Method of manufacturing electronic component and electronic component
Each terminal includes a tapered portion having a tapered width and an extension portion extending from a narrow-side distal end of the tapered portion. A method includes, after positioning the extension portion in one of grooves formed in one surface of each sliding die, sliding the sliding dies relative to the extension portion to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension portion lying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity, thus forming a connection portion protruding from the housing with the part of the tapered portion and the extension portion.
1 . A method of manufacturing an electronic component having a housing with terminals insert-molded thereon, in which
each of the terminals includes a tapered portion having a tapered width and an extension portion extending from a narrow-side distal end of the tapered portion, and
a mold defining a cavity for molding the housing includes a first die and second dies, the method comprising:
after positioning the extension portion in one of grooves formed in one surface of each of the second dies, sliding the second dies relative to the extension portion to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces that form tapering of the tapered portion; and
performing molding while keeping the first die in close contact with the one surface and keeping part of the tapered portion having the tapered width and the extension portion lying in the groove held between a bottom surface of the groove and the first die, with a remaining portion of the tapered portion having the tapered width lying in the cavity, thus forming a connection portion protruding from the housing with the part of the tapered portion having the tapered width and the extension portion and embedding, by the insert-molding, both side surfaces of the remaining portion in the housing, such that the both side surfaces of the remaining portion are in direct contact with the housing.
2 . The method of manufacturing an electronic component according to claim 1 , wherein the connection portion is a point of soldering to a land on a substrate or a point of contact with a terminal of a mating electronic component.
3 . An electronic component having a housing with terminals insert-molded thereon, wherein
each of the terminals includes a tapered portion having a tapered width and an extension portion extending from a narrow-side distal end of the tapered portion,
part of the tapered portion having the tapered width and the extension portion protrude from the housing to form a connection portion, and
a remaining portion of the tapered portion having the tapered width is embedded, by the insert-molding, in the housing with both side surfaces in direct contact with the housing.
4 . The electronic component according to claim 3 , wherein the connection portion is a point of soldering to a land on a substrate or a point of contact with a terminal of a mating electronic component.