IP Library Granted Patent US 12666666
Granted Patent B2
US 12666666 · App. 18/183,354 · Granted Jun 23, 2026

Semiconductor device structure and method for forming the same

Inventors: Hong-Chih Chen (Changhua County, TW); Chun-Yi Chang (Hsinchu City, TW); Fu-Hsiang Su (Zhubei City, TW); Shih-Hsun Chang (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H10D62/121H10D30/014H10D30/43H10D30/6735H10D30/6757H10D64/017
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Quick Facts
Patent No.
US 12666666
App. No.
18/183,354
Granted
Jun 23, 2026
Kind
B2
Abstract

A semiconductor device structure includes first nanostructures and second nanostructures formed over a substrate. The structure also includes gate structures that are wrapped around the first nanostructures and the second nanostructures and that extend along a first direction. The structure also includes a dielectric structure formed between two of the gate structures and parallel to the gate structures. A first sidewall of the first nanostructures is shifted from a first sidewall of the second nanostructures in a second direction, the second direction is different from the first direction.

Claims (49)

1 . A semiconductor device structure, comprising:

first nanostructures and second nanostructures formed over a substrate;

gate structures wrapped around the first nanostructures and the second nanostructures and extending along a first direction; and

a dielectric structure formed between two of the gate structures and parallel to the gate structures,

wherein a first sidewall of the first nanostructures is shifted from a first sidewall of the second nanostructures in a second direction, and wherein the second direction is different from the first direction.

2 . The semiconductor device structure as claimed in claim 1 , wherein the dielectric structure is sandwiched between the first nanostructures and the second nanostructures.

3 . The semiconductor device structure as claimed in claim 1 , further comprising:

a wall structure formed beside the first nanostructures,

wherein the dielectric structure is formed across the wall structure.

4 . The semiconductor device structure as claimed in claim 3 , wherein the wall structure is in contact with a bottom surface and sidewalls of a bottom portion of the dielectric structure.

5 . The semiconductor device structure as claimed in claim 3 , wherein the wall structure protrudes from a third sidewall of the second nanostructures in the first direction in a top view.

6 . The semiconductor device structure as claimed in claim 3 , further comprising:

a second dielectric structure parallel to the dielectric structure formed across the second nanostructures.

7 . The semiconductor device structure as claimed in claim 6 , wherein one of the gate structures is formed between the dielectric structure and the second dielectric structure.

8 . The semiconductor device structure as claimed in claim 3 , further comprising:

a second wall structure formed beside the second nanostructures,

wherein the second wall structure is shifted from the wall structure.

9 . A semiconductor device structure, comprising:

a wall structure formed over a substrate;

first nanostructures attached to a first sidewall of the wall structure;

second nanostructures formed parallel to the first nanostructures;

third nanostructures formed parallel to the first nanostructures and the second nanostructures and attached to a second sidewall of the wall structure;

a dielectric structure sandwiched between the first nanostructures and the second nanostructures; and

gate structures formed across the first nanostructures and the second nanostructures,

wherein the first nanostructures and the second nanostructures have different widths.

10 . The semiconductor device structure as claimed in claim 9 , further comprising:

an isolation structure formed beside the second nanostructures,

wherein the wall structure and the isolation structure are at opposite sides of the dielectric structure.

11 . The semiconductor device structure as claimed in claim 9 , further comprising:

a first seam formed in the wall structure,

wherein a portion of the dielectric structure is exposed by the first seam.

12 . The semiconductor device structure as claimed in claim 11 , further comprising:

a second seam formed in the dielectric structure,

wherein the second seam is separated from the first seam.

13 . The semiconductor device structure as claimed in claim 9 , wherein the dielectric structure partially overlaps the wall structure.

14 . The semiconductor device structure as claimed in claim 9 , further comprising:

source/drain structures formed at opposite sides of the gate structures; and

a dummy gate material formed between the source/drain structures and the dielectric structure.

15 . The semiconductor device structure as claimed in claim 9 , wherein a bottom surface of the dielectric structure is lower than a top surface of the wall structure.

16 . A semiconductor device structure, comprising:

an isolation structure surrounding a substrate;

first nanostructures and second nanostructures over the substrate;

gate structures wrapped around the first nanostructures and the second nanostructures;

a dielectric structure between the first nanostructures and the second nanostructures, wherein a lower portion of the dielectric structure extends into the isolation structure; and

a wall structure attached to the first nanostructures, wherein the wall structure is at opposite sides of the dielectric structure.

17 . The semiconductor device structure as claimed in claim 16 , wherein a bottom width of the dielectric structure is less than a top width of the dielectric structure.

18 . The semiconductor device structure as claimed in claim 16 , wherein an area of the wall structure on a first side of the dielectric structure is greater than an area of the wall structure on a second side of the dielectric structure opposite to the first side in a top view.

19 . The semiconductor device structure as claimed in claim 16 , wherein the first nanostructures and the second nanostructures have different widths.

20 . The semiconductor device structure as claimed in claim 16 , wherein the lower portion of the dielectric structure has a tapered width.