Tunnel-junction cascade LED with different pump wavelengths
Provided is a phosphor converted LED comprised of a first and a second p-n junction deposited sequentially on the same wafer. The first and second junctions are separated by a tunnel junction. One multiple quantum well is embedded between the n- and p-layers of the first junction and another multiple quantum well is embedded between the n- and p-layers of the second junction. The peak emission wavelengths of the two junctions are both between 400 nm and 500 nm and are at least 5 nm apart.
1 . A light-emitting diode (LED) die comprising:
a first p-n junction on a second p-n junction, the first p-n junction and the second p-n junction separated by a tunnel junction, wherein:
the first p-n junction comprises a first p-type layer on a first multiple quantum well, and the first multiple quantum well on a first n-type layer,
the second p-n junction comprises a second n-type layer in contact with the tunnel junction and on a second multiple quantum well, the second multiple quantum well on a second p-type layer;
a first metal contact on a dielectric layer;
a second metal contact on the second p-type layer; and
a wavelength converting layer surrounding the first p-n junction and the second p-n junction.
2 . The LED die of claim 1 , wherein the first p-n junction has a first emission wavelength in a range of from 400 nm to 500 nm and wherein the second p-n junction has a second emission wavelength in a range of from 400 nm to 500 nm, the first emission wavelength different from the second emission wavelength by at least 5 nm.
3 . The LED die of claim 2 , wherein the first emission wavelength is in a range of from 420 nm and 460 nm and the second emission wavelength is in a range of from 460 nm and 500 nm.
4 . The LED die of claim 2 , wherein the first emission wavelength is in a range of from 420 nm and 460 nm and the second emission wavelength is in a range of from 400 nm and 420 nm.
5 . The LED die of claim 2 , further comprising a third p-n junction on the second p-n junction, the second p-n junction, the third p-n junction and the second p-n junction separated by a second tunnel junction, and the third p-n junction comprising a third n-type layer in contact with the second tunnel junction and on a third multiple quantum well, the third multiple quantum well on a third p-type layer.
6 . The LED die of claim 5 , wherein the third p-n junction has a third emission wavelength in a range of from 400 nm to 500 nm, and the third emission wavelength is different from the first emission wavelength and from the second emission wavelength by at least 5 nm.
7 . The LED die of claim 6 , wherein the first emission wavelength is in a range of from 400 nm and 420 nm, the second emission wavelength is in a range of from 420 nm and 460 nm, and the third emission wavelength is in a range of from 460 nm to 500 nm.
8 . The LED die of claim 1 , wherein the metal contact comprises one or more of a cathode layer or an anode layer.
9 . The LED die of claim 1 , wherein the wavelength converting layer comprises phosphor.
10 . The LED die of claim 1 , further comprising a sub-mount.
11 . The LED die of claim 1 , wherein the first n-type layer and the second n-type layer independently comprise one or more of gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), gallium aluminum nitride (GaAlN), gallium indium nitride (GaInN), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), indium gallium nitride (InGaN), indium aluminum nitride (InAlN), and the like.
12 . The LED die of claim 1 , further comprising a via extending from the first n-type layer of the first p-n junction to the second p-type layer of the second p-n junction.
13 . The LED die of claim 1 , further comprising a bonding metal layer.
14 . A method of manufacturing a light-emitting diode (LED) die, the method comprising:
epitaxially growing a first p-n junction and a second p-n junction on an epitaxial wafer, the first p-n junction and the second p-n junction separated by a tunnel junction, the first p-n junction comprising a first p-type layer on a first multiple quantum well, and the first multiple quantum well on a first n-type layer, the second p-n junction comprising a second n-type layer in contact with the tunnel junction and on a second multiple quantum well, the second multiple quantum well on a second p-type layer;
forming a wavelength converting layer surrounding the first p-n junction and the second p-n junction; and
forming at least one metal contact on one or more of the first n-type layer or the second p-type layer,
wherein the first p-n junction has a first emission wavelength in a range of from 400 nm to 500 nm and wherein the second p-n junction has a second emission wavelength in a range of from 400 nm to 500 nm, the first emission wavelength different from the second emission wavelength by at least 5 nm.
15 . The method of claim 14 , wherein the metal contact comprises one or more of a cathode layer or an anode layer.
16 . The method of claim 14 , further comprising mounting the LED die to a sub-mount.
17 . The method of claim 14 , further comprising forming a dielectric layer on the LED die.
18 . The method of claim 14 , further comprising forming a bonding metal layer.
19 . A method of manufacturing thin film flip chip (TFFC) die, the method comprising:
sequentially forming a first p-n junction and a second p-n junction on an epitaxial wafer to form an epitaxial stack, the first p-n junction and the second p-n junction separated by a tunnel junction, the first p-n junction comprising a first p-type layer on a first multiple quantum well, and the first multiple quantum well on a first n-type layer, the second p-n junction comprising a second n-type layer in contact with the tunnel junction and on a second multiple quantum well, the second multiple quantum well on a second p-type layer;
forming a wavelength converting layer surrounding the first p-n junction and the second p-n junction;
dry etching the epitaxial stack to form a via;
conformally depositing a dielectric layer in the via;
removing a portion of the dielectric layer to form contact openings;
depositing one or more of an anode layer and a cathode layer in the contact openings;
depositing a bonding metal layer on one or more of the anode layer or the cathode layer;
singulating the thin film flip chip (TFFC) die; and
bonding the thin film flip chip (TFFC) die to a sub-mount.
20 . The method of claim 19 , wherein the wavelength converting layer comprises phosphor.
21 . The LED die of claim 12 , wherein the dielectric layer conformally lining the via and defining opposing sidewalls of the via.
22 . The LED die of claim 21 , wherein the first metal contact is along the sidewall of the via on the dielectric layer.