Component carrier with flexible portions and manufacturing method

1 . A component carrier having a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, the stack comprising:

a central rigid portion;

a first flexible portion, extending from a first side of the central rigid portion; and

a second flexible portion, extending from a second side of the central rigid portion;

wherein the first flexible portion extends from a first vertical level from the central rigid portion that is different from a second vertical level from which the second flexible portion extends from the central rigid portion;

wherein the first flexible portion and/or the second flexible portion comprises at least one flexible layer structure, and

wherein the flexible layer structure comprises a flexible solder resist layer structure.

2 . The component carrier according to claim 1 ,

wherein the central rigid portion comprises at least two opposed main surfaces,

wherein the first flexible portion extends to a first of the main surfaces, and

wherein the second flexible portion extends to a second of the main surfaces or wherein the second flexible portion extends to the first of the main surfaces.

3 . The component carrier according to claim 1 ,

wherein the first flexible portion and the second flexible portion are opposed to each other with respect to the central rigid portion in a direction perpendicular to the stacking direction.

4 . The component carrier according to claim 1 ,

wherein the first flexible portion and the second flexible portion are bendable in different directions.

5 . The component carrier according to claim 1 ,

wherein the first flexible portion is arranged at a bottom or top part of the stack; and/or

wherein the second flexible portion is arranged at a top or bottom part of the stack.

6 . The component carrier according to claim 1 ,

wherein a first opening opens to the top or bottom of the stack at least partially delimiting the first flexible portion; and/or

wherein a second opening opens to the bottom or top of the stack at least partially delimiting the second flexible portion.

7 . The component carrier according to claim 1 , further comprising:

a first rigid portion extending from the first flexible portion; and/or

a second rigid portion extending from the second flexible portion.

8 . The component carrier according to claim 7 , configured such that the first rigid portion is bendable, by the first flexible portion, with respect to the first main surface of the central rigid portion; and/or the second rigid portion is bendable, by the second flexible portion, with respect to the second main surface of the central rigid portion.

9 . The component carrier according to claim 1 ,

wherein at least one of the central rigid portion, the first rigid portion, the second rigid portion, the first flexible portion, the second flexible portion, is configured to reach a bending angle of the first flexible portion and/or the second flexible portion with respect to the respective central rigid portion and/or the first rigid portion and/or the second rigid portion of at least 450.

10 . The component carrier according to claim 1 ,

wherein at least one of the central rigid portion, the first rigid portion, the second rigid portion, the first flexible portion, the second flexible portion, is configured to bend the first flexible portion and the second flexible portion toward opposed directions.

11 . The component carrier according to claim 1 ,

wherein the stack comprises a first layer structure that extends from the central rigid portion to the first flexible portion; and/or

wherein the stack comprises a second layer structure that extends from the central rigid portion to the second flexible portion.

12 . The component carrier according to claim 1 ,

wherein the central rigid portion comprises at least one of a component embedded in a cavity, an embedded component, a surface-mounted component.

13 . The component carrier according to claim 1 ,

wherein the first rigid portion and/or the second rigid portion comprises at least one of a component embedded in a cavity, an embedded component, a surface-mounted component.

14 . The component carrier according to claim 1 ,

wherein the central rigid portion and the first flexible portion are embedded in a common encapsulant; or

wherein the central rigid portion and the second flexible portion are embedded in a further common encapsulant.

15 . The component carrier according to claim 1 ,

wherein the first opening and/or the second opening comprises a metal residue at the bottom part, the metal residue being part of a metal layer structure of the stack.

16 . The component carrier according to claim 1 ,

wherein the component carrier is semi-flexible; and/or

wherein the component carrier is bendable to an S-shape.

17 . A method of manufacturing a component carrier, the method comprising:

providing a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a central rigid portion;

forming a first flexible portion, extending from a first side of the central rigid portion; and

forming a second flexible portion, extending from a second side of the central rigid portion;

wherein the first flexible portion extends from a first vertical level from the central rigid portion that is different from a second vertical level from which the second flexible portion extends from the central rigid portion;

wherein the first flexible portion and/or the second flexible portion comprises at least one flexible layer structure, and

wherein the flexible layer structure comprises a flexible solder resist layer structure.

18 . The method according to claim 17 , further comprising:

forming a first opening in the stack to provide the first flexible portion; and

forming a second opening in the stack to provide the second flexible portion;

wherein the first opening and the second opening open into different directions.