Semiconductor device
A Metal Oxide Semiconductor (MOS) transistor cell design has multiple trench recesses embedding trench gate electrodes longitudinally extending in a third dimension, with interconnected first base layer, source regions, and a second base layer covering portions of the regions between adjacent trench recesses and longitudinally extending in the same third dimension. When a control voltage greater than a threshold value is applied on the trench gate electrodes, no vertical MOS channels are formable on the trench walls because each of trench recesses abuts at least one source regions and a connected highly doped second base layer. Instead, the charge carriers flow from a singular point within the source region, into a radial MOS channel formed only on the lateral walls of those trench regions abutting the first base layer, but not the higher doped second base layer.
1 . A semiconductor device comprising a first surface and a second surface separated in a first dimension of three orthogonal dimensions, wherein an emitter electrode is operatively connected to the first surface and a collector electrode is operatively connected to the second surface, and further comprising:
a drift layer located between the first surface and the second surface;
a source region of a first conductivity type operatively connected to the emitter electrode, formed by ion implantation through a source mask, with a doping concentration greater than a doping concentration of the drift layer;
a first base layer of a second conductivity type opposite of the first conductivity type, extending in the first dimension from the first surface towards the drift layer;
a second base layer of the second conductivity type located within the first base layer and extending deeper than the source region in the first dimension, having a doping concentration greater than a doping concentration of the first base layer, having at least a point operatively connected to the emitter electrode via a contact opening;
wherein, each of the source region and the second base layer extend longitudinally in a top plane view in a third dimension,
a plurality of trench regions longitudinally extending in the third dimension, each trench region comprising a first gate electrode and a first insulating layer, the first insulating layer electrically insulating the first gate electrode from the first base layer, the second base layer, the source region and the drift layer;
a second insulating layer on the first surface of the drift layer in contact with the first base layer, source region and drift layer; and,
wherein, the second base layer is adjacent to and does not fully surround the source region,
wherein, the first base layer extends longitudinally in a top plane view and is structured in the third dimension,
wherein a singular point is defined at a surface of the source region abutting an adjacent trench region from the plurality of trench regions, a surface doping concentration of the source region is at a maximum value, the surface doping concentration of the source region decreases from the singular point to a p-n junction with the first base layer,
wherein, the first base layer is structured in the third dimension with a first and second edges that extend beyond the first and second edges of the source region, and its position of maximum surface doping concentration is spaced apart, by a first separation region, from the singular point of the source region
wherein, in the third dimension, the first end of the second base layer and the singular point are spaced apart by a second separation region,
wherein the effective total channel width W total can be determined by the formula
W
total
=
4
×
N
cells
×
(
π
×
L
50
/
2
+
L
6
0
)
,
and wherein, N cells is the number of active transistor cells across the plurality of transistor cells,
L 50 is the length of the first separation region, and
L 60 is the length of the second separation region.
2 . The semiconductor device of claim 1 wherein the plurality of trench regions abuts the source region and the second base layer in a second dimension perpendicular to the first and third dimensions, such that the highly doped second base layer prevents charge carriers to flow in the first dimension between the source region and the drift layer, when the voltage applied on the first gate electrodes forms an inversion layer in the first base layer.
3 . The semiconductor device of claim 1 included within an arrangement comprising a plurality of semiconductor devices.
4 . The semiconductor device of claim 1 , wherein the contact opening extends between and connects adjacent transistor cells in the third dimension.
5 . The semiconductor device of claim 1 having at least a portion of the drift layer abutting the first surface in the regions between adjacent transistor cells in the second dimension.
6 . The semiconductor device of claim 1 , wherein a second gate electrode is arranged on the first base layer, the source region and the drift layer, wherein the second gate electrode is electrically insulated from the first base layer, the source region, and the drift layer, by the second insulating layer, and from the emitter electrode by a third insulating layer; wherein the first gate electrodes are operatively connected with the second gate electrode.
7 . The semiconductor device of claim 1 , wherein at least one of the first gate electrodes is electrically connected to the emitter electrode.
8 . The semiconductor device of claim 1 , wherein at least one of the first gate electrodes is electrically floating.
9 . The semiconductor device of claim 1 , further comprising at least one of:
a buffer layer of the first conductivity type located between the drift layer and the collector electrode on the second surface, wherein the doping concentration of the buffer layer is greater than the doping concentration of the drift layer; and
a collector layer of the second conductivity type located between the drift layer and the collector electrode on the second surface.
10 . The semiconductor device according to claim 9 , wherein the semiconductor is a reverse conducting power semiconductor device and the collector layer comprises alternating regions of opposite first and second conductivity types.
11 . The semiconductor device of claim 1 , wherein an enhancement layer of the first conductivity type is located between the drift layer and the first base layer, and wherein the doping concentration of the enhancement layer is greater than a doping concentration of the drift layer.
12 . The semiconductor device of claim 1 , wherein the semiconductor has a stripe layout design or cellular layout design in a top view plane.
13 . The semiconductor device of claim 1 , wherein at least the drift layer is formed of a wide bandgap material.
14 . The semiconductor device of claim 1 , wherein the drift layer is formed of alternating regions of the first conductivity type and the second conductivity type.