Electronic device cooling heat from electronic elements
The electronic device includes a housing, a substrate disposed in an interior of the housing, an electronic element mounted on the substrate, a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element, and a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing.
1 . An electronic device comprising:
a housing;
a substrate disposed in an interior of the housing;
an electronic element mounted on the substrate;
a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element; and
a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing,
wherein the first cooling member includes:
a heat pipe including a first end in contact with the electronic element and a second end spaced apart from the first end, and configured to transfer the heat received from the electronic element from the first end toward the second end; and
a heat dissipation member in contact with the heat pipe and configured to dissipate heat received from the heat pipe to the outside of the housing,
wherein the second cooling member includes:
a fan coupled to the housing and configured to draw the air from the outside to the inside of the housing;
a first guide portion guiding, toward the heat pipe, a flow of a portion of the air drawn to the inside of the housing by the fan; and
a second guide portion guiding, toward the heat dissipation member, a flow of another portion of the air drawn to the inside of the housing by the fan,
wherein the heat dissipation member includes:
a heat dissipation body coupled to the housing and in contact with the heat pipe;
a first heat dissipation portion protruding from the heat dissipation body toward the outside of the housing; and
a second heat dissipation portion protruding from the heat dissipation body toward the outside of the housing and spaced apart from the first heat dissipation portion,
wherein the second guide portion includes an outer channel externally disposed on the housing in a position facing the first heat dissipation portion, and
wherein a first blocking member is disposed between the first heat dissipation portion and the second heat dissipation portion and configured to block moisture from entering the outer channel.
2 . The electronic device of claim 1 , wherein the heat pipe is disposed to face a topmost substrate vertically on an upper side of the housing.
3 . The electronic device of claim 1 , wherein a volume of the second heat dissipation portion is greater than a volume of the first heat dissipation portion.
4 . The electronic device of claim 1 , wherein the first heat dissipation portion is disposed between the first end and the second end.
5 . The electronic device of claim 1 , wherein the first guide portion includes:
an inner channel disposed between the substrate and the second end; and
a discharge hole penetrating through the housing or the heat dissipation body and configured to discharge the air drawn into the inner channel to the outside of the housing.
6 . The electronic device of claim 5 , wherein a gap between the substrate and the second end is greater than a gap between the substrate and the first end.
7 . The electronic device of claim 6 , further including a stepped portion formed with first and second ends disposed crosswise with respect to the first end and the second end.
8 . The electronic device of claim 1 , wherein the second guide portion further includes:
a transfer hole penetrating through the heat dissipation body so as to be connected to the outer channel and configured to transfer the air drawn to the inside of the housing to the outer channel.
9 . The electronic device of claim 8 , wherein the outer channel includes a form of a groove that is recessed downwardly from a top surface of the heat dissipation member.
10 . The electronic device of claim 8 , wherein the first heat dissipation portion is provided in plural so that the outer channel is disposed between adjacent ones of the plurality of first heat dissipation portions.
11 . The electronic device of claim 8 , wherein the first blocking member is recessed inward from a top surface of the heat dissipation member.
12 . The electronic device of claim 8 , wherein the first blocking member is disposed parallel to the outer channel.
13 . The electronic device of claim 8 , further including:
a second blocking member protruding from the outer channel toward the transfer hole and configured to block moisture from entering the inside of the housing.
14 . The electronic device of claim 13 , wherein the second blocking member is disposed at an end of the outer channel.
15 . The electronic device of claim 13 , wherein a height of the second blocking member is less than a height of the transfer hole.
16 . An electronic device comprising:
a housing;
a substrate disposed in an interior of the housing;
an electronic element mounted on the substrate;
a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element; and
a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing,
wherein the first cooling member includes:
a heat pipe including a first end in contact with the electronic element and a second end spaced apart from the first end, and configured to transfer the heat received from the electronic element from the first end toward the second end; and
a heat dissipation member in contact with the heat pipe and configured to dissipate heat received from the heat pipe to the outside of the housing,
wherein the second cooling member includes:
a fan coupled to the housing and configured to draw the air from the outside to the inside of the housing;
a first guide portion guiding, toward the heat pipe, a flow of a portion of the air drawn to the inside of the housing by the fan; and
a second guide portion guiding, toward the heat dissipation member, a flow of another portion of the air drawn to the inside of the housing by the fan;
wherein the heat dissipation member includes:
a heat dissipation body coupled to the housing and in contact with the heat pipe;
a first heat dissipation portion protruding from the heat dissipation body toward the outside of the housing; and
a second heat dissipation portion protruding from the heat dissipation body toward the outside of the housing and spaced apart from the first heat dissipation portion,
wherein the second guide portion includes:
an outer channel externally disposed on the housing in a position facing the first heat dissipation portion; and
a transfer hole penetrating through the heat dissipation body so as to be connected to the outer channel and configured to transfer the air drawn to the inside of the housing to the outer channel,
wherein a blocking member is protruded from the outer channel toward the transfer hole and configured to block moisture from entering the inside of the housing.