Systems and methods for microfluidic thermal management
A thermal management device includes a microfluidic volume having a first peripheral side and a second peripheral side and including at least one thermal element, a first port to the microfluidic volume, a second port from the microfluidic volume, an inlet valve at the first port to the microfluidic volume, an outlet valve at the second port, and a valve piezoelectric element in mechanical communication with a portion of at least one of the inlet valve and the outlet valve to move at least the portion of the at least one of the inlet valve and the outlet valve and selectively allow fluid flow through the microfluidic volume.
1 . A thermal management device comprising:
a microfluidic volume having a first peripheral side and a second peripheral side and including at least one thermal element, wherein the microfluidic volume is at least partially defined by an integrated circuit substrate;
a first port to the microfluidic volume;
a second port from the microfluidic volume;
an inlet valve at the first port to the microfluidic volume;
an outlet valve at the second port; and
a valve piezoelectric element in mechanical communication with a portion of at least one of the inlet valve and the outlet valve to move at least the portion of the at least one of the inlet valve and the outlet valve and selectively allow fluid flow through the microfluidic volume, wherein the thermal management device has a first state in which the inlet valve is open and the outlet valve is closed to allow the fluid flow into the microfluidic volume and a second state in which the inlet valve is closed and the outlet valve is open to allow the fluid flow out of the microfluidic volume.
2 . The thermal management device of claim 1 , wherein the first port is one port of a plurality of ports in fluid communication with an inlet manifold.
3 . The thermal management device of claim 1 , wherein the second port is one port of a plurality of ports in fluid communication with an outlet manifold.
4 . The thermal management device of claim 1 ,
wherein the at least one thermal element is integrally formed with the integrated circuit substrate.
5 . The thermal management device of claim 1 , further comprising a pumping membrane located adjacent to the microfluidic volume between the first peripheral side and the second peripheral side.
6 . The thermal management device of claim 5 , wherein the pumping membrane is or includes a pump piezoelectric element.
7 . The thermal management device of claim 1 , wherein the valve piezoelectric element is in mechanical communication with at least one of an inlet valve membrane of the inlet valve and an outlet valve membrane of the outlet valve to move at least a portion of the inlet valve membrane or the outlet valve membrane and selectively allow the fluid flow through the microfluidic volume.
8 . The thermal management device of claim 7 , wherein the valve piezoelectric element is in mechanical communication with at least a portion of the inlet valve, and the outlet valve is passive.
9 . The thermal management device of claim 1 , further comprising an external pump to pressurize a working fluid proximate the inlet valve.
10 . A method of thermal management, the method comprising:
measuring a thermal management demand of a heat-generating component in thermal communication with the thermal management device of claim 1 and in thermal communication with the microfluidic volume;
determining, based at least partially on the thermal management demand, a flow path of a working fluid through the microfluidic volume;
applying a first electric voltage or current to the valve piezoelectric element in mechanical communication with the inlet valve;
moving the inlet valve;
applying a second electric voltage or current to a second valve piezoelectric element in mechanical communication with the outlet valve;
moving the outlet valve; and
flowing the working fluid in the flow path through the microfluidic volume from the inlet valve toward the outlet valve.
11 . The method of claim 10 , wherein the thermal management demand includes a temperature of the heat-generating component.
12 . The method of claim 10 , wherein the thermal management demand includes a workload of the heat-generating component.
13 . The method of claim 10 , wherein the thermal management demand includes a power draw of the heat-generating component.
14 . The method of claim 10 , wherein the thermal management demand includes a local region of the heat-generating component.
15 . The method of claim 14 , further comprising selectively opening the inlet valve based at least partially on the local region of the thermal management demand.
16 . The method of claim 15 , wherein opening the inlet valve includes applying an electric voltage or current to a pump piezoelectric element in mechanical communication with a pumping membrane.
17 . A thermal management system comprising:
a first bi-directional manifold in fluid communication with the thermal management device of claim 1 , wherein the first bi-directional manifold is in fluid communication with the first port and the inlet valve; and
a second bi-directional manifold in fluid communication with the thermal management device of claim 1 , wherein the second bi-directional manifold is in fluid communication with the second port and the outlet valve.
18 . The thermal management system of claim 17 , further comprising a pump configured to pressurize a working fluid at an inlet manifold.
19 . The thermal management system of claim 17 , wherein the first inlet valve is between the first port and the first bi-directional manifold.
20 . The thermal management system of claim 19 , wherein the outlet valve is between the second port and the second bi-directional manifold.