Systems and methods for automated degassing during the manufacturing of a high speed design

1 . A method comprising:

analyzing, by a processor, information related to a material comprising a set of layers and a plurality of voids;

identifying, by the processor, a void from the plurality of voids, the void having a position among the set of layers on the material;

determining, by the processor, an area associated with the void, the area based on a center of the void;

performing, by the processor, a trace selection based on the area and the position of the void;

executing, by the processor, a modification of the information related to the void based on the trace selection; and

generating, by the processor, a grid for degassing based on the modification.

2 . The method of claim 1 , wherein the modification of the information related to the void comprises:

determining an overlap of the trace selection with the area of the void; and

determining, based on the overlap, a positional value to shift the void.

3 . The method of claim 2 , further comprising:

moving the void to the positional value.

4 . The method of claim 2 , further comprising:

deleting the void; and

adding a new void based on the positional value.

5 . The method of claim 2 , wherein the positional value comprises at least one of an x direction and a y direction.

6 . The method of claim 1 , wherein the modification of the information related to the void comprises:

detecting a set of traces overlapping the area of the void; and

analyzing the information related to the material, and determining, based on the analysis, an empty space at least having an area of the area.

7 . The method of claim 6 , further comprising:

moving the void within the empty space.

8 . The method of claim 6 , further comprising:

deleting the void; and

adding a new void within the empty space.

9 . The method of claim 6 , wherein the empty space comprises a rectangular shape.

10 . The method of claim 6 , wherein the set of traces comprises more than two traces, wherein a width of at least a portion of the set of traces are reduced at least a threshold value.

11 . The method of claim 1 , further comprising:

identifying a set of voids from the plurality of voids, wherein the grid is an updated grid generated based on a grid having a plurality of voids on a printed circuit board.

12 . The method of claim 1 , further comprising:

identifying, by the processor, a computer-aided design (CAD) file, the CAD file comprising the information related to the material.

13 . The method of claim 1 , wherein the area associated with the void is based on a radius respective to the center of the void.

14 . The method of claim 1 , wherein the material is at least one of a printed circuit board (PCB), substrate and silicon.

15 . A system comprising:

at least one physical processor; and

physical memory comprising computer-executable instructions that, when executed by the physical processor, cause the physical processor to:

analyze information related to a material comprising a set of layers and a plurality of voids;

identify a void from the plurality of voids, the void having a position among the set of layers on the material;

determine an area associated with the void, the area based on a center of the void;

perform a trace selection based on the area and the position of the void;

execute a modification of the information related to the void based on the trace selection; and

generate a grid for degassing based on the modification.

16 . The system of claim 15 , wherein the instructions further cause the physical processor to:

determine an overlap of the trace selection with the area of the void; and

determine, based on the overlap, a positional value to shift the void, wherein the modification of the information related to the void comprises causing the physical processor to:

move the void the positional value, and

delete the void and add a new void based on the positional value.

17 . The system of claim 15 , wherein the instructions further cause the physical processor to:

detect a set of traces overlapping the area of the void; and

analyze the information related to the material, and determining, based on the analysis, an empty space at least having an area of the area, wherein the modification of the information related to the void comprises causing the physical processor to:

move the void within the empty space, and

delete the void and add a new void within the empty space.

18 . The system of claim 15 , wherein the area associated with the void is based on a radius respective to the center of the void.