Removable covers for air cavity surface mount packages
An air cavity surface mount package including a package base, one or more package interconnects disposed at least partially on the package base and a device cover that is temporarily adhered to the package base by an intentionally weak adhesive. The adhesive includes a threshold amount of low strength adhesive material to allow for the non-damaging removal of the device cover from the air cavity surface mount package.
1 . An air cavity surface mount package, comprising:
a package base;
one or more package interconnects disposed at least partially on a carrier substrate of the package base; and
a device cover temporarily adhered to the package base, wherein the device cover is temporarily adhered to the package base by an adhesive comprising a threshold amount of a low strength adhesive material, wherein the adhesive has an adhesive strength that is at least five times a weight of the air cavity surface mount package and less than a threshold force corresponding to a material strength or an attachment strength of the one or more package interconnects.
2 . The air cavity surface mount package of claim 1 , wherein the adhesive strength achieves a first threshold adhesive strength without exceeding a second threshold adhesive strength.
3 . The air cavity surface mount package of claim 2 , wherein the first threshold adhesive strength is based at least in part on weight of the air cavity surface mount package.
4 . The air cavity surface mount package of claim 2 , wherein the second threshold adhesive strength is based at least in part on the one or more package interconnects disposed at least partially on the carrier substrate.
5 . The air cavity surface mount package of claim 2 , wherein the air cavity surface mount package is electrically attached to a host printed circuit board (PCB) comprising at least one board interconnect and the second threshold adhesive strength is based at least in part on a material strength or an attachment strength of the at least one board interconnect.
6 . The air cavity surface mount package of claim 5 , wherein at least one of: (i) the threshold amount of low strength adhesive material, or (ii) a type of the low strength adhesive material is based at least in part on the weight of the air cavity surface mount package.
7 . The air cavity surface mount package of claim 5 , wherein at least one of: (i) the threshold amount of low strength adhesive material, or (ii) a type of the low strength adhesive material is based at least in part on a solder joint strength between at least one of the one or more package interconnects and the at least one board interconnect of the host PCB.
8 . The air cavity surface mount package of claim 5 , wherein at least one of: (i) the threshold amount of low strength adhesive material, or (ii) a type of the low strength adhesive material is based at least in part on an interconnect adhesive strength of the at least one board interconnect.
9 . The air cavity surface mount package of claim 8 , wherein the at least one of: (i) the threshold amount of low strength adhesive material, or (ii) the type of the low strength adhesive material is based at least in part on a package interconnect material strength of at least one package interconnect of the one or more package interconnects or a board interconnect material strength of the at least one board interconnect.
10 . The air cavity surface mount package of claim 1 , wherein the adhesive is disposed proximate to an exterior boundary of the package base.
11 . The air cavity surface mount package of claim 10 , wherein the threshold amount of low strength adhesive material comprises at least two portions of adhesive material, and wherein the at least two portions of adhesive material are symmetrically spaced at two boundary positions of the exterior boundary.
12 . A method comprising:
selecting an adhesive for temporarily adhering a device cover to a package base of an air cavity surface mount package;
applying the adhesive to temporarily adhere the device cover to the package base of the air cavity surface mount package;
providing the air cavity surface mount package for at least one of refinishing or circuit board assembly; and
removing the device cover from the package base.
13 . The method of claim 12 , wherein the air cavity surface mount package is provided for at least one of: (i) manual circuit board assembly, (ii) robotic circuit board assembly by a pick and place (PNP) machine, or (iii) robotic refinishing using a robotic refinishing machine.
14 . The method of claim 13 , wherein the air cavity surface mount package is a particular package type of a plurality of package types,
wherein selecting the adhesive comprises selecting, during a design phase, the adhesive for the air cavity surface mount package based at least in part on a weight of the air cavity surface mount package,
wherein applying the adhesive comprises applying, during an air cavity surface mount package manufacturing phase, the adhesive to temporarily adhere the device cover to the package base of the air cavity surface mount package, and
wherein the design phase is performed once for a plurality of manufacturing phases for a plurality of air cavity surface mount packages of the particular package type.
15 . The method of claim 14 , further comprising:
electrically attaching the air cavity surface mount package to a host printed circuit board.
16 . The method of claim 12 , further comprising:
reattaching the device cover to the package base.