IP Library Granted Patent US 12665372
Granted Patent B2
US 12665372 · App. 17/702,931 · Granted Jun 23, 2026

Laser processing apparatus

Inventor: Kazuhiro Nakashima (Nagoya, JP)
Assignee: Brother Kogyo Kabushiki Kaisha
H01S3/0404B23K26/703
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Quick Facts
Patent No.
US 12665372
App. No.
17/702,931
Granted
Jun 23, 2026
Kind
B2
Abstract

A laser processing apparatus includes: a laser emission unit configured to emit laser beam; a control member configured to control the laser emission unit; a casing in which the laser emission unit and the control member are accommodated; and a pipe through which compressed gas supplied from outside of the casing flows in a branched manner, the pipe being provided in the casing. The pipe includes a first branch pipe arranged with a leading end for jetting the compressed gas facing the laser emission unit, and a second branch pipe arranged with a leading end for jetting the compressed gas facing the control member.

Claims (27)

1 . A laser processing apparatus comprising:

a laser emission unit configured to emit laser beam;

a control member configured to control the laser emission unit;

a casing in which the laser emission unit and the control member are accommodated; and

a pipe through which compressed gas supplied from outside of the casing flows in a branched manner, the pipe being provided in the casing,

wherein the pipe includes a first branch pipe arranged with a nozzle facing the laser emission unit for jetting the compressed gas facing the laser emission unit, and a second branch pipe arranged with a leading end for jetting the compressed gas facing the control member.

2 . The laser processing apparatus according to claim 1 , further comprising a wall provided between the laser emission unit and the control member.

3 . The laser processing apparatus according to claim 2 , further comprising:

a first space which is a space formed by partitioning inside the casing by the wall and in which the laser emission unit is arranged; and

a second space which is a space formed by partitioning inside the casing by the wall, in which the control member is arranged, and which is in communication with the first space at least on one side in a partitioning direction along which the wall extends,

wherein the nozzle of the first branch pipe is arranged on the other side in the partitioning direction with respect to the laser emission unit in the first space, and

a vent for discharging the compressed gas inside the casing to the outside of the casing is provided in a lateral surface, which is included in a plurality of lateral surfaces constructing the casing and which is positioned on the other side in the partitioning direction.

4 . The laser processing apparatus according to claim 3 , wherein in the second space, the leading end of the second branch pipe is directed to the other side in the partitioning direction.

5 . The laser processing apparatus according to claim 1 , further comprising a third branch pipe arranged with a leading end for jetting the compressed gas facing the laser emission unit,

wherein the laser emission unit comprises a plurality of heat sinks provided respectively on at least two lateral surfaces, which are included in a plurality of lateral surfaces constructing the laser emission unit,

the nozzle of the first branch pipe is directed to one heat sink among the plurality of heat sinks, and

the leading end of the third branch pipe is directed to another heat sink among the plurality of heat sinks.

6 . The laser processing apparatus according to claim 1 ,

wherein the control member comprises:

a control substrate;

a metallic fixing member which is fixed on the casing in a state that the control substrate is attached to the metallic fixing member; and

a thermal conducting member which is interposed between the control substrate and the metallic fixing member, and

the leading end of the second branch pipe is directed to the thermal conducting member from a side of the metallic fixing member.

7 . The laser processing apparatus according to claim 5 , wherein the third branch pipe branches from the second branch pipe.

8 . The laser processing apparatus according to claim 7 , wherein the third branch pipe has an internal diameter larger than an internal diameter of a part, of the second branch pipe, which is defined from the leading end of the second branch pipe to a branching position of the third branch pipe.

9 . The laser processing apparatus according to claim 7 , wherein the first branch pipe has an internal diameter larger than an internal diameter of a part, of the second branch pipe, which is defined from the leading end of the second branch pipe to a branching position of the third branch pipe.

10 . The laser processing apparatus according to claim 1 , wherein a part of the second branch pipe including the leading end of the second branch pipe has an internal diameter smaller than an internal diameter of the first branch pipe.