Organic-inorganic adhesive composition, and gas barrier film comprising same
An organic-inorganic adhesive composition and a gas barrier film including the same are disclosed. The organic-inorganic adhesive composition includes: a silane compound including at least one functional group of a vinyl group, an acryloxy group, a methacryloxy group, or a combination thereof; an amine group-containing compound; an isocyanate-based compound; and an acid catalyst, wherein a pH of the organic-inorganic adhesive composition is from 5 to 8.
1 . A gas barrier film comprising:
a substrate;
an inorganic material gas barrier layer disposed on at least one surface of the substrate; and
an organic-inorganic adhesive layer, which is a cured layer derived from an organic-inorganic adhesive composition, on one surface of the inorganic material gas barrier layer, wherein the organic-inorganic adhesive composition comprises:
a silane compound comprising at least one functional group of a vinyl group, an acryloxy group, a methacryloxy group, or a combination thereof;
an amine group-containing compound;
an isocyanate-based compound;
an acid catalyst; and
a silane compound having an epoxy group,
wherein a pH of the organic-inorganic adhesive composition is from 5 to 8 and a weight ratio of the silane compound having an epoxy group to the silane compound comprising at least one functional group of a vinyl group, an acryloxy group, a methacryloxy group, or a combination thereof is from 1:1 to 1:100.
2 . The gas barrier film of claim 1 , wherein the amine group-containing compound increases the pH of the organic-inorganic adhesive composition from 2 to 6.
3 . The gas barrier film of claim 1 , wherein the organic-inorganic adhesive composition has a change in pH of 0.5 or less for 48 hours.
4 . The gas barrier film of claim 1 , wherein the silane compound comprises a C 1 -C 10 alkoxy silane compound.
5 . The gas barrier film of claim 1 , wherein a content of the silane compound is from 0.01 percent by weight (wt %) to 10 wt %, based on a total weight of the organic-inorganic adhesive composition.
6 . The gas barrier film of claim 1 , wherein the organic-inorganic adhesive composition is cured within 2 minutes at a temperature of 100° C. or less.
7 . The gas barrier film of claim 1 , further comprising an organic material layer on one surface of the organic-inorganic adhesive layer.
8 . The gas barrier film of claim 7 , wherein the organic-inorganic adhesive layer forms a radical bond with the organic material layer.
9 . The gas barrier film of claim 1 , wherein a thickness of the organic-inorganic adhesive layer is from 0.01 micrometers (μm) to 10 μm.
10 . The gas barrier film of claim 1 , wherein the gas barrier film reduces a water vapor transmission rate by 10% or more, as compared with a gas barrier film that does not comprise an organic-inorganic adhesive layer.