Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.
1 . An apparatus for manufacturing a semiconductor device, the apparatus comprising:
a carrier configured to transfer a substrate;
a rail unit including a driving rail extending in a first direction that the carrier moves and a stopper on a side of the driving rail in a second direction crossing the first direction; and
a maintenance lift configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the carrier from the rail unit,
wherein the maintenance lift is configured to ascend in the third direction toward the driving rail, and
wherein the maintenance lift is configured to descend in the third direction to contact the stopper to move the stopper from a closed state to an open state.
2 . The apparatus of claim 1 , wherein the rail unit further includes a position adjustment block configured to adjust a position where the stopper and the maintenance lift are in contact,
the maintenance lift includes a position adjustment pin configured to adjust a contact position with the stopper, and
the position adjustment pin is received at the position adjustment block as the maintenance lift moves in the first direction.
3 . The apparatus of claim 2 , wherein the position adjustment block includes a concave portion recessed in the first direction, and
the position adjustment pin is received in the concave portion as the maintenance lift moves in the first direction.
4 . The apparatus of claim 2 , wherein the maintenance lift further includes a stopper open block configured to open the stopper in contact with the stopper, and a stopper open block support supporting the stopper open block, and
as the maintenance lift descends in the third direction, the stopper open block contacts the stopper to open the stopper.
5 . The apparatus of claim 1 , wherein the maintenance lift includes a first sensor configured to sense a height when ascending in the third direction and a second sensor configured to sense a height when descending in the third direction.
6 . The apparatus of claim 1 , wherein, when the stopper and the maintenance lift are in contact with each other, the maintenance lift is configured to remove the carrier from the rail unit.
7 . The apparatus of claim 1 , wherein the rail unit is further configured to support a cable supplying a power source to the carrier, and the rail unit further comprises a stopper support configured to support the stopper on a side of the driving rail.
8 . The apparatus of claim 1 , wherein the maintenance lift further includes a first frame configured to move in the third direction, a second frame supporting the first frame, and a wheel below the second and configured to move the first frame in the first direction, wherein the second frame is configured to be fixed in place.
9 . The apparatus of claim 1 , further comprising a first controller configured to control movement of the maintenance lift.
10 . The apparatus of claim 1 , further comprising a second controller configured to control movement of the carrier.
11 . An apparatus for maintenance and repair of equipment in an apparatus for manufacturing a semiconductor device, the apparatus comprising:
a ceiling-mounted motor configured to transfer a carrier in which a substrate is accommodated;
a rail system including a driving rail extending in a first horizontal direction that the ceiling-mounted motor moves the carrier, a position adjustment block at an end portion of the driving rail in the first horizontal direction and first and second stoppers on opposite sides of the driving rail to face each other in a second horizontal direction crossing the first horizontal direction;
a maintenance lift configured to remove the carrier from the rail system and including a position adjustment pin and a stopper open block; and
a controller configured to control movement of the maintenance lift,
wherein the position adjustment pin is received at the position adjustment block in the first horizontal direction with the stopper open block being farther along the driving rail than the position adjustment pin in the first horizontal direction and the stopper open block moves in a third direction perpendicular to the first and second horizontal directions to contact the first and second stoppers.
12 . The apparatus of claim 11 , wherein the position adjustment pin moves in the first horizontal direction to be received at the position adjustment block.
13 . The apparatus of claim 11 , wherein the stopper open block descends in the third direction to open the first and second stoppers.
14 . The apparatus of claim 11 , wherein the maintenance lift further includes a first sensor configured to sense an ascending height in the third direction and a second sensor configured to sense a descending height in the third direction.
15 . The apparatus of claim 11 , wherein the controller is configured to control movement of the maintenance lift in the first and second horizontal directions.
16 . The apparatus of claim 11 , wherein the controller is configured to control movement of the maintenance lift in the third direction.
17 . A method for manufacturing a semiconductor device using an apparatus for manufacturing a semiconductor device, which comprises a rail unit including a stopper and a position adjustment block, a carrier for driving along a ceiling surface and the rail unit, and a maintenance lift for moving the carrier from the ceiling surface to a bottom surface, the method comprising:
moving the maintenance lift to a first horizontal point where the carrier is positioned;
ascending the maintenance lift toward the ceiling surface in a vertical direction until the maintenance lift is sensed by a first sensor;
moving the maintenance lift to a second horizontal point spaced apart from the first horizontal point in a first horizontal direction;
descending the maintenance lift toward the bottom surface in the vertical direction until the maintenance lift is sensed by a second sensor;
positioning the maintenance lift to correspond to an upper portion of the position adjustment block;
descending the maintenance lift so that the maintenance lift and the stopper are in contact with each other to open the stopper; and
removing the carrier from the rail unit using the maintenance lift.
18 . The method of claim 17 , further comprising controlling horizontal movement of the maintenance lift.
19 . The method of claim 17 , further comprising controlling vertical movement of the maintenance lift.
20 . The method of claim 17 , further comprising:
checking the stopper is open by contact between the stopper and the maintenance lift before removing the carrier from the rail unit using the maintenance lift; and
ascending the maintenance lift so that the maintenance lift and the stopper are spaced apart from each other to close the stopper.