Thermal treatment of component
An apparatus for thermal treatment of a component includes a heating portion and a downstream cooling portion, separated by a partition wall. The cooling portion has a nozzle for discharging a cooling fluid, with the nozzle being inclined toward the component and away from the heating portion. An outer wall of the nozzle, facing the heating portion, is arranged parallel to and spaced apart from the partition wall. This parallel arrangement forms a defined gap that guides entrained air, thereby achieving a sharply delimited thermal separation between the heating and cooling portion.
1 . An apparatus for thermal treatment of a component, which can be arranged in a component plane (E) in the apparatus, wherein the component plane (E) is spanned by a first direction (x) and a second direction (y) perpendicular to the first direction, the apparatus comprising a heating portion for heating a first region of the component, a cooling portion having a cooling means for cooling a second region of the component, wherein the cooling portion is downstream of the heating portion in the second direction (y), wherein the cooling means has a nozzle for discharging a cooling fluid onto the component, wherein the nozzle is oriented such that it drops in the second direction (y), and toward the component plane (E), and wherein the nozzle has a fluid channel having a nozzle opening, and a partition wall between the heating portion and the cooling portion, wherein an outer wall of the nozzle facing the heating portion is spaced apart from the partition wall and is oriented parallel to the partition wall in the second direction (y), wherein the outer wall of the nozzle facing the heating portion drops at least partially in the second direction (y) and towards the component plane (E).
2 . The apparatus of claim 1 , wherein the fluid channel has a straight portion upstream of the nozzle opening having a length (l g ) of at least 5 mm.
3 . The apparatus of claim 1 , further comprising a cover plate which is arranged in the cooling portion above the nozzle.
4 . The apparatus of claim 1 , further comprising a guide plate which is arranged in the cooling portion on a side of the nozzle facing away from the heating portion and parallel to the component plane (E).
5 . The apparatus of claim 4 , wherein an edge of the guide plate facing the nozzle is bent downward toward the component plane (E).
6 . The apparatus of claim 4 , wherein at least one spacer pin is arranged on the guide plate in order to hold the component at a distance from the guide plate.
7 . The apparatus of claim 1 , wherein the fluid channel has a uniform width (b g ) in a range of 0.1 to 3 mm in a portion upstream of the nozzle opening perpendicular to the first direction (x).
8 . The apparatus of claim 1 , wherein the nozzle is oriented at a first angle (α) defined between the component plane and the direction in which the cooling fluid is discharged from the nozzle in a range of 15 to 600 to the component plane (E), and/or wherein an outer wall of the nozzle facing the heating portion encloses a second angle (φ in a range of 15 to 60° with the component plane (E).