Angled and stepped faceplate for telecommunications and networking shelf and circuit packs
A shelf system for use in a telecommunications or networking application, the shelf system including a shelf assembly and a circuit pack conformally inserted into the shelf assembly. The circuit pack includes a printed circuit board disposed in an enclosure, an integrated circuit chip coupled to the printed circuit board, and a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip. The ports of the plurality of ports are angled relative to a front faceplate of the enclosure such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.
1 . A circuit pack adapted to be inserted into a conformal shelf assembly, the circuit pack comprising:
a printed circuit board disposed in an enclosure comprising a front faceplate and a side facing corner surface adjacent to the front faceplate, wherein the printed circuit board and the enclosure comprise a narrowed front portion and a widened rear portion, wherein side edges of the widened rear portion of the printed circuit board and the enclosure are adapted to be received by guide rails of the shelf assembly;
an integrated circuit chip coupled to the printed circuit board; and
a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip and a perimeter of the narrowed front portion of the printed circuit board and the enclosure, wherein ports of the plurality of ports are each disposed at the side facing corner surface at a same acute angle relative to towards the front faceplate of the enclosure and stepped relative to each other such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.
2 . The circuit pack of claim 1 , wherein the acute angle is 45 degrees.
3 . The circuit pack of claim 1 , wherein the ports of the plurality of ports comprise one or more of client ports and fabric ports.
4 . The circuit pack of claim 1 , wherein the integrated circuit chip is disposed in a central portion of the printed circuit board and between a plurality of fabric ports and a plurality of client ports of the plurality of ports.
5 . The circuit pack of claim 1 , further comprising a busbar coupled to the printed circuit board and disposed conformally around at least a portion of a perimeter of the integrated circuit chip.
6 . The circuit pack of claim 1 , further comprising:
a heat sink disposed within the enclosure and adjacent to a component side of the printed circuit board, the heat sink configured as a vapor chamber configured to circulate a fluid such that heat is removed from one or more heat sources of the printed circuit board, the vapor chamber comprising:
an evaporator proximate to the one or more heat sources of the printed circuit board and configured to thermally transfer heat from the one or more heat sources of the printed circuit board to the fluid of the vapor chamber;
a condenser physically displaced from the one or more heat sources of the printed circuit board and fluidly coupled to the evaporator, the condenser configured to thermally transfer heat from the fluid of the vapor chamber; and
a wick structure fluidly coupled between the condenser and the evaporator such that the fluid is transferred from the condenser to the evaporator and completing a fluid circuit of the vapor chamber.
7 . A shelf assembly adapted to receive an inserted conformal circuit pack, the shelf assembly comprising:
a chassis defining an opening adapted to provide access to a plurality of ports of the circuit pack, wherein the circuit pack is adapted to be inserted into the shelf assembly, the circuit pack comprising:
a printed circuit board disposed in an enclosure comprising a front faceplate and a side facing corner surface adjacent to the front faceplate, wherein the printed circuit board and the enclosure comprise a narrowed front portion and a widened rear portion, wherein side edges of the widened rear portion of the printed circuit board and the enclosure are adapted to be received by guide rails of the shelf assembly;
an integrated circuit chip coupled to the printed circuit board; and
a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip and a perimeter of the narrowed front portion of the printed circuit board and the enclosure, wherein ports of the plurality of ports are each disposed at the side facing corner surface at a same acute angle relative to towards the front faceplate of the enclosure and stepped relative to each other such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.
8 . The shelf assembly of claim 7 , wherein the acute angle is 45 degrees.
9 . The shelf assembly of claim 7 , wherein the ports of the plurality of ports comprise one or more of client ports and fabric ports.
10 . The shelf assembly of claim 7 , wherein the integrated circuit chip is disposed in a central portion of the printed circuit board and between a plurality of fabric ports and a plurality of client ports.
11 . The shelf assembly of claim 7 , further comprising a busbar coupled to the printed circuit board and disposed conformally around at least a portion of a perimeter of the integrated circuit chip.
12 . The shelf assembly of claim 7 , further comprising:
a heat sink disposed within the enclosure and adjacent to a component side of the printed circuit board, the heat sink configured as a vapor chamber configured to circulate a fluid such that heat is removed from one or more heat sources of the printed circuit board, the vapor chamber comprising:
an evaporator proximate to the one or more heat sources of the printed circuit board and configured to thermally transfer heat from the one or more heat sources of the printed circuit board to the fluid of the vapor chamber;
a condenser physically displaced from the one or more heat sources of the printed circuit board and fluidly coupled to the evaporator, the condenser configured to thermally transfer heat from the fluid of the vapor chamber; and
a wick structure fluidly coupled between the condenser and the evaporator such that the fluid is transferred from the condenser to the evaporator and completing a fluid circuit of the vapor chamber.
13 . A shelf system for use in a telecommunications or networking application, the shelf system comprising:
a shelf assembly;
a circuit pack conformally inserted into the shelf assembly, the circuit pack comprising:
a printed circuit board disposed in an enclosure comprising a front faceplate and a side facing corner surface adjacent to the front faceplate, wherein the printed circuit board and the enclosure comprise a narrowed front portion and a widened rear portion, wherein side edges of the widened rear portion of the printed circuit board and the enclosure are adapted to be received by guide rails of the shelf assembly;
an integrated circuit chip coupled to the printed circuit board; and
a plurality of ports coupled to the printed circuit board and disposed around the integrated circuit chip and a perimeter of the narrowed front portion of the printed circuit board and the enclosure, wherein ports of the plurality of ports are each disposed at the side facing corner surface at a same acute angle relative to towards the front faceplate of the enclosure and stepped relative to each other such that lengths of tracks between the ports and the integrated circuit chip are less than a predetermined maximum length.
14 . The shelf system of claim 13 , wherein the acute angle is 45 degrees.
15 . The shelf system of claim 13 , wherein the ports of the plurality of ports comprise one or more of client ports and fabric ports.
16 . The shelf system of claim 13 , wherein the integrated circuit chip is disposed in a central portion of the printed circuit board and between a plurality of fabric ports and a plurality of client ports of the plurality of ports.
17 . The shelf system of claim 13 , further comprising a busbar coupled to the printed circuit board and disposed conformally around at least a portion of a perimeter of the integrated circuit chip.