Resin composition and article made therefrom
A resin composition includes 100 parts by weight of a maleimide resin, 50 to 100 parts by weight of a maleic anhydride-modified polyolefin resin and 0.1 to 1.5 parts by weight of a free radical scavenger, wherein the maleimide resin has a structure of Formula (1), and the free radical scavenger includes o-methylhydroquinone, a nitroxide radical compound having a tetramethylpiperidine structure or a combination thereof. The resin composition may be used to make various articles, including a resin-coated copper, a resin film, a laminate or a printed circuit board, and one or more of the properties can be improved, including copper foil peeling strength, resin flow and 5° C. shelf life.
1 . A resin composition, comprising 100 parts by weight of a maleimide resin, 50 to 100 parts by weight of a maleic anhydride-modified polyolefin resin and 0.1 to 1.5 parts by weight of a free radical scavenger, wherein:
the maleimide resin has a structure of Formula (1):
wherein n is an integer of 1 to 10, and R 1 to R 4 are each independently hydrogen or a C1 to C3 alkyl group;
the free radical scavenger comprises o-methylhydroquinone, a nitroxide radical compound having a tetramethylpiperidine structure or a combination thereof.
2 . The resin composition of claim 1 , wherein the maleic anhydride-modified polyolefin resin comprises a maleic anhydride-adducted polybutadiene-styrene copolymer, a maleic anhydride-adducted polybutadiene or a combination thereof.
3 . The resin composition of claim 1 , wherein the nitroxide radical compound having a tetramethylpiperidine structure has a structure of Formula (2):
wherein R 5 is hydrogen, a C1 to C5 alkyl group, an amino group, a hydroxyl group, a keto group, a tetramethylpiperidine nitroxide radical-substituted phosphite ester group or a carboxyl group.
4 . The resin composition of claim 1 , further comprising inorganic filler, curing accelerator, flame retardant, solvent, silane coupling agent, coloring agent, toughening agent or a combination thereof.
5 . An article made from the resin composition of claim 1 , comprising a resin-coated copper, a resin film, a laminate or a printed circuit board.
6 . The article of claim 5 , having a copper foil peeling strength as measured by reference to IPC-TM-650 2.4.8 of greater than or equal to 4.0 lb/in.
7 . The article of claim 5 , having a resin flow as measured by reference to IPC-TM-650 2.3.17 of between 35.0% and 50.0%.
8 . The article of claim 5 , having a 5° C. shelf life of greater than or equal to 78 days.