Micro package structure

1 . A micro package structure, comprising:

a micro LED panel comprising an IC (integrated circuit) substrate and a micro LED array area formed on the IC substrate;

a top cover plane formed above the micro LED panel, wherein light emitted from the micro LED array area is transmitted upward to the top cover plane; and

a seal structure formed on the micro LED panel and below the top cover plane surrounding the micro LED array area;

wherein the IC substrate comprises a non-functional area around the micro LED array area, the seal structure is formed on a surface of the non-functional area, and the micro package structure further comprises a plurality of signal metal pads formed on a surface of the non-functional area; and

wherein the non-functional area comprises a connected area, the plurality of signal metal pads comprise a plurality of IO (input/output) metal pads and a plurality of dummy metal pads, and all of the IO metal pads and at least some of the dummy metal pads are formed on the connected area.

2 . The micro package structure according to claim 1 , wherein a distance between the micro LED panel and the top cover plane is not greater than a thickness of the micro LED panel or a thickness of the top cover plane.

3 . The micro package structure according to claim 2 , wherein a height of the seal structure is equal to a distance between the non-functional area and the top cover plane.

4 . The micro package structure according to claim 2 , wherein the distance between the micro LED panel and the top cover plane is in a range of 3 μm to 25 μm.

5 . The micro package structure according to claim 1 , wherein the seal structure comprises a light absorption material.

6 . The micro package structure according to claim 5 , wherein the light absorption material comprises a film forming agent.

7 . The micro package structure according to claim 6 , wherein the film forming agent comprises one or more of resin, polymer, or light-sensitive sensitizer.

8 . The micro package structure according to claim 1 , wherein the seal structure further comprises a sealant and a plurality of spacers between the micro LED panel and the top cover plane.

9 . The micro package structure according to claim 8 , wherein the sealant and the plurality of spacers are mixed.

10 . The micro package structure according to claim 8 , wherein a material of the sealant comprises a resin and a polymer.

11 . The micro package structure according to claim 10 , wherein the resin is epoxy resin and the polymer is silicone.

12 . The micro package structure according to claim 1 , wherein a sidewall of the seal structure is aligned with a sidewall of the top cover plane in a vertical direction.

13 . The micro package structure according to claim 1 , further comprising a dummy metal formed on the surface of the non-functional area.

14 . The micro package structure according to claim 1 , further comprising one or more bonding wires to connect the signal metal pads with an external circuit.

15 . The micro package structure according to claim 1 , further comprising one or more bonding wires to connect the signal metal pads with an external circuit, and a protective layer formed on a surface of the connected area and covering around a surface of the one or more bonding wires.

16 . The micro package structure according to claim 15 , further comprising an external circuit plane formed at a bottom of the micro LED panel with an extruded part extending outside of the micro LED panel.

17 . The micro package structure according to claim 16 , wherein the protective layer is further formed on a surface of the extruded part of the external circuit plane.