IP Library › Granted Patent US 12666532
Granted Patent B2
US 12666532 · App. 18/026,794 · Granted Jun 23, 2026

High speed camera interface PCB floor plan for autonomous vehicles

Inventors: Yun Ji (Sunnyvale, CA); Zhenwei Yu (Sunnyvale, CA); Yuming Wang (Beijing, CN); Weibo Dong (Beijing, CN)
Assignees: APOLLO AUTONOMOUS DRIVING USA LLC; BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
H05K1/0298H04N7/181H04N23/54H05K1/115H05K3/4038H05K2201/10151
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Quick Facts
Patent No.
US 12666532
App. No.
18/026,794
Granted
Jun 23, 2026
Kind
B2
Abstract

A printed circuit board (PCB) includes one or more signal layers in between a first surface and a second surface, the one or more signal layers including a first signal layer. The PCB includes a connector interface disposed on the first surface and a first signal via electrically coupled to the connector interface. The PCB includes first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer and a second signal via disposed at the second location. The PCB includes a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via and a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit. The PCB includes a second transmission line disposed on the first surface layer electrically coupling the power-over-cable circuit to the receiver circuit.

Claims (46)

1 . A printed circuit board (PCB), comprising:

one or more signal layers in between a first surface and a second surface of the PCB, the one or more signal layers including a first signal layer;

a connector interface disposed on the first surface;

a first signal via electrically coupled to the connector interface extending from the first surface to the first signal layer;

a first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer;

a second signal via disposed at the second location extending from the first signal layer to the first surface;

a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via;

a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit; and

a second transmission line disposed on the first signal layer electrically coupling the power-over-cable circuit to the receiver circuit

wherein the first and second transmission lines carry a signal of an image sensor from the connector interface to the receiver circuit and the first transmission line carries power from the power-over-cable circuit to the image sensor, wherein the image sensor is used to perceive an environment of an autonomous driving vehicle (ADV), wherein the image sensor comprises one or more image sensors and the connector interface interfaces with a connector that is coupled to one or more transmission cables to receive one or more signals from the one or more image sensors, wherein each of one or more of the transmission cables is a single wire carrying a serialized signal of the image sensor and carrying power from the power-over-cable circuit of the PCB to the image sensor.

2 . The PCB of claim 1 , further comprising a power integrated circuit (IC) disposed on the first surface, and the power-over-cable circuit is electrically coupled to a power IC to receive a power signal from the power IC.

3 . The PCB of claim 1 , further comprising one or more sets of: the connector interface, power-over-cable circuit, receiver chipset, and a power integrated circuit (IC).

4 . The PCB of claim 1 , wherein the first transmission line is a stripline and the second transmission line is a microstrip.

5 . The PCB of claim 1 , wherein the power transmitted from the power-over-cable circuit to the image sensor is direct current (DC) and the signal that is transmitted from the image sensor to a receiver chipset is a signal with a frequency greater than a gigabits per second.

6 . A sensor system of an autonomous driving vehicle, comprising:

an image sensor;

a printed circuit board (PCB); and

a transmission cable electrically coupling the image sensor to the PCB, wherein the PCB comprises:

one or more signal layers in between a first surface and a second surface of the PCB, the one or more signal layers including a first signal layer;

a connector interface disposed on the first surface;

a first signal via electrically coupled to the connector interface extending from the first surface to the first signal layer;

a first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer;

a second signal via disposed at the second location extending from the first signal layer to the first surface;

a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via;

a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit; and

a second transmission line disposed on the first signal layer electrically coupling the power-over-cable circuit to the receiver circuit, wherein the first and second transmission lines carry a signal of an image sensor from the connector interface to the receiver circuit and the first transmission line carries power from the power-over-cable circuit to the image sensor, wherein the image sensor is used to perceive an environment of an autonomous driving vehicle (ADV), wherein the image sensor comprises one or more image sensors and the connector interface interfaces with a connector that is coupled to one or more transmission cables to receive one or more signals from the one or more image sensors, wherein each of one or more the transmission cables is a single wire carrying a serialized signal of the image sensor and carrying power from the power-over-cable circuit of the PCB to the image sensor.

7 . The sensor system of claim 6 , further comprising a power integrated circuit (IC) disposed on the first surface, and the power-over-cable circuit is electrically coupled to a power IC to receive a power signal from the power IC.

8 . The sensor system of claim 6 , further comprising one or more sets of: the connector interface, power-over-cable circuit, receiver chipset, and a power integrated circuit (IC).

9 . The sensor system of claim 6 , wherein the first transmission line is a stripline and the second transmission line is a microstrip.

10 . The sensor system of claim 6 , wherein the power transmitted from the power-over-cable circuit to the image sensor is direct current (DC) and the signal that is transmitted from the image sensor to a receiver chipset is a signal with a frequency greater than a gigabits per second.

11 . An autonomous driving vehicle comprising a sensor system, the sensor system comprises:

an image sensor;

a printed circuit board (PCB); and

a transmission cable electrically coupling the image sensor to the PCB, wherein the PCB comprises:

one or more signal layers in between a first surface and a second surface of the PCB, the one or more signal layers including a first signal layer;

a connector interface disposed on the first surface;

a first signal via electrically coupled to the connector interface extending from the first surface to the first signal layer;

a first transmission line disposed at the first signal layer electrically coupling a first location to a second location of the first signal layer;

a second signal via disposed at the second location extending from the first signal layer to the first surface;

a power-over-cable circuit disposed on the first surface and electrically coupled to the second signal via;

a receiver circuit disposed on the first surface adjacent to the power-over-cable circuit; and

a second transmission line disposed on the first signal layer electrically coupling the power-over-cable circuit to the receiver circuit, wherein the first and second transmission lines carry a signal of an image sensor from the connector interface to the receiver circuit and the first transmission line carries power from the power-over-cable circuit to the image sensor, wherein the image sensor is used to perceive an environment of an autonomous driving vehicle (ADV), wherein the image sensor comprises one or more image sensors and the connector interface interfaces with a connector that is coupled to one or more transmission cables to receive one or more signals from the one or more image sensors, wherein each of one or more the transmission cables is a single wire carrying a serialized signal of the image sensor and carrying power from the power-over-cable circuit of the PCB to the image sensor.

12 . The autonomous driving vehicle of claim 11 , further comprising a power integrated circuit (IC) disposed on the first surface, and the power-over-cable circuit is electrically coupled to a power IC to receive a power signal from the power IC.

13 . The autonomous driving vehicle of claim 11 , further comprising one or more sets of: the connector interface, power-over-cable circuit, receiver chipset, and a power integrated circuit (IC).

14 . The autonomous driving vehicle of claim 11 , wherein the first transmission line is a stripline and the second transmission line is a microstrip.

15 . The autonomous driving vehicle of claim 11 , wherein the power transmitted from the power-over-cable circuit to the image sensor is direct current (DC) and the signal that is transmitted from the image sensor to a receiver chipset is a signal with a frequency greater than a gigabits per second.