Apparatus and method to form ultrafine features on glass
The present invention relates to a method and apparatus for forming ultrafine features on a glass surface. The method and apparatus for forming ultrafine features on a glass surface are configured to directly pressurize a mold with a transmission unit or to pressurize the mold with a fluid using the transmission unit, so the mold may pressurize the glass surface with a uniform force.
1 . An apparatus forming ultrafine features on a glass surface, the apparatus comprising:
a lower support part;
a glass that is disposed above the lower support part;
a mold that is made of a transparent material covering an upper surface of the glass through which an infrared laser is transmitted;
a transmission unit that is made of a transparent material covering an upper surface of the mold through which an infrared laser is transmitted;
an upper support part that is coupled to an outer periphery of the transmission unit to support the transmission unit; and
a laser irradiation unit that irradiates an infrared laser to an upper portion of the transmission unit,
wherein the lower support part pressurizes the glass upward so that the upper surface of the glass is pressurized by the mold,
wherein the lower support part includes a third heating unit that heats the lower support part, and the upper support part includes a fourth heating unit that heats the upper support part, and
wherein the transmission unit is formed to be depressed upward so that the transmission unit is flattened during pressurizing the mold, so the upper surface of the mold is pressurized with a uniform force.
2 . The apparatus of claim 1 , wherein the upper support part protrudes upward from the transmission unit so that a groove is formed between the upper support part and the upper outer periphery of the transmission unit, and a support member is installed in the groove so that the upper support part pressurizes the upper outer periphery of the transmission unit.
3 . The apparatus of claim 1 , wherein the mold is made of any one of silicon (Si), diamond, germanium (Ge), zinc selenide (ZnSe), zinc sulfide (ZnS), gallium arsenide (GaAs), sodium chloride (NaCl), gallium bromide (KBr), barium fluoride (BaF2), or thallium bromoiodide (KRS-5), and the transmission unit is made of any one of silicon (Si), diamond, germanium (Ge), zinc selenide (ZnSe), zinc sulfide (ZnS), gallium arsenide (GaAs), sodium chloride (NaCl), gallium bromide (KBr), barium fluoride (BaF2), or thallium bromoiodide (KRS-5).