Electronic package and manufacturing method thereof
An electronic package and a manufacturing method thereof are provided, in which a groove space for accommodating an electronic element is formed on a wiring structure, and an encapsulation layer is formed on the wiring structure to cover the electronic element. Via the design of the groove space, the overall thickness of the electronic package can be easily thinned to meet the demand for miniaturization.
1 . An electronic package, comprising:
a wiring structure having a groove space;
an encapsulation layer formed on the wiring structure, wherein the encapsulation layer has a first surface and a second surface opposing the first surface, and the second surface of the encapsulation layer is bonded to the wiring structure;
an electronic element embedded in the encapsulation layer and located in the groove space;
a plurality of conductive pillars embedded in the encapsulation layer and electrically connected to the wiring structure; and
a circuit structure formed on the first surface of the encapsulation layer and electrically connected to the plurality of conductive pillars and the electronic element.
2 . The electronic package of claim 1 , wherein the electronic element is in contact with the wiring structure.
3 . The electronic package of claim 1 , further comprising a plurality of conductive elements disposed on and electrically connected to the wiring structure.
4 . The electronic package of claim 1 , wherein the conductive pillars are located outside the groove space.
5 . The electronic package of claim 1 , further comprising a plurality of conductive elements disposed on and electrically connected to the circuit structure.
6 . A method of manufacturing an electronic package, comprising:
forming a conductive layer on part of a surface of a carrier board, and disposing an electronic element on other parts of the surface of the carrier board;
forming an encapsulation layer on the carrier board to cover the electronic element, wherein the encapsulation layer has a first surface and a second surface opposing the first surface, wherein the second surface of the encapsulation layer is bonded to the carrier board and the conductive layer, and the second surface of the encapsulation layer presents an uneven surface;
removing the carrier board and the conductive layer to expose the second surface of the encapsulation layer and the electronic element; and
forming a wiring structure on the second surface of the encapsulation layer and on the electronic element, wherein the wiring structure is formed with a groove space corresponding to the second surface, and the electronic element is located in the groove space.
7 . The method of claim 6 , wherein the electronic element is in contact with the wiring structure.
8 . The method of claim 6 , further comprising forming a plurality of conductive elements on the wiring structure, wherein the conductive elements are electrically connected to the wiring structure.
9 . The method of claim 6 , further comprising forming a plurality of conductive pillars on the conductive layer, wherein the encapsulation layer covers the conductive pillars, and the conductive pillars are electrically connected to the wiring structure.
10 . The method of claim 9 , wherein the plurality of conductive pillars are located outside the groove space.
11 . The method of claim 9 , further comprising forming a circuit structure on the first surface of the encapsulation layer, wherein the circuit structure is electrically connected to the plurality of conductive pillars and the electronic element.
12 . The method of claim 6 , further comprising forming a circuit structure on the first surface of the encapsulation layer, wherein the circuit structure is electrically connected to the electronic element.
13 . The method of claim 12 , further comprising forming a plurality of conductive elements on the circuit structure, wherein the conductive elements are electrically connected to the circuit structure.