Substrate structure and terminal device

1 . A substrate structure, comprising:

a frame body comprising:

a first wall plate comprising a first wall plate surface;

a second wall plate that is spaced apart from the first wall plate, wherein the second wall plate is away from the first wall plate surface; and

an accommodation cavity between the first wall plate and the second wall plate;

a plastic package, wherein the plastic package covers the first wall plate surface;

a cooling housing at least partially disposed in the accommodation cavity and fastened to the frame body;

a cooling cavity between the cooling housing and the second wall plate; and

a first chip disposed in the cooling cavity, located in the accommodation cavity, and connected to the second wall plate, wherein the cooling cavity is configured to be filled by cooling fluid that immerses the first chip.

2 . The substrate structure of claim 1 , wherein the first wall plate further comprises a first wall plate end face, wherein the substrate structure further comprises a first insulation part, and wherein the first insulation part is disposed on the first wall plate end face and away from the second wall plate to form a first electrical connection region on the first wall plate surface.

3 . The substrate structure of claim 1 , wherein the second wall plate comprises a second wall plate surface and a second wall plate end face, wherein the substrate structure further comprises a second insulation part, wherein the second insulation part is disposed on the second wall plate end face and away from the first wall plate to form a second electrical connection region on the second wall plate surface.

4 . The substrate structure of claim 1 , further comprising a buffer between the first wall plate and the cooling housing in the accommodation cavity, wherein the buffer is configured to buffer an impact force between the first wall plate and the second wall plate.

5 . The substrate structure of claim 1 , further comprising a copper clad laminate comprising a first copper clad laminate surface and a second copper clad laminate surface, wherein the copper clad laminate is fastened to the frame body, wherein the copper clad laminate is disposed between the second wall plate and the first chip, wherein the first copper clad laminate surface is away from the second wall plate and forms a first wiring surface, and wherein the second copper clad laminate surface is close to the second wall plate and forms a second wiring surface.

6 . The substrate structure of claim 1 , further comprising two cooling pipes, wherein each of the two cooling pipes comprise a first connection end and a second connection end that are connected, wherein the first connection end of each of the two cooling pipes is connected to the cooling cavity, and wherein the second connection end of each of the two cooling pipes is configured to connect a circulation apparatus that supplies the cooling fluid.

7 . The substrate structure of claim 1 , further comprising a first resistor-capacitor-inductor element, wherein the first resistor-capacitor-inductor element is disposed in the cooling cavity and is connected to the second wall plate.

8 . The substrate structure of claim 7 , further comprising:

a first insulation film that covers a first chip surface of the first chip; and

a second insulation film that covers a first resistor-capacitor-inductor element surface of the first resistor-capacitor-inductor element.

9 . The substrate structure of claim 1 , further comprising a second chip, wherein the cooling housing comprises an outer housing component and middleware, wherein the cooling cavity is formed between the outer housing component and the second wall plate, wherein the middleware is disposed in the cooling cavity, wherein the middleware is fastened to the outer housing component, and wherein the second chip is connected to the middleware.

10 . The substrate structure of claim 9 , further comprising a second resistor-capacitor-inductor element, wherein the second resistor-capacitor-inductor element is disposed in the cooling cavity and is connected to the middleware.

11 . The substrate structure of claim 1 , wherein the first wall plate comprises a mounting opening, wherein the cooling housing extends out of the accommodation cavity from the mounting opening, wherein the cooling housing comprises a cooling housing surface that is away from the second wall plate, and wherein the plastic package covers the first wall plate and the cooling housing surface.

12 . The substrate structure of claim 1 , wherein the substrate structure further comprises a heat dissipation member, and wherein the heat dissipation member is disposed on the first wall plate surface.

13 . The substrate structure of claim 1 , wherein the first chip is connected to the second wall plate using a plurality of first connectors, wherein the first connectors form a first slot between the first connectors, and wherein the first slot is configured to circulate the cooling fluid.

14 . A terminal device, comprising:

a device body; and

a substrate structure disposed in the device body, wherein the substrate structure comprises:

a frame body comprising:

a first wall plate comprising a first wall plate surface and a first wall plate end face;

a second wall plate that is spaced apart from the first wall plate; and

an accommodation cavity between the first wall plate and the second wall plate;

a first insulation part, wherein the first insulation part is disposed on the first wall plate end face and away from the second wall plate to form a first electrical connection region on the first wall plate surface;

a cooling housing at least partially disposed in the accommodation cavity and fastened to the frame body;

a cooling cavity between the cooling housing and the second wall plate; and

a first chip disposed in the cooling cavity, located in the accommodation cavity, and connected to the second wall plate, wherein the cooling cavity is configured to be filled by cooling fluid that immerses the first chip.

15 . The terminal device of claim 14 , wherein the second wall plate comprises a second wall plate surface and a second wall plate end face, wherein the substrate structure further comprises a second insulation part, wherein the second insulation part is disposed on the second wall plate end face and away from the first wall plate to form a second electrical connection region on the second wall plate surface.

16 . The terminal device of claim 14 , further comprising a buffer between the first wall plate and the cooling housing in the accommodation cavity, wherein the buffer is configured to buffer an impact force between the first wall plate and the second wall plate.

17 . The terminal device of claim 14 , wherein the substrate structure further comprises a copper clad laminate comprising a first copper clad laminate surface and a second copper clad laminate surface, wherein the copper clad laminate is fastened to the frame body, wherein the copper clad laminate is disposed between the second wall plate and the first chip, wherein the first copper clad laminate surface is away from the second wall plate and forms a first wiring surface, and wherein the second copper clad laminate surface is close to the second wall plate and forms a second wiring surface.

18 . The terminal device of claim 14 , wherein the substrate structure further comprises a first resistor-capacitor-inductor element, wherein the first resistor-capacitor-inductor element is disposed in the cooling cavity and is connected to the second wall plate.

19 . A substrate structure, comprising:

a frame body comprising:

a first wall plate comprising a first wall plate surface;

a second wall plate that is spaced apart from the first wall plate surface; and

an accommodation cavity between the first wall plate and the second wall plate;

a cooling housing at least partially disposed in the accommodation cavity and fastened to the frame body;

a heat dissipation member disposed on the first wall plate surface;

a cooling cavity between the cooling housing and the second wall plate; and

a first chip disposed in the cooling cavity, located in the accommodation cavity, and connected to the second wall plate, wherein the cooling cavity is configured to be filled by cooling fluid that immerses the first chip.

20 . The substrate structure of claim 19 , wherein the first wall plate further comprises a first wall plate end face, wherein the substrate structure further comprises a first insulation part, and wherein the first insulation part is disposed on the first wall plate end face and away from the second wall plate to form a first electrical connection region on the first wall plate surface.