Pressure-sensitive adhesive tape suitable for component cutting process
A pressure-sensitive adhesive tape suitable for component cutting process is provided. The pressure-sensitive adhesive tape includes a release film layer, an adhesive layer, and a support base layer that are stacked in sequence. Based on the adhesive layer having a total weight percent of 100 wt %, the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator. The adhesive layer has a first acid value before being exposed to an ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value.
1 . A pressure-sensitive adhesive tape, including:
a release film layer;
an adhesive layer formed on a surface of the release film layer, wherein the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator based on the adhesive layer having a total weight percent of 100 wt %; and wherein the acrylic resin has a chemical structure of the following formula (I),
formula (I); wherein n=3,000 to 5,000; and
a support base layer formed on a surface of the adhesive layer opposite to the release film layer;
wherein the adhesive layer has a first acid value before being exposed to a ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value:
wherein the first acid value is between 5 mg KOH/g and 20 mg KOH/g, and the second acid value is between 1 mg KOH/g and 4 mg KOH/g;
wherein a wavelength of the ultraviolet light is between 300 nm and 380 nm, an exposure energy of the ultraviolet light to the adhesive layer is between 100 mJ/cm 2 and 300 mJ/cm 2 , and an exposure time of the ultraviolet light to the adhesive layer is between 0.05 minutes to 5.0 minutes.
2 . The pressure-sensitive adhesive tape according to claim 1 , wherein the first acid value of the adhesive layer before being exposed to the ultraviolet light is between 10 mg KOH/g and 15 mg KOH/g, and the second acid value of the adhesive layer after being exposed to the ultraviolet light is between 1 mg KOH/g and 3 mg KOH/g.
3 . The pressure-sensitive adhesive tape according to claim 1 , wherein the release film layer has a first thickness ranging from 25 microns to 45 microns; wherein the release film layer is consisting of a polyester material, and the support base layer is consisting of a polyolefin material.
4 . The pressure-sensitive adhesive tape according to claim 1 , wherein the epoxy monomer in the adhesive layer is a reactive epoxy monomer with the following chemical structure:
5 . The pressure-sensitive adhesive tape according to claim 1 , wherein the hardener is an isocyanate hardener, and the initiator is a photoinitiator.
6 . The pressure-sensitive adhesive tape according to claim 1 , wherein in a component cutting process, the release film layer is configured to be torn off, and the adhesive layer is configured to be attached to a cutting substrate; wherein the cutting substrate is a printed circuit board, a ceramic substrate, a glass substrate, or a wafer; wherein, before the adhesive layer is exposed to the ultraviolet light, a first peeling force between the adhesive layer and the cutting substrate is greater than or equal to 10 N/inch.
7 . The pressure-sensitive adhesive tape according to claim 6 , wherein after the adhesive layer is exposed to the ultraviolet light, the epoxy monomer in the adhesive layer undergoes a crosslinking reaction, and the adhesive layer is formed to be an exposed adhesive layer; wherein a second peeling force between the exposed adhesive layer and the cutting substrate is smaller than or equal to 0.2 N/inch.
8 . The pressure-sensitive adhesive tape according to claim 7 , wherein the adhesive layer shrinks after the epoxy monomer undergoes the crosslinking reaction, so that a contact area between the exposed adhesive layer and the cutting substrate is reduced.