Display panel, electronic apparatus including the display panel, and method of manufacturing the display panel

1 . A display panel comprising:

a substrate including an opening area, a display area surrounding at least a portion of the opening area, an intermediate area between the opening area and the display area, and a peripheral area outside the display area;

a first dam in the peripheral area and surrounding the display area;

a second dam in the peripheral area and outside the first dam;

a power supply line in the peripheral area and defining a notch overlapping the first dam and the second dam; and

a first inorganic encapsulation layer in the display area, the intermediate area, and the peripheral area to cover the first dam and the second dam,

wherein a portion of a boundary of the notch between the first dam and the second dam is in direct contact with the first inorganic encapsulation layer.

2 . The display panel of claim 1 , further comprising a metal pattern in the peripheral area and overlapping the notch, wherein the metal pattern is spaced apart from the power supply line.

3 . The display panel of claim 1 , wherein the notch includes a first boundary, a second boundary, and a third boundary, wherein the first boundary extends from the first dam to the second dam, the second boundary faces the first boundary, and the third boundary connects the first boundary and the second boundary to each other, and wherein the third boundary overlaps the first dam.

4 . The display panel of claim 1 , further comprising:

an organic encapsulation layer on the first inorganic encapsulation layer; and

a second inorganic encapsulation layer on the organic encapsulation layer,

wherein an end of the organic encapsulation layer is on the first dam.

5 . The display panel of claim 1 , further comprising:

a first organic insulating layer in the intermediate area and defining a first groove surrounding the opening area;

a metal layer on the first organic insulating layer and including a tip extending in a direction from an upper surface of the first organic insulating layer to a center of the first groove; and

a second organic insulating layer on the metal layer.

6 . The display panel of claim 5 , further comprising

a light-emitting diode in the display area and including a pixel electrode, an opposite electrode, and an intermediate layer between the pixel electrode and the opposite electrode,

wherein the intermediate layer includes a first portion and a second portion spaced apart and separated from each other by the tip.

7 . An electronic apparatus comprising:

a display panel including a substrate including an opening area, a display area surrounding at least a portion of the opening area, an intermediate area between the display area and the opening area, and a peripheral area outside the display area; and

a component overlapping the opening area of the display panel,

wherein the display panel further includes:

a first dam in the peripheral area and surrounding the display area;

a second dam in the peripheral area and outside the first dam;

a power supply line in the peripheral area and defining a notch overlapping the first dam and the second dam; and

a first inorganic encapsulation layer in the display area, the intermediate area, and the peripheral area to cover the first dam and the second dam,

wherein a portion of a boundary of the notch between the first dam and the second dam is in direct contact with the first inorganic encapsulation layer.

8 . The electronic apparatus of claim 7 , further comprising a metal pattern in the peripheral area and overlapping the notch, wherein the metal pattern is spaced apart from the power supply line.

9 . The electronic apparatus of claim 7 , wherein the notch includes a first boundary, a second boundary, and a third boundary, wherein the first boundary extends from the first dam to the second dam, the second boundary faces the first boundary, and the third boundary connects the first boundary and the second boundary to each other, and wherein the third boundary overlaps the first dam.

10 . The electronic apparatus of claim 7 , further comprising:

an organic encapsulation layer on the first inorganic encapsulation layer; and

a second inorganic encapsulation layer on the organic encapsulation layer,

wherein an end of the organic encapsulation layer is on the first dam.

11 . The electronic apparatus of claim 7 , further comprising:

a first organic insulating layer in the intermediate area and defining a first groove surrounding the opening area;

a metal layer on the first organic insulating layer and including a tip extending in a direction from an upper surface of the first organic insulating layer to a center of the first groove; and

a second organic insulating layer on the metal layer.

12 . The electronic apparatus of claim 11 , further comprising a light-emitting diode in the display area and including a pixel electrode, an opposite electrode, and an intermediate layer between the pixel electrode and the opposite electrode,

wherein the intermediate layer includes a first portion and a second portion spaced apart and separated from each other by the tip.

13 . A method of manufacturing a display panel, the method comprising:

preparing a substrate including an opening area, a display area surrounding at least a portion of the opening area, an intermediate area between the opening area and display area, and a peripheral area outside the display area;

forming a first dam, a second dam, a power supply line, and an organic bridge in the peripheral area, wherein the first dam surrounds the display area, the second dam is outside the first dam, the power supply line defines a notch overlapping the first dam and the second dam, and the organic bridge covers a portion of a boundary of the notch located between the first dam and the second dam;

forming a sacrificial layer to cover the first dam, the second dam, and the organic bridge;

removing a portion of the sacrificial layer overlapping the organic bridge;

removing the organic bridge; and

removing the sacrificial layer.

14 . The method of claim 13 , wherein the organic bridge connects the first dam and the second dam to each other.

15 . The method of claim 13 , further comprising forming a first inorganic encapsulation layer in the display area, the intermediate area, and the peripheral area to cover the first dam and the second dam,

wherein the portion of the boundary of the notch located between the first dam and the second dam is in direct contact with the first inorganic encapsulation layer.

16 . The method of claim 13 , further comprising, before the forming of the sacrificial layer:

forming a first organic insulating layer in the intermediate area;

forming a metal layer on the first organic insulating layer, wherein the metal layer defines a first hole surrounding the opening area; and

forming a second organic insulating layer on the metal layer,

wherein the second organic insulating layer defines a first sub-hole overlapping the first hole.

17 . The method of claim 16 , wherein, in the forming of the sacrificial layer, the sacrificial layer is formed on the second organic insulating layer and the first organic insulating layer exposed through the first sub-hole.

18 . The method of claim 16 , wherein, in the removing of the portion of the sacrificial layer overlapping the organic bridge, a portion of the sacrificial layer overlapping the first hole is simultaneously removed.

19 . The method of claim 16 , wherein, in the removing of the organic bridge, a portion of the first organic insulating layer overlapping the first hole is simultaneously removed, and a first groove surrounding the opening area is formed.

20 . The method of claim 19 , wherein the metal layer forms a tip extending in a direction from an upper surface of the first organic insulating layer to a center of the first groove.