Semiconductor device including multi-dimension through silicon via structures for backside alignment and thermal dissipation
Some implementations described herein include systems and techniques for fabricating a multi-dimension through silicon via structure in a three-dimensional integrated circuit device. The multi-dimension through silicon via structure includes a first columnar structure having a first width and a second columnar structure including a second width that is greater relative to the first width. The first columnar structure may include a low electrical capacitance and be configured for electrical signaling within the three-dimensional integrated circuit device. The second columnar structure may be configured to provide power to integrated circuitry of the three-dimensional integrated circuit device and also be configured to conduct heat through the three-dimensional integrated circuit device for thermal management of the three-dimensional integrated circuit device. Additionally, a pattern including the second columnar structure may be used for alignment purposes.
1 . A method, comprising:
forming, within a substrate, a first columnar structure comprising a first set of properties related to a first rate of thermal conduction for a temperature difference;
forming, above the substrate, a seal ring structure interspersed within one or more dielectric layers, wherein the first columnar structure further comprises a first side adjacent to, or underlying, the seal ring structure; and
forming, adjacent to the first columnar structure, a second columnar structure comprising a second set of properties, related to a second rate of thermal conduction for the temperature difference that is lesser relative to the first rate of thermal conduction, and comprising a second top surface in, or above, an approximate plane that corresponds to an upper surface of the substrate, wherein the second columnar structure is adjacent to a second side of the first columnar structure that is opposite from the first side.
2 . The method of claim 1 , wherein forming the seal ring structure comprises:
forming the seal ring structure directly above the first columnar structure.
3 . The method of claim 1 , wherein forming the seal ring structure comprises:
forming the seal ring structure adjacent to the first columnar structure.
4 . The method of claim 1 , wherein forming the first columnar structure comprises:
forming the first columnar structure prior to forming integrated circuitry above the substrate.
5 . The method of claim 1 , wherein forming the first columnar structure comprises:
forming the first columnar structure subsequent to forming integrated circuitry above the substrate.
6 . The method of claim 1 , wherein forming the first columnar structure comprises:
forming the first columnar structure subsequent to forming the seal ring structure.
7 . The method of claim 1 , further comprising:
joining the substrate to another substrate using a direct alignment technique,
wherein the direct alignment technique includes using a vision system to detect the first columnar structure.
8 . A device, comprising:
a substrate;
one or more first dielectric layers above the substrate;
one or more second dielectric layers above the one or more first dielectric layers;
a seal ring structure interspersed with the one or more second dielectric layers;
one or more third dielectric layers above the one or more second dielectric layers;
a first columnar structure penetrating into the substrate adjacent to the seal ring structure and comprising:
a first side adjacent to the seal ring structure;
a first top surface above a first approximate plane,
wherein the first approximate plane corresponds to an upper surface of the substrate; and
a first set of properties related to a first rate of thermal conduction for a temperature difference; and
a second columnar structure penetrating into the substrate adjacent to a second side of the first columnar structure that is opposite the first side and comprising:
a second top surface in, or above, a second approximate plane,
wherein the second approximate plane corresponds to an upper surface of the one or more third dielectric layers; and
a second set of properties related to a second rate of thermal conduction for the temperature difference,
wherein the second rate of thermal conduction is lesser relative to the first rate of thermal conduction.
9 . The device of claim 8 , wherein the first top surface is in a third approximate plane corresponding to the upper surface of the one or more first dielectric layers.
10 . The device of claim 8 , wherein the first top surface is in, or above, the second approximate plane corresponding to the upper surface of the one or more third dielectric layers.
11 . The device of claim 8 , wherein the first columnar structure is included in a first row of columnar structures adjacent to integrated circuitry, and
wherein the second columnar structure is included in a second row of columnar structures above the integrated circuitry.
12 . The device of claim 8 , wherein from a top view perspective the first columnar structure includes an approximately rectangular shape.
13 . The device of claim 8 , further comprising:
a pattern of columnar structures comprising a third columnar structure that penetrates the substrate,
wherein the pattern of columnar structures is configured to be detectable by a vision system of a semiconductor processing tool, and
wherein the third columnar structure comprises:
a width that is approximately equal to a width of the first columnar structure.
14 . A device, comprising:
a substrate;
a seal ring structure above the substrate;
a dielectric layer above the seal ring structure above the substrate;
a first columnar structure penetrating into the substrate adjacent to the seal ring structure and comprising:
a first top surface in a first approximate plane corresponding to an upper surface of the substrate;
a second columnar structure adjacent to a first side of the first columnar structure and penetrating into the substrate directly below the seal ring structure and comprising:
a second top surface in the first approximate plane; and
a third columnar structure penetrating into the substrate adjacent a second side of the first columnar structure that is opposite the first side and comprising:
a third top surface in, or above, a third approximate plane corresponding to an upper surface of the dielectric layer.
15 . The device of claim 14 , wherein the first columnar structure comprises:
a first width, and
wherein the second columnar structure comprises a second width that is approximately equivalent to the first width.
16 . The device of claim 14 , further comprising:
a metallization structure, and
wherein the third columnar structure is between the first columnar structure and the metallization structure.
17 . The device of claim 14 , wherein from a top view perspective one or more of the first columnar structure, the second columnar structure, or the third columnar structure includes an approximately round shape.
18 . The device of claim 14 , wherein the first columnar structure and/or the second columnar structure is connected to a power source providing power to the device, and
wherein a first electrical capacitance of the first columnar structure and/or a second electrical capacitance of the second columnar structure is greater relative to a third electrical capacitance of the third columnar structure.
19 . The device of claim 14 , wherein the first columnar structure comprises a first width, wherein the second columnar structure comprises a second width, and wherein the third columnar structure comprises a third width that is lesser relative to the first width and lesser relative to the second width.
20 . The device of claim 19 , wherein a ratio of a greater width corresponding to the first width, and/or the second width, to a lesser width corresponding to the third width is greater than or equal to approximately 5:3.