Adhesive sheet and electronic component
Provided are an adhesive sheet including an adhesive layer that contains a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more, and has a thickness variation of less than 10%, and an electronic component including an adhesive layer that contains a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more, and has a thickness variation of less than 10%.
1 . An adhesive sheet comprising:
an adhesive layer containing a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more and a thermoplastic resin having a glass transition temperature Tg of −50° C. or higher and 30° C. or lower, and having a thickness variation of less than 10%.
2 . The adhesive sheet according to claim 1 ,
wherein the adhesive layer further contains a thermosetting resin.
3 . The adhesive sheet according to claim 2 ,
wherein the thermosetting resin is an epoxy resin.
4 . The adhesive sheet according to claim 1 ,
wherein the adhesive layer further contains a compound containing a polyalkyleneimine chain and a polyester chain.
5 . The adhesive sheet according to claim 4 ,
wherein a proportion of the polyalkyleneimine chain in the compound is less than 5.0% by mass.
6 . The adhesive sheet according to claim 1 ,
wherein the average primary particle size of the FeCo-based magnetic powder is 30 nm or more and 100 nm or less.
7 . The adhesive sheet according to claim 1 ,
wherein the coercive force Hc of the FeCo-based magnetic powder is 400 Oe or more and 1500 Oe or less.
8 . The adhesive sheet according to claim 1 ,
wherein the thickness variation of the adhesive layer is 5% or more and less than 10%.
9 . An electronic component comprising:
an adhesive layer containing a FeCo-based magnetic powder having an average primary particle size of 100 nm or less and a coercive force Hc of 400 Oe or more and a thermoplastic resin having a glass transition temperature Tg of −50° C. or higher and 30° C. or lower, and having a thickness variation of less than 10%.
10 . The electronic component according to claim 9 ,
wherein the adhesive layer further contains a thermosetting resin.
11 . The electronic component according to claim 10 ,
wherein the thermosetting resin is an epoxy resin.
12 . The electronic component according to claim 9 ,
wherein the adhesive layer further contains a compound containing a polyalkyleneimine chain and a polyester chain.
13 . The electronic component according to claim 12 ,
wherein a proportion of the polyalkyleneimine chain in the compound is less than 5.0% by mass.
14 . The electronic component according to claim 9 ,
wherein the average primary particle size of the FeCo-based magnetic powder is 30 nm or more and 100 nm or less.
15 . The electronic component according to claim 9 ,
wherein the coercive force Hc of the FeCo-based magnetic powder is 400 Oe or more and 1500 Oe or less.
16 . The electronic component according to claim 9 ,
wherein the thickness variation of the adhesive layer is 5% or more and less than 10%.