Heat-sink-coupled conductor structures with integrated current sensors and eddy current mitigation
Systems, circuits, and methods provide heat-sink-coupled conductive structures having eddy current mitigation structures, formed as S-notches, and integrated current sensors. An example conductive structure includes a high-current conductor structure having a main current path including an S-notch portion configured to mitigate eddy currents. The structure includes a low-current conductor structure connected to a first heat sink and having a main current path configured to conduct a second current. A differential current sensor is connected to the low-current conductor structure and configured to detect current flowing in the high-current conductor structure. A power module includes the conductive structure and a power converter that is configured to convert power between the first current in the high-current conductor structure and the second current in the low-current conductor structure. The conductive structures and power modules can be used for EV applications.
1 . A power module with integrated current sensor, the power module comprising:
a higher-current conductor structure having a main current path configured to conduct a first current, wherein the main current path includes an S-notch portion configured to mitigate eddy currents;
a lower-current conductor structure connected to a first heat sink and having a main current path configured to conduct a second current, wherein the higher-current conductor structure is configured to conduct a higher current level than the lower-current conductor structure;
a power converter connected to the higher-current conductor structure and the lower-current conductor structure, wherein the power converter is configured to convert power between the first current in the higher-current conductor structure and the second current in the lower-current conductor structure; and
a differential current sensor connected to the lower-current conductor structure, wherein the differential current sensor is configured to detect current flowing in the higher-current conductor structure,
wherein the higher-current conductor structure comprises first and second planar conductive layers and an insulator layer disposed between the first and second planar conductive layers, wherein the first planar conductive layer includes the main current path.
2 . The power module of claim 1 , wherein the S-notch portion comprises a first current-redirection portion including a current path substantially transverse to a first input current path and a second current-redirection portion connected to the first current-redirection portion and including a current path substantially transverse to a second input current path.
3 . The power module of claim 1 , wherein the differential current sensor has a longitudinal axis and first and second magnetic field sensing elements aligned on the longitudinal axis.
4 . The power module of claim 3 , wherein the longitudinal axis of the differential current sensor is aligned with a longitudinal axis of the main current path of the higher-current conductor structure.
5 . The power module of claim 3 , wherein the longitudinal axis of the differential current sensor is aligned with the longitudinal axis of the higher-current conductor structure, within a rotation angle ranging from about 1 degree to about 15 degrees about an axis normal to the longitudinal axis of the higher-current conductor structure.
6 . The power module of claim 5 , wherein the rotation angle is between about 8 degrees and about 10 degrees.
7 . The power module claim 1 , wherein the higher-current conductor structure comprises a direct bonded copper substrate.
8 . A power module with integrated current sensor, the power module comprising:
a higher-current conductor structure having a main current path configured to conduct a first current, wherein the main current path includes an S-notch portion configured to mitigate eddy currents;
a lower-current conductor structure connected to a first heat sink and having a main current path configured to conduct a second current, wherein the higher-current conductor structure is configured to conduct a higher current level than the lower-current conductor structure;
a power converter connected to the higher-current conductor structure and the lower-current conductor structure, wherein the power converter is configured to convert power between the first current in the higher-current conductor structure and the second current in the lower-current conductor structure; and
a differential current sensor connected to the lower-current conductor structure, wherein the differential current sensor is configured to detect current flowing in the higher-current conductor structure, wherein the lower-current conductor structure comprises first and second planar conductive layers and an insulator layer disposed between the first and second planar conductive layers.
9 . The power module claim 8 , wherein the lower-current conductor structure comprises a direct bonded copper substrate.
10 . A power module with integrated current sensor, the power module comprising:
a higher-current conductor structure having a main current path configured to conduct a first current, wherein the main current path includes an S-notch portion configured to mitigate eddy currents;
a lower-current conductor structure connected to a first heat sink and having a main current path configured to conduct a second current, wherein the higher-current conductor structure is configured to conduct a higher current level than the lower-current conductor structure;
a power converter connected to the higher-current conductor structure and the lower-current conductor structure, wherein the power converter is configured to convert power between the first current in the higher-current conductor structure and the second current in the lower-current conductor structure; a differential current sensor connected to the lower-current conductor structure,
wherein the differential current sensor is configured to detect current flowing in the higher-current conductor structure; and
one or more eddy current blockers disposed within the second planar conductive layer of the higher-current conductor structure.
11 . The power module of claim 10 , wherein the one or more eddy current blockers each comprises an array of spaced-apart conductive structures.
12 . The power module of claim 10 , wherein the S-notch portion is disposed in the first planar conductive layer of the higher-current conductor structure and the one or more eddy current blockers comprise a first eddy current blocker disposed in the second planar conductive layer of the higher-current conductor structure.
13 . The power module of claim 1 , further comprising one or more eddy current blockers disposed within the lower-current conductor structure.
14 . The power module of claim 13 , wherein the one or more eddy current blockers each comprises an array of spaced-apart conductive structures.
15 . The power module of claim 13 , wherein the one or more eddy current blockers is disposed in the first planar conductive layer and/or the second planar conductive layer of the lower-current conductor structure.
16 . The power module of claim 1 , wherein the power converter comprises one or more transistors configured to convert power between AC power and DC power.
17 . The power module of claim 16 , wherein the one or more transistors comprises a plurality of transistors configured as a bridge or half-bridge.
18 . The power module of claim 17 , wherein the plurality of transistors is configured as an inverter.
19 . The power module of claim 1 , wherein the power converter comprises one or more diodes configured to convert power between AC power and DC power.
20 . The power module of claim 19 , wherein the one or more diodes comprises a plurality of diodes configured as a rectifier.
21 . The power module of claim 1 , further comprising one or more busbars connected to the higher-current conductor structure and configured to provide input current.
22 . The power module of claim 1 , further comprising one or more busbars connected to the higher-current conductor structure and configured to provide output current.
23 . The power module of claim 1 , wherein the differential current sensor comprises a plurality of Hall effect elements.
24 . The power module of claim 1 , wherein the differential current sensor comprises a plurality of magnetoresistance (xMR) elements.
25 . The power module of claim 24 , wherein the plurality of xMR elements comprise tunneling magnetoresistance (TMR) elements.
26 . The power module of claim 24 , wherein the plurality of xMR elements comprise giant magnetoresistance (GMR) elements.
27 . The power module of claim 24 , wherein the plurality of xMR elements comprise anisotropic magnetoresistance (AMR) elements.
28 . The power module of claim 1 , wherein the higher-current conductor structure is connected to a second heat sink.
29 . The power module of claim 1 , wherein the first current is greater in magnitude than the second current.
30 . The power module of claim 1 , wherein the first current comprises an AC current.
31 . The power module of claim 1 , wherein the first current comprises a DC current.
32 . The power module of claim 1 , wherein the second current comprises a DC current.