Semiconductor package and method

1 . A device comprising:

a molding compound;

an integrated circuit die encapsulated in the molding compound, the integrated circuit die comprising a die connector;

a first conductive pillar on and electrically coupled to the die connector; and

a first conductive via on the die connector and around the first conductive pillar, wherein bottom surfaces of the first conductive pillar and the first conductive via are coplanar.

2 . The device of claim 1 , wherein the first conductive pillar is taller than the first conductive via.

3 . The device of claim 1 , further comprising:

a first dielectric layer over the molding compound; and

a second dielectric layer over the first dielectric layer, the first conductive pillar being in the first and second dielectric layers.

4 . The device of claim 3 , further comprising:

a third dielectric layer over the second dielectric layer; and

a second conductive pillar in the third dielectric layer, the second conductive pillar contacting the first conductive pillar.

5 . The device of claim 4 , wherein a top surface of the first conductive pillar is disposed further from the die connector than the top surface of the second dielectric layer.

6 . The device of claim 4 , further comprising:

a second conductive via around the second conductive pillar, the second conductive via being in the third dielectric layer.

7 . The device of claim 6 , further comprising:

a fourth dielectric layer between the second and third dielectric layers, the second conductive pillar and the second conductive via being in the fourth dielectric layer.

8 . The device of claim 6 , further comprising:

an integrated passive device (IPD) coupled to the second conductive via.

9 . The device of claim 6 , wherein the second conductive via is around at least a portion of the first conductive pillar.

10 . The device of claim 6 , further comprising:

a seed layer on the first conductive via, the seed layer disposed between a first conductive material of the first conductive via and a second conductive material of the second conductive via.

11 . A device comprising:

an integrated circuit die encapsulated in a molding compound, the integrated circuit die comprising a die connector;

a through via adjacent the integrated circuit die; and

a redistribution structure over the integrated circuit die, the molding compound, and the through via, the redistribution structure electrically connected to the integrated circuit die and the through via, the redistribution structure comprising:

a first dielectric layer over the molding compound;

a second dielectric layer over the first dielectric layer; and

a first conductive pillar in the second dielectric layer and the first dielectric layer, the first conductive pillar physically contacting the die connector; and

a first conductive via around the first conductive pillar, the first conductive via extending through the second dielectric layer and the first dielectric layer.

12 . The device of claim 11 , wherein the first conductive pillar has a greater height than the first conductive via.

13 . The device of claim 11 , wherein a top surface of the first conductive pillar is disposed further from the die connector than the top surface of the second dielectric layer.

14 . The device of claim 11 , further comprising:

a third dielectric layer over the second dielectric layer; and

a second conductive pillar in the third dielectric layer, the second conductive pillar contacting the first conductive pillar.

15 . The device of claim 14 , further comprising:

a second conductive via around the second conductive pillar, the second conductive via extending through the third dielectric layer.

16 . The device of claim 15 , further comprising:

a seed layer on the first conductive via, the seed layer disposed between a first conductive material of the first conductive via and a second conductive material of the second conductive via.

17 . A method comprising:

encapsulating an integrated circuit die in a molding compound, the integrated circuit die having a die connector;

depositing a first dielectric layer over the molding compound;

patterning a first opening through the first dielectric layer exposing the die connector of the integrated circuit die;

depositing a first seed layer over the first dielectric layer and in the first opening;

plating a first conductive pillar extending through the first dielectric layer on the first seed layer;

depositing a second dielectric layer over the first dielectric layer;

patterning a second opening in the second dielectric layer, the second opening exposing the first dielectric layer;

depositing a second seed layer over the second dielectric layer, in the second opening, and on the first dielectric layer; and

plating a first conductive via on the second seed layer, the first conductive via being around the first conductive pillar.

18 . The method of claim 17 , wherein the first seed layer is deposited on sidewalls and a top surface of the first conductive pillar.

19 . The method of claim 17 , further comprising:

depositing a third dielectric layer over the second dielectric layer;

patterning a third opening in the third dielectric layer, the third opening exposing the first conductive via;

forming a second conductive pillar in the third opening on the first conductive pillar;

depositing a fourth dielectric layer over the third dielectric layer;

patterning a fourth opening in the fourth dielectric layer, the fourth opening exposing the third opening; and

forming a second conductive via around the second conductive pillar in the third opening and the fourth opening.

20 . The method of claim 19 , wherein the second conductive via is further formed around the first conductive pillar.