IP Library Granted Patent US 12665554
Granted Patent B2
US 12665554 · App. 18/305,282 · Granted Jun 23, 2026

Radio frequency power amplifier module

Inventors: Son Jong Wang (Daejeon, KR); Hyun Ho Wi (Daejeon, KR)
Assignee: Korea Institute of Fusion Energy
H03F3/245H03F3/602H03F2200/114H03F2200/451
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Quick Facts
Patent No.
US 12665554
App. No.
18/305,282
Granted
Jun 23, 2026
Kind
B2
Abstract

Disclosed is a radio frequency power amplifier module. The radio frequency power amplifier module according to an embodiment of the disclosed technology includes a module main body one or more amplifier semiconductors installed inside the module main body, and a coupler electrically connected to the amplifier semiconductor and protruding and extending to the outside of the module main body to transmit electromagnetic waves.

Claims (25)

1 . A radio frequency (RF) power amplifier module comprising:

a module main body;

one or more amplifier semiconductors installed inside the module main body; and

a coupler electrically connected to at least one of the one or more amplifier semiconductors, and protrude and extend outside of the module main body to transmit electromagnetic waves at a radio frequency,

wherein the coupler is arranged to have a partial loop configuration and comprises:

a first end and a second end both extending towards the module main body,

the first end terminating outside the main body and serving as an antenna to transmit the electromagnetic waves, and

the second end extending farther towards the module main body than the first end to terminate inside the main body and connected to an outer terminal of the one or more amplifier semiconductors for receiving amplified signal therefrom, and

wherein the module main body has provided on a front side thereof an assembly slot such that the coupler extends from an inside to an outside of the module main body, and a flange that protrudes and extends in an outward direction from the module main body.

2 . The module of claim 1 , wherein the module main body further comprises:

an installation box disposed inside the RF power amplifier module; and

a cover plate configured to cover one surface of the installation box and to provide the assembly slot to form the flange.

3 . The module of claim 2 , wherein the cover plate further comprises:

an extension plate that is wider than one surface of the installation box and extends outside of the installation box; and

a front plate coupled to the extension plate and having a reduced size while having generally a same shape as the extension plate,

wherein the front plate is configured to protrude thereby forming a step on the extension plate.

4 . The module of claim 2 , wherein the coupler further comprises:

an outer coupler portion exposed to a front part of the cover plate in the assembly slot; and

an inner coupler portion, having the second end, connected to the amplifier semiconductor.

5 . The module of claim 4 , wherein the outer coupler portion is continuous with the inner coupler, and wherein the outer coupler portion has the first end coupled to the cover plate.

6 . The module of claim 5 , wherein the outer coupler has a “U” or “⊏” shape.

7 . The module of claim 4 , wherein the module comprises a plurality of couplers disposed at upper and lower parts of the cover plate.

8 . The module of claim 7 , wherein the module comprises a plurality of amplifier semiconductors each corresponding to one of the couplers.

9 . The module of claim 1 , wherein each amplifier semiconductor is provided as a semiconductor package for outputting electromagnetic waves.

10 . The module of claim 9 , wherein the module main body is shielded to protect the amplifier semiconductor from external electromagnetic waves.