Semiconductor structure and method for forming semiconductor structure

1 . A method for forming a semiconductor structure, comprising:

providing a substrate; and

forming a switching transistor and a storage transistor on a top surface of the substrate, wherein the switching transistor comprises a first gate electrode, a first channel layer coating a portion of the first gate electrode, and a first source-drain electrode and a second source-drain electrode both covering a surface of the first channel layer, the first source-drain electrode and the second source-drain electrode are distributed at two opposite ends of the first channel layer in a first direction, the first gate electrode extends in the first direction, the storage transistor comprises a second gate electrode, a second channel layer coating a portion of the second gate electrode, and a third source-drain electrode and a fourth source-drain electrode both covering a surface of the second channel layer, the third source-drain electrode and the fourth source-drain electrode are distributed at two opposite ends of the second channel layer in the first direction, the second gate electrode extends in the first direction, a portion of the second gate electrode extending out of the second channel layer in the first direction is electrically connected to the second source-drain electrode, the storage transistor is configured to store charge, and the first direction is a direction parallel to the top surface of the substrate.

2 . The method for forming the semiconductor structure of claim 1 , wherein forming the switching transistor and the storage transistor on the top surface of the substrate comprises:

forming a layer stack on the top surface of the substrate, wherein the layer stack comprises a plurality of semiconductor layers spaced apart in a direction perpendicular to the top surface of the substrate;

forming a support frame covering a portion of each of the plurality of semiconductor layers, wherein the support frame separates the layer stack into a switching area and a storage area arranged in the first direction, a portion of the semiconductor layer in the switching area serves as the first gate electrode, and a portion of the semiconductor layer in the storage area serves as the second gate electrode;

depositing a channel material on the first gate electrode and the second gate electrode to form the first channel layer coating the first gate electrode and the second channel layer coating the second gate electrode; and

forming the second source-drain electrode covering the surface of the first channel layer, the second source-drain electrode being connected to the second gate electrode.

3 . The method for forming the semiconductor structure of claim 2 , wherein forming the layer stack on the top surface of the substrate comprises:

alternately depositing a first sacrificial layer and the semiconductor layer on the top surface of the substrate to form the layer stack;

etching the layer stack to form a first part, and a second part and a third part both protruding from a side wall of the first part in a second direction, the second direction being a direction parallel to the top surface of the substrate, and the second direction intersecting the first direction; and

forming a plurality of first trenches penetrating through the first part, wherein the plurality of first trenches separate each of the plurality of semiconductor layers into a plurality of active strips spaced apart in the second direction.

4 . The method for forming the semiconductor structure of claim 3 , wherein forming the support frame covering a portion of each of the plurality of semiconductor layers comprises:

defining the switching area and the storage area in the layer stack, such that the third part is located at a side of the switching area away from the storage area and the second part is located at a side of the storage area close to the switching area;

forming a second sacrificial layer filling the plurality of first trenches and a gap between the second part and the third part;

removing the second sacrificial layer at an end portion of the storage area adjacent to the switching area, to expose a portion of each of the plurality of active strips; and

forming the support frame covering a surface of the exposed portion of the active strip.

5 . The method for forming the semiconductor structure of claim 4 , wherein forming the first channel layer coating the first gate electrode and the second channel layer coating the second gate electrode comprises:

removing the layer stack and the second sacrificial layer which are located at an end portion of the switching area adjacent to the support frame to form a second trench exposing the substrate;

forming a third sacrificial layer filling the second trench;

removing the first sacrificial layer and the second sacrificial layer to expose the portion of the first gate electrode and the portion of the second gate electrode;

forming a first gate electrode dielectric layer covering the exposed portion of the first gate electrode and a second gate electrode dielectric layer covering the exposed portion of the second gate electrode;

removing the third sacrificial layer to expose an end portion of the second gate electrode located in the support frame;

implanting second doped ions into the exposed end portion of the second gate electrode; and

depositing a channel material on the first gate electrode and the second gate electrode to form the first channel layer coating the first gate electrode and the second channel layer coating the second gate electrode, the first channel layer being in contact with the end portion of the second gate electrode implanted with the second doped ions.

6 . The method for forming the semiconductor structure of claim 5 , further comprising:

before forming the second source-drain electrode covering the surface of the first channel layer, depositing a conductive material on a portion of the surface of the second channel layer and a surface of the second part in the storage area, to form the fourth source-drain electrode and a read word line extending in the second direction and successively connecting a plurality of fourth source-drain electrodes.

7 . The method for forming the semiconductor structure of claim 5 , further comprising:

after forming the second source-drain electrode covering the surface of the first channel layer, forming the first source-drain electrode, the third source-drain electrode, a read bit line, and a write bit line, wherein the read bit line extends in a third direction and continuously connects a plurality of third source-drain electrodes spaced apart in the third direction, the write bit line extends in the third direction and continuously connects a plurality of first source-drain electrodes spaced apart in the third direction, and the third direction is a direction perpendicular to the top surface of the substrate; and

forming a write word line in the third part and a portion of the first part connected to the third part in the second direction, the write word line being connected to the first gate electrode.