Substrate structure
A substrate structure is provided, in which an insulator encapsulates a conductive pillar that is a single solid pillar body, and at least one wiring layer electrically connected to the conductive pillar is arranged on the insulator. Therefore, the conductive pillar is designed as a single solid pillar body to meet the requirements of thin lines, fine spacing and high-density contacts.
1 . A substrate structure comprising:
a conductive pillar being a single solid pillar body formed by electroplating and having a first end surface and a second end surface opposite to each other;
an insulator encapsulating the conductive pillar, wherein the insulator has a first surface and a second surface opposite to each other, so that the first end surface of the conductive pillar is flush with the first surface of the insulator, and the second end surface of the conductive pillar is free from being connected to the second surface; and
a wiring layer formed on the first surface and/or the second surface of the insulator to electrically connect the conductive pillar, wherein the wiring layer comprises:
a first part of a circuit portion, a second part of the circuit portion, and a conductor disposed on the first surface and/or the second surface of the insulator, wherein the first part of the circuit portion is coupled to the conductive pillar and the conductor, and the second part of the circuit portion is separated from the conductive pillar, the first part of the circuit portion, and the conductor; and
a covering portion covering the first part of the circuit portion, the second part of the circuit portion, and the conductor, wherein the covering portion is a dielectric body containing glass fiber.
2 . The substrate structure of claim 1 , wherein the insulator is a dielectric body without glass fiber.
3 . The substrate structure of claim 1 , wherein the wiring layer is disposed on the first surface of the insulator, the first part and the second part of the circuit portion are disposed on the first surface, and the conductor is disposed on the first part of the circuit portion.
4 . The substrate structure of claim 3 , wherein the conductor is in a pillar shape.
5 . The substrate structure of claim 3 , wherein the first part of the circuit portion is partially coupled to the first end surface of the conductive pillar.
6 . The substrate structure of claim 1 , wherein the wiring layer is disposed on the second surface of the insulator, the conductor is also disposed on the second surface, and the first part of the circuit portion is disposed on the conductor.
7 . The substrate structure of claim 6 , wherein the conductor is in a pillar shape.
8 . The substrate structure of claim 6 , wherein the first part of the circuit portion is partially embedded in the second surface of the insulator to couple to the second end surface of the conductive pillar.