Chip treating method
A chip treating method includes a first tape affixing step of affixing a first tape to a circular wafer, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having an opening, and a chip disposing step of disposing chips on the first tape exposed in the opening.
1 . A chip treating method of disposing a chip in an opening of a ring frame having the opening in a center of the ring frame, through a tape, the chip treating method comprising:
a first tape affixing step of affixing a first tape to a wafer;
after the first tape affixing step, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having the opening and exposing the first tape in the opening; and
a chip disposing step of disposing the chip on the first tape exposed in the opening of the ring frame unit.
2 . The chip treating method according to claim 1 , further comprising:
after the chip disposing step, a second tape affixing step of affixing a second tape on a side where the chip is disposed, in such a manner as to cover the ring frame of the ring frame unit, thereby clamping the ring frame between the first tape and the second tape in a sandwiching manner; and
a chip transferring step of peeling off the first tape to transfer the chip onto the second tape.
3 . The chip treating method according to claim 2 , further comprising:
a processing step of processing the chip, after the chip transferring step.
4 . The chip treating method according to claim 3 , wherein the processing step is a step of carrying out a grinding process of grinding the chip.
5 . The chip treating method according to claim 1 , wherein a blank material of the wafer and a blank material of the chip are the same.
6 . The chip treating method according to claim 1 , wherein, in the ring frame unit forming step, a cutting blade or a laser beam is positioned along an outline of the opening to be formed, and the outline is cut to form the opening.
7 . The chip treating method according to claim 1 , further comprising:
a processing step of processing the chip, after the chip disposing step.
8 . The chip treating method according to claim 7 , wherein the processing step is a step of carrying out a grinding process of grinding the chip.
9 . The chip treating method according to claim 1 , wherein, in the ring frame unit forming step, a part of the first tape corresponding to the central part of the wafer is irradiated with ultraviolet rays.