IP Library Granted Patent US 12666543
Granted Patent B2
US 12666543 · App. 18/205,365 · Granted Jun 23, 2026

Pre-connected analyte sensors

Inventors: Jason Halac (San Diego, CA); John Charles Barry (San Diego, CA); Becky L. Clark (San Diego, CA); Chris W. Dring (Fremont, CA); John Michael Gray (San Diego, CA); Kris Elliot Higley (Ramona, CA); Jeff Jackson (Poway, CA); David A. Keller (Encinitas, CA); Ted Tang Lee (San Diego, CA); Jason Mitchell (San Diego, CA); Kenneth Pirondini (San Diego, CA); David Rego (San Diego, CA); Ryan Everett Schoonmaker (Oceanside, CA); Peter C. Simpson (Cardiff, CA); Craig Thomas Gadd (Lemon Grove, CA); Kyle Thomas Stewart (San Diego, CA); John Stanley Hayes (San Diego, CA)
Assignee: Dexcom, Inc.
H05K3/321A61B5/14532A61B5/14546A61B5/1459A61B5/1473A61B5/14865A61B5/1495A61B5/6801A61B5/6849A61M5/14244A61M5/14276A61M5/1723A61M5/20A61M11/00A61M15/0065A61M15/0068A61M15/008A61M15/0083A61M35/00G01N27/3273G01N27/3274G01N33/66G16H20/17G16H40/63A61B5/0031A61B2560/0468A61B2562/043A61B2562/08A61B2562/085A61B2562/12A61B2562/125A61B2562/16A61M5/003A61M2005/14296A61M5/178A61M5/30A61M15/00A61M2205/3569A61M2205/50A61M2205/502A61M2205/52A61M2205/581A61M2205/582A61M2205/587A61M2205/8206A61M2230/201Y10T29/49169
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Quick Facts
Patent No.
US 12666543
App. No.
18/205,365
Granted
Jun 23, 2026
Kind
B2
Abstract

Pre-connected analyte sensors are provided. A pre-connected analyte sensor includes a sensor carrier attached to an analyte sensor. The sensor carrier includes a substrate configured for mechanical coupling of the sensor to testing, calibration, or wearable equipment. The sensor carrier also includes conductive contacts for electrically coupling sensor electrodes to the testing, calibration, or wearable equipment.

Claims (22)

1 . A system for measuring an analyte concentration in a host, the system comprising:

a transcutaneous analyte sensor;

a bottom housing;

a top housing;

sensor electronics configured to operatively connect to the transcutaneous analyte sensor, wherein the sensor electronics includes a substrate, wherein the sensor electronics are configured to be disposed between the bottom housing and the top housing;

wherein the bottom housing includes a floor and a plurality of locating pins, the plurality of locating pins extending from the floor;

wherein the plurality of locating pins are configured to extend into a plurality of holes in the substrate of the sensor electronics; and

a conductive member configured to establish electrical connection between the sensor and the sensor electronics.

2 . The system of claim 1 , wherein the conductive member is a conductive foam.

3 . The system of claim 1 , wherein the conductive member is a conductive polymer.

4 . The system of claim 3 , wherein the conductive member is a conductive elastomer.

5 . The system of claim 1 , wherein the conductive member is a conductive fabric.

6 . The system of claim 1 , wherein the conductive member is a conductive wire.

7 . The system of claim 1 , wherein the conductive member is a metallic foil.

8 . The system of claim 1 , wherein the conductive member is a conductive strip.

9 . The system of claim 1 , wherein the plurality of locating pins consists of two locating pins.

10 . The system of claim 1 , wherein the plurality of locating pins consists of three locating pins.

11 . The system of claim 1 , wherein the plurality of locating pins are formed as an integral part of the floor.

12 . The system of claim 1 , wherein the sensor is pre-connected to the sensor electronics within the bottom housing and the top housing.

13 . The system of claim 1 , wherein the top housing and the bottom housing are assembled together to form a housing, the housing having an internal cavity.

14 . The system of claim 13 , wherein the top housing and the bottom housing are sealed together to prevent moisture ingress to the internal cavity.

15 . The system of claim 14 , wherein the sealing includes an encapsulating material.