Systems and methods for a direct printed heat sink

1 . A system for an electric vehicle, the system comprising:

a power switch configured to convert DC power from a battery to AC power to drive a motor;

a direct bonding material layer coupled to the power switch by a first solder material; and

a three-dimensionally printed heat sink (3D heat sink) that is three-dimensionally printed onto the direct bonding material layer,

wherein the direct bonding material layer includes:

a first copper layer;

an aluminum nitride layer; and

a second copper layer, wherein the aluminum nitride layer is located between the first copper layer and the second copper layer.

2 . The system of claim 1 , wherein the power switch includes silicon carbide.

3 . The system of claim 1 , further comprising:

a second solder material coupled to the power switch;

a second direct bonding material layer coupled to the second solder material; and

a second heat sink three-dimensionally printed to the second direct bonding material layer, the second direct bonding material layer being of a material configured to allow for the 3D heat sink to be three-dimensionally printed onto the direct bonding material layer.

4 . The system of claim 3 , wherein the second direct bonding material layer includes:

a first copper layer;

an aluminum nitride layer; and

a second copper layer.

5 . The system of claim 1 , further comprising:

a second solder material coupled to the power switch;

a second direct bonding material layer coupled to the second solder material;

a thermal interface material coupled to the second direct bonding material layer; and

a second heat sink coupled to the thermal interface material.

6 . The system of claim 1 , wherein the direct bonding material layer and the 3D heat sink are a same material.

7 . An inverter comprising the system of claim 1 .

8 . An inverter comprising:

a power module including:

a first power switch;

a three-dimensionally printed first heat sink (first 3D heat sink) coupled to the first power switch, the first 3D heat sink including a first inlet and a first outlet;

a second power switch;

a three-dimensionally printed second heat sink (second 3D heat sink) coupled to the second power switch, the second 3D heat sink including a second inlet and a second outlet; wherein the first outlet of the first 3D heat sink is fluidly coupled to the second inlet of the second 3D heat sink;

a first direct bonding material layer coupled to the first power switch by a first solder material, wherein the first 3D heat sink is three-dimensionally printed onto the first direct bonding material layer;

a second direct bonding material layer coupled to the second power switch by a second solder material, wherein the second 3D heat sink is three-dimensionally printed onto the second direct bonding material layer;

a third direct bonding material layer coupled to the first power switch by a third solder material;

a three-dimensionally printed third heat sink (third 3D heat sink) three-dimensionally printed to the third direct bonding material layer, the third 3D heat sink including a third inlet and a third outlet;

a fourth direct bonding material layer coupled to the second power switch by a fourth solder material; and

a three-dimensionally printed fourth heat sink (fourth 3D heat sink) three-dimensionally printed to the fourth direct bonding material layer, the fourth 3D heat sink including a fourth inlet and a fourth outlet; wherein the third outlet of the third 3D heat sink is fluidly coupled to the fourth inlet of the fourth 3D heat sink.

9 . The inverter of claim 8 , wherein the first direct bonding material layer includes:

a first copper layer;

an aluminum nitride layer; and

a second copper layer, wherein the aluminum nitride layer is located between the first copper layer and the second copper layer.

10 . The inverter of claim 8 , wherein the second direct bonding material layer includes:

a third copper layer;

a second aluminum nitride layer; and

a fourth copper layer, wherein the second aluminum nitride layer is located between the third copper layer and the fourth copper layer.

11 . The inverter of claim 8 , wherein the first 3D heat sink is a same material as a layer of the first direct bonding material layer.

12 . The inverter of claim 8 , wherein the second 3D heat sink is a same material as a layer of the second direct bonding material layer.

13 . A vehicle comprising the inverter of claim 8 .

14 . A method of forming a cooling module assembly, the method comprising:

three-dimensionally printing a heat sink onto a direct bonding material layer coupled by a solder material to a power switch configured to convert DC power from a battery to AC power to drive a motor, wherein the direct bonding material layer includes:

a first copper layer;

a second copper layer; and

an aluminum nitride layer located between the first copper layer and the second copper layer.