Semiconductor device structure with conductive via structure and method for forming the same
A method for forming a semiconductor device structure is provided. The method includes providing a conductive structure. The method includes forming a first dielectric layer over the conductive structure. The method includes forming a conductive via structure that passes through the first dielectric layer. The conductive via structure is over and connected to the conductive structure, the conductive via structure has a first portion and a second portion over the first portion, and a first overall diffusion rate of the second portion in the first dielectric layer is lower than a second overall diffusion rate of the first portion in the first dielectric layer. The method includes forming a second dielectric layer over the conductive via structure and the first dielectric layer. The method includes forming a conductive line that passes through the second dielectric layer.
1 . A method for forming a semiconductor device structure, comprising:
providing a conductive structure;
forming a first dielectric layer over the conductive structure;
forming a conductive via structure passing through the first dielectric layer, wherein the conductive via structure is over and connected to the conductive structure, the conductive via structure has a first portion and a second portion over the first portion, and a first overall diffusion rate of the second portion in the first dielectric layer is lower than a second overall diffusion rate of the first portion in the first dielectric layer, wherein a first resistance of the first portion of the conductive via structure is different from a second resistance of the second portion of the conductive via structure;
forming a second dielectric layer over the conductive via structure and the first dielectric layer; and
forming a conductive line passing through the second dielectric layer, wherein the conductive line is over and connected to the conductive via structure.
2 . The method for forming the semiconductor device structure as claimed in claim 1 , wherein the second portion comprises a conductive layer and a barrier layer surrounding the conductive layer.
3 . The method for forming the semiconductor device structure as claimed in claim 2 , wherein the barrier layer is between the conductive layer and the first dielectric layer.
4 . The method for forming the semiconductor device structure as claimed in claim 3 , wherein the forming of the conductive via structure passing through the first dielectric layer comprises:
partially removing the first dielectric layer to form a through hole in the first dielectric layer, wherein the through hole exposes a third portion of the conductive structure;
performing a selective deposition process over the third portion of the conductive structure to form the first portion of the conductive via structure;
forming the barrier layer in the through hole and covering an inner wall of the through hole; and
filling the through hole with the conductive layer, wherein the conductive layer is over the first portion of the conductive via structure.
5 . The method for forming the semiconductor device structure as claimed in claim 4 , wherein the forming of the barrier layer in the through hole and covering the inner wall of the through hole comprises:
forming a sacrificial layer over the first portion of the conductive via structure;
depositing a barrier material layer in the through hole to cover the inner wall of the through hole and the sacrificial layer; and
removing the sacrificial layer and a fourth portion of the barrier material layer over the sacrificial layer to form an opening in the barrier material layer, wherein the opening exposes the first portion of the conductive via structure.
6 . The method for forming the semiconductor device structure as claimed in claim 3 , wherein the barrier layer is further between the conductive layer and the first portion of the conductive via structure.
7 . The method for forming the semiconductor device structure as claimed in claim 6 , wherein the forming of the conductive via structure passing through the first dielectric layer comprises:
partially removing the first dielectric layer to form a through hole in the first dielectric layer, wherein the through hole exposes a third portion of the conductive structure;
performing a selective deposition process over the third portion of the conductive structure to form the first portion of the conductive via structure;
depositing the barrier layer in the through hole to cover an inner wall of the through hole and the first portion of the conductive via structure; and
filling the through hole with the conductive layer, wherein the conductive layer is over the barrier layer.
8 . The method for forming the semiconductor device structure as claimed in claim 1 , wherein the forming of the conductive via structure passing through the first dielectric layer comprises:
partially removing the first dielectric layer to form a through hole in the first dielectric layer, wherein the through hole exposes a third portion of the conductive structure;
performing a first selective deposition process over the third portion of the conductive structure to form the first portion of the conductive via structure; and
performing a second selective deposition process over the first portion of the conductive via structure to form the second portion of the conductive via structure.
9 . The method for forming the semiconductor device structure as claimed in claim 8 , wherein the first resistance of the first portion of the conductive via structure is lower than the second resistance of the second portion of the conductive via structure.
10 . The method for forming the semiconductor device structure as claimed in claim 8 , wherein the second portion of the conductive via structure comprises molybdenum.
11 . A method for forming a semiconductor device structure, comprising:
providing a conductive structure;
forming a first dielectric layer over the conductive structure;
forming a conductive via structure passing through the first dielectric layer, wherein the conductive via structure is over and connected to the conductive structure, the conductive via structure has a first portion and a second portion over the first portion, and a first overall diffusion rate of the first portion in the first dielectric layer is lower than a second overall diffusion rate of the second portion in the first dielectric layer;
forming a second dielectric layer over the conductive via structure and the first dielectric layer; and
forming a conductive line passing through the second dielectric layer, wherein the conductive line is over and connected to the conductive via structure.
12 . The method for forming the semiconductor device structure as claimed in claim 11 , wherein the first portion comprises a conductive layer and a barrier layer surrounding the conductive layer.
13 . The method for forming the semiconductor device structure as claimed in claim 12 , wherein the barrier layer is between the conductive layer and the first dielectric layer.
14 . The method for forming the semiconductor device structure as claimed in claim 13 , wherein the barrier layer is further between the conductive layer and the conductive structure.
15 . The method for forming the semiconductor device structure as claimed in claim 11 , wherein the forming of the conductive via structure passing through the first dielectric layer comprises:
partially removing the first dielectric layer to form a through hole in the first dielectric layer, wherein the through hole exposes a third portion of the conductive structure;
performing a first selective deposition process over the third portion of the conductive structure to form the first portion of the conductive via structure; and
performing a second selective deposition process over the first portion of the conductive via structure to form the second portion of the conductive via structure, wherein the first portion and the second portion are made of different materials.
16 . A semiconductor device structure, comprising:
a conductive structure;
a first dielectric layer over the conductive structure;
a conductive via structure over and connected to the conductive structure, wherein the conductive via structure passes through the first dielectric layer, the conductive via structure has a first portion and a second portion over the first portion, and a first overall diffusion rate of the second portion in the first dielectric layer is lower than a second overall diffusion rate of the first portion in the first dielectric layer, wherein a first resistance of the first portion of the conductive via structure is lower than a second resistance of the second portion of the conductive via structure;
a second dielectric layer over the conductive via structure and the first dielectric layer; and
a conductive line over and connected to the conductive via structure and passing through the second dielectric layer.
17 . The semiconductor device structure as claimed in claim 16 , wherein the second portion comprises a conductive layer and a barrier layer surrounding the conductive layer.
18 . The semiconductor device structure as claimed in claim 17 , wherein the barrier layer is between the conductive layer and the first dielectric layer.
19 . The semiconductor device structure as claimed in claim 18 , wherein the barrier layer is further between the conductive layer and the first portion of the conductive via structure.
20 . The semiconductor device structure as claimed in claim 16 , wherein the first portion of the conductive via structure is thicker than the second portion of the conductive via structure.