive terminal includes a first conductive part, a second conductive part, and a holding part. The first conductive part is located at one end of the conductive terminal, the second conductive part is located at the other end of the conductive terminal, and the holding part is located between the first conductive part and the second conductive part. The conductive terminal may be fastened to the substrate by using the fastening medium, so that disposing of a stub structure may be avoided, to improve signal transmission performance of the conductive terminal.
1 . A connector, comprising:
a substrate, comprising M through holes; and
M conductive terminals, wherein the M conductive terminals are disposed to penetrate through the M through holes in a one-to-one correspondence, and wherein each conductive terminal in the M conductive terminals comprises:
a first conductive part;
a second conductive part; and
a holding part, wherein
the first conductive part is located at a first end of the conductive terminal;
the second conductive part is located at a second end of the conductive terminal;
the holding part is located between the first conductive part and the second conductive part;
the holding part is fastened in the through hole by using a fastening medium that is a conductive material;
an inner wall of the M through holes comprises a conductive layer;
the substrate comprises a conductive circuit that is electrically connected to the conductive layer of the inner wall of at least one of the M through holes;
M is an integer greater than or equal to 1;
the substrate comprises a plurality of stacked sub-substrates; and
the conductive circuit is located between two adjacent sub-substrates in the plurality of stacked sub-substrates.
2 . The connector according to claim 1 , wherein the first conductive part is of an elastic arm structure or a solder ball structure.
3 . The connector according to claim 1 , wherein the second conductive part is of an elastic arm structure or a solder ball structure.
4 . The connector according to claim 1 , wherein
the conductive terminal comprises a first segment and a second segment that are separated from each other; and
the first conductive part and a part of the holding part are located in the first segment, and the second conductive part and another part of the holding part are located in the second segment.
5 . The connector according to claim 1 , wherein
the connector further comprises a support base; and
the support base is fastened to at least one of the M conductive terminals and abuts against one of plate surfaces of the substrate.
6 . The connector according to claim 5 , wherein the support base comprises a protrusion part that extends in a direction away from the substrate.
7 . The connector according to claim 1 , wherein the conductive circuit is located on a plate surface of the substrate.
8 . An electronic device, comprising:
a first electrical element:
a second electrical element; and
a connector, comprising:
a substrate, comprising M through holes; and
M conductive terminals, wherein the M conductive terminals are disposed to penetrate through the M through holes in a one-to-one correspondence, and wherein each conductive terminal in the M conductive terminal comprises:
a first conductive part;
a second conductive part; and
a holding part, wherein
the first conductive part is located at a first end of the conductive terminal;
the second conductive part is located at a second end of the conductive terminal;
the holding part is located between the first conductive part and the second conductive part;
the holding part is fastened in the through hole by using a fastening medium that is a conductive material;
an inner wall of the M through holes comprises a conductive layer;
the substrate comprises a conductive circuit that is electrically connected to the conductive layer of the inner wall of at least one of the M through holes;
M is an integer greater than or equal to 1;
the substrate comprises a plurality of stacked sub-substrates; and
the conductive circuit is located between two adjacent sub-substrates in the plurality of stacked sub-substrate.
9 . The electronic device according to claim 8 , wherein the first conductive part of the connector is of an elastic arm structure or a solder ball structure.
10 . The electronic device according to claim 8 , wherein the second conductive part of the connector is of an elastic arm structure or a solder ball structure.
11 . The electronic device according to claim 8 , wherein
the conductive terminal of the connector comprises a first segment and a second segment that are separated from each other; and
the first conductive part and a part of the holding part are located in the first segment, and the second conductive part and another part of the holding part are located in the second segment.
12 . The electronic device according to claim 8 , wherein
the connector further comprises a support base; and
the support base is fastened to at least one of the M conductive terminals and abuts against one of plate surfaces of the substrate.
13 . The electronic device according to claim 12 , wherein the support base comprises a protrusion part that extends in a direction away from the substrate.
14 . The electronic device according to claim 8 , wherein the conductive circuit is located on a plate surface of the substrate.