Encapsulant composition and film
An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator.
1 . An encapsulant composition, comprising:
20-45 parts by weight of a component (A), wherein the component (A) comprises a first compound (A-1) and a second compound (A-2), and the weight ratio of the first compound (A-1) to the second compound (A-2) is 9:1 to 3:7;
55-80 parts by weight of a component (B), wherein the component (B) is a non-modified inorganic powder or a modified inorganic powder, and the total weight of the component (A) and the component (B) is 100 parts by weight; and
a component (C), wherein the component (C) is an initiator, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100, wherein the first compound (A-1) has a structure represented by Formula (I) or Formula (II), and the second compound (A-2) is monoalkenyl aromatic compound
wherein R 1 and R 2 are independently hydrogen, fluorine, methyl group, fluoromethyl group, or ethyl group; R 3 , R 4 , R 5 and R 6 are independently fluorine, C 1-6 alkyl group, C 1-6 fluoroalkyl group, or C 2-6 terminal alkenyl group, and at least two of R 3 , R 4 , R 5 and R 6 are C 2-6 terminal alkenyl group; R 7 and R 8 are independently C 2-6 terminal alkenyl group, 2-vinylphenyl group, 3-vinylphenyl group, or 4-vinylphenyl group; R 9 and R 10 are independently fluorine, C 1-6 alkyl group, C 1-6 fluoroalkyl group, or C 2-6 terminal alkenyl group; a and b are independently 1, 2, 3, 4, or 5; c, d, e and f are independently 1, 2, 3, or 4.
2 . The encapsulant composition as claimed in claim 1 , wherein the non-modified inorganic powder is silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, or a combination thereof.
3 . The encapsulant composition as claimed in claim 1 , wherein the modified inorganic powder is a reaction product of an oxide and a modifier, wherein the oxide is silicon oxide, aluminum oxide, titanium oxide, or zirconium oxide, and the modifier is organosilane.
4 . The encapsulant composition as claimed in claim 1 , wherein the first compound (A-1) is
wherein R 1 and R 2 are independently hydrogen, fluorine, methyl group, fluoromethyl group, or ethyl group; R 3 , R 4 , R 5 and R 6 are independently fluorine, C 1-6 alkyl group, C 1-6 fluoroalkyl group, or C 2-6 terminal alkenyl group, and at least two of R 3 , R 4 , R 5 and R 6 are C 2-6 terminal alkenyl group; R 7 and R 5 are independently C 2-6 terminal alkenyl group, 2-vinylphenyl group, 3-vinylphenyl group, or 4-vinylphenyl group; R 9 and R 10 are independently fluorine, C 1-6 alkyl group, C 1-6 fluoroalkyl group, or C 2-6 terminal alkenyl group; a and b are independently 1, 2, 3, 4, or 5; and, c, d, e and f are independently 1, 2, 3, or 4.
5 . The encapsulant composition as claimed in claim 1 , wherein the second compound (A-2) is styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2,4-styrenemethylstyrene (2,4-dimethylstyrene), 2,4 diisopropylstyrene, 4-propylstyrene, 4-cyclohexylstyrene, 4-(p-methylphenyl)styrene, 2-tert-butylstyrene, 3-tert-butylstyrene, 4-tert-butylstyrene, N,N-dimethylaminoethylstyrene, 1-vinyl-5-hexylnaphthalene, N-(4-vinylbenzyl)-N,N-dimethylamine, 2-vinylpyridine, 4-ethenyl-1,2-dimethyl-benzene, 1-vinylnaphthalene, 1,1-diphenylethylene, 2-propenylbenzene, or a combination thereof.
6 . The encapsulant composition as claimed in claim 1 , wherein the initiator is a peroxide initiator.
7 . The encapsulant composition as claimed in claim 1 , further comprising a component (D), wherein the component (D) is a silane coupling agent, wherein the weight ratio of the component (D) to the component (A) is 1:100 to 5:100.
8 . The encapsulant composition as claimed in claim 1 , wherein the non-modified inorganic powder or the modified inorganic powder has an average particle size of 0.5 μm to 20 μm.
9 . The encapsulant composition as claimed in claim 1 , wherein the non-modified inorganic powder or the modified inorganic powder consists of a first powder (B-1) having a first average particle size and a second powder (B-2) having a second average particle size, wherein the first average particle size is greater than the second average particle size, and the ratio of the first average particle size to the second average particle size is 1.5 to 10.
10 . The encapsulant composition as claimed in claim 9 , wherein the weight ratio of the first powder (B-1) to the second powder (B-2) is 1:5 to 5:1.
11 . The encapsulant composition as claimed in claim 1 , wherein the component (A) further comprises a third compound (A-3), wherein the third compound (A-3) is a multialkenyl compound.
12 . The encapsulant composition as claimed in claim 11 , wherein the third compound (A-3) is divinylbenzene, trivinylbenzene, triallyl cyanurate, triallyl isocyanurate, di(ethylene glycol) divinyl ether, tetraallylsilane, polybutadiene, diallyl phthalate, 2,2-bis[3-allyl-4-(4-vinylbenzyl)phenyl]propane (AV-BPA), or a combination thereof.
13 . The encapsulant composition as claimed in claim 11 , wherein the weight ratio of the second compound (A-2) to the third compound (A-3) is 1:1 to 9:1.
14 . A film, comprising a cured product of the encapsulant composition as claimed in claim 1 .