Semiconductor device and method of fabricating the same
View Patent ↗The present disclosure relates to a semiconductor device and a fabricating method thereof, includes a substrate, a gate structure, a plug hole, a plug spacer, a metal silicide layer, and a plug. The gate structure is disposed on the substrate. The plug hole is disposed within a dielectric layer to partially extended into the substrate. The plug spacer is disposed on a sidewall of the plug hole to partially expose the substrate. The metal silicide layer is disposed at a bottom of the plug hole, wherein a portion of the substrate is sandwiched between the metal silicide layer and the plug spacer. The plug is disposed in the plug hole to physically contact the portion of the substrate. Accordingly, through forming the plug spacer to precisely define the forming location and the depth of the metal silicide layer, thereby achieving the function on improving the performance of the semiconductor device.
1 . A semiconductor device, comprising:
a substrate;
a gate structure, disposed on the substrate;
a dielectric layer, disposed on the substrate to cover the gate structure;
a plug hole, disposed within the dielectric layer to partially extend into the substrate;
a plug spacer, disposed on a sidewall of the plug hole to partially expose the substrate;
a metal silicide layer, disposed at a bottom of the plug hole, wherein the metal silicide layer comprises two portions separately disposed from each other; and
a plug, disposed in the plug hole to physically contact the portion of the substrate, wherein the two portions of the metal silicide layer respectively contact a side surface and a bottom surface of the plug.
2 . The semiconductor device according to claim 1 , wherein a sidewall of the metal silicide layer is vertically aligned with a sidewall of the plug spacer.
3 . The semiconductor device according to claim 1 , wherein an extension area of the metal silicide layer in a horizontal direction gradually decreases with an increasing depth of the metal silicide layer.
4 . The semiconductor device according to claim 1 , wherein the plug spacer is separated from the metal silicide layer.
5 . The semiconductor device according to claim 1 , wherein a vertical sidewall of the plug physically contacts the portion of the substrate and the plug spacer at the same time.
6 . The semiconductor device according to claim 1 , wherein the gate structure further comprising:
a stacked structure; and
a gate spacer, disposed on a sidewall of the stacked structure, at one side of the plug spacer.
7 . The semiconductor device according to claim 1 , further comprising:
two doped regions, disposed in the substrate and at two opposite sides of the gate structure, wherein the plug physically contacts the doped regions.
8 . A fabricating method of a semiconductor device, comprising:
providing a substrate;
forming a gate structure on the substrate;
forming a dielectric layer on the substrate, to cover the gate structure;
forming a plug hole within the dielectric layer, to partially extend into the substrate;
forming a plug spacer on a sidewall of the plug hole, to partially expose the substrate;
forming a metal silicide layer at a bottom of the plug hole, wherein the metal silicide layer comprises two portions separately disposed from each other; and
forming a plug in the plug hole, to physically contact the portion of the substrate, wherein the two portions of the metal silicide layer respectively contact a side surface and a bottom surface of the plug.
9 . The fabricating method of the semiconductor device according to claim 8 , wherein forming the metal silicide layer further comprises:
forming two doped regions in the substrate, at two opposite sides of the gate structure; and
forming a through hole in the dielectric layer, to partially expose the doped regions.
10 . The fabricating method of the semiconductor device according to claim 9 , further comprising:
performing a metal silicidation process to form a metal silicide material layer.
11 . The fabricating method of the semiconductor device according to claim 10 , wherein the metal silicidation process further comprises:
performing a selectively epitaxial growth process, to form a metal layer in the through hole; and
transforming the metal layer into the metal silicide material layer.
12 . The fabricating method of the semiconductor
device according to claim 10 , further comprising:
performing a deposition process, to form a metal layer;
transforming the metal layer into the metal silicide-silicon material layer; and
after forming the metal silicide material layer, removing an unreacted portion of the metal layer.
13 . The fabricating method of the semiconductor device according to claim 10 , further comprising:
after performing the metal silicidation process, partially removing the metal silicide material layer, to form the plug hole and the metal silicide layer disposed at the bottom of the plug hole, wherein an upper portion of the plug hole overlaps the through hole.
14 . The fabricating method of the semiconductor device according to claim 13 , further comprising:
before performing the metal silicidation process, depositing a material layer in the through hole; and
partially removing the material layer, to form the plug spacer at a sidewall of the through hole.
15 . The fabricating method of the semiconductor device according to claim 8 , wherein an extension area of the metal silicide layer in a horizontal direction gradually decreases with an increasing depth of the metal silicide layer.
16 . The fabricating method of the semiconductor device according to claim 8 , wherein a sidewall of the metal silicide layer is vertically aligned with a sidewall of the plug spacer.
17 . A semiconductor device, comprising:
a substrate;
a gate structure, disposed on the substrate;
a dielectric layer, disposed on the substrate to cover the gate structure;
a plug hole, disposed within the dielectric layer to partially extend into the substrate;
a plug spacer, disposed on a sidewall of the plug hole to partially expose the substrate;
a metal silicide layer, disposed at a bottom of the plug hole, wherein the metal silicide layer comprises a discontinuous structure and a portion of the substrate is sandwiched between the metal silicide layer and the plug spacer; and
a plug, disposed in the plug hole to physically contact the portion of the substrate.
18 . The semiconductor device according to claim 17 , wherein a sidewall of the metal silicide layer is vertically aligned with a sidewall of the plug spacer.
19 . The semiconductor device according to claim 17 , wherein an extension area of the metal silicide layer in a horizontal direction gradually decreases with an increasing depth of the metal silicide layer.
20 . The semiconductor device according to claim 17 , wherein the plug spacer is separated from the metal silicide layer.