Methods of calibrating an ultrasonic characteristic on a wire bonding system
A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
1 . A method of calibrating an ultrasonic characteristic on a wire bonding system to be calibrated, the method comprising the steps of:
(a) determining a reference ultrasonic characteristic using reference response data from one or more reference wire bonding systems for formation of a wire bond;
(b) determining a reference non-stick ultrasonic characteristic using one or more reference wire bonding systems that results in a non-stick wire bond condition;
(c) determining a calibration non-stick ultrasonic characteristic, on the wire bonding system to be calibrated, that results in a non-stick wire bond condition; and
(d) determining an ultrasonic characteristic setpoint for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
2 . The method of claim 1 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding systems using application specific materials.
3 . The method of claim 2 wherein the application specific materials include at least one of a wire, a wire bonding tool, and a workpiece.
4 . The method of claim 1 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding systems using an application specific wire bonding program.
5 . The method of claim 1 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding systems using application specific wire bonding parameters.
6 . The method of claim 1 wherein the reference ultrasonic characteristic is an electrical current value configured to be applied to an ultrasonic transducer on a wire bonding system to form the wire bond.
7 . The method of claim 1 wherein step (b) includes determining the reference non-stick ultrasonic characteristic by incrementally adjusting an applied ultrasonic characteristic in wire bonding operations until the non-stick wire bond condition results.
8 . The method of claim 1 wherein step (c) includes determining the calibration non-stick ultrasonic characteristic by incrementally adjusting an applied ultrasonic characteristic in wire bonding operations until the non-stick wire bond condition results.
9 . The method of claim 1 wherein step (d) includes determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
10 . The method of claim 9 wherein step (d) includes determining the ultrasonic characteristic setpoint for the wire bonding system to be calibrated using the calibration factor.
11 . A method of calibrating an ultrasonic characteristic on a wire bonding system to be calibrated, the method comprising the steps of:
(a) determining a reference ultrasonic characteristic using reference response data from one or more reference wire bonding systems for formation of a wire bond;
(b) determining a reference unacceptable ultrasonic characteristic using one or more reference wire bonding systems that results in an unacceptable wire bond condition;
(c) determining a calibration unacceptable ultrasonic characteristic, on the wire bonding system to be calibrated, that results in an unacceptable wire bond condition; and
(d) determining an ultrasonic characteristic setpoint for the wire bonding system to be calibrated using the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
12 . The method of claim 11 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding systems using application specific materials.
13 . The method of claim 12 wherein the application specific materials include at least one of a wire type, a wire bonding tool type, and a workpiece.
14 . The method of claim 11 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding systems using an application specific wire bonding program.
15 . The method of claim 11 wherein step (a) includes determining the reference ultrasonic characteristic on the one or more reference wire bonding system using application specific wire bonding parameters.
16 . The method of claim 11 wherein the reference ultrasonic characteristic is an electrical current value configured to be applied to an ultrasonic transducer on a wire bonding system to form the wire bond.
17 . The method of claim 11 wherein step (b) includes determining the reference unacceptable ultrasonic characteristic by incrementally adjusting an applied ultrasonic characteristic in wire bonding operations until the unacceptable wire bond condition results.
18 . The method of claim 11 wherein step (c) includes determining the calibration unacceptable ultrasonic characteristic by incrementally reducing an applied ultrasonic characteristic in wire bonding operations until the unacceptable wire bond condition results.
19 . The method of claim 11 wherein step (d) includes determining a calibration factor for the wire bonding system to be calibrated using the reference unacceptable ultrasonic characteristic and the calibration unacceptable ultrasonic characteristic.
20 . The method of claim 11 wherein the unacceptable wire bond condition is a non-stick wire bond condition.
21 . The method of claim 11 wherein the unacceptable wire bond condition is a low shear strength wire bond condition.
22 . The method of claim 11 wherein the unacceptable wire bond condition is a low pull strength wire bond condition.
23 . The method of claim 11 wherein the unacceptable wire bond condition is an unacceptable level of wire bond deformation.
24 . The method of claim 19 wherein step (d) includes determining the ultrasonic characteristic setpoint for the wire bonding system to be calibrated using the calibration factor.