Laser projection proximity mass transfer device, method and equipment
The disclosure belongs to the field of MicroLED, and discloses a projection proximity mass transfer device. The device includes a support layer, a dynamic release layer and a adhesive foam layer. The support layer is a base layer; the dynamic release layer is arranged on the support layer. Under laser radiation, the dynamic release layer is ablated to generate ablation gas, thereby causing the dynamic release layer to generate blister; the adhesive foam layer is arranged on the dynamic release layer, and the foam layer is in contact with the MicroLED to be transferred. Under the action of thermal stimulation or laser, the foamed particles inside the adhesive foam layer expand, reducing the adhesion of the foam layer. Thereby, blisters with microstructures are formed at the interface between the stamp and the chip, thus realizing peeling of the MicroLED to be transferred.
1 . A preparation method of a mass transfer module for a laser projection proximity mass transfer device, wherein the laser projection proximity mass transfer device comprises:
a laser module, a laser mask projection optical path module, a vision module, and a mass transfer module, wherein the mass transfer module comprises a support layer, a dynamic release layer and an adhesive foam layer arranged in a top-down setup;
wherein the support layer is a base layer; the dynamic release layer is arranged on the support layer, under an action of a laser, the dynamic release layer is ablated to generate an ablation gas, thereby causing the dynamic release layer to generate a blister, wherein the adhesive foam layer is arranged on the dynamic release layer, and the adhesive foam layer is in contact with a MicroLED to be transferred, under an action of thermal stimulation or the laser, foamed particles inside the adhesive foam layer expand, reducing a adhesion of the adhesive foam layer, so as to peel off the MicroLED to be transferred;
wherein the laser module is configured to emit the laser, the laser mask projection optical path module is configured to project the laser to the dynamic release layer, and the vision module is configured to observe a transfer process of the MicroLED to be transferred in real time,
wherein the preparation method comprises the following steps:
S1, selecting a hard and transparent substrate as the support layer;
S2, spin-coating a solution of the dynamic release layer on the support layer, and performing curing;
S3, selecting a material of a matrix of the adhesive foam layer and the material of the foamed particles, mixing the two evenly to form a mixed solution, spin-coating the mixed solution on the cured dynamic release layer, and performing curing, so as to obtain the required mass transfer device.
2 . The preparation method according to claim 1 , wherein in step S2, a curing temperature is 180° C. to 220° C., and a curing time is 3 hours to 5 hours.
3 . The preparation method according to claim 1 , wherein in step S3, a curing temperature is 60° C. to 90° C., and a curing time is 10 minutes to 20 minutes.