IP Library Granted Patent US 12668876
Granted Patent B2
US 12668876 · App. 18/209,026 · Granted Jun 30, 2026

Pump liner for process chamber

Inventors: Muhannad Mustafa (Milpitas, CA); Sanjeev Baluja (Campbell, CA)
Assignee: Applied Materials, Inc.
C23C16/45544
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12668876
App. No.
18/209,026
Granted
Jun 30, 2026
Kind
B2
Abstract

Embodiments of the present disclosure are related to directed to a pump liner for a process chamber. The pump liner is aligned with particular components in the process chamber so that there is an upper gap and a lower gap between the pump liner and the particular processing chamber components (e.g., an edge ring). The pump liner advantageously reduces side to side variation in temperature and gas flow based on its alignment with particular components in the process chamber (e.g., the edge ring) and the size of the upper gap and the lower gap. Some embodiments advantageously provide better precursor flow distribution for various process spacing between the showerhead and wafer.

Claims (44)

1 . A pump liner comprising:

a ring-shaped body having an upper portion and a lower portion separated by an annular partition,

the upper portion of the ring-shaped body having an upper peripheral wall and a top wall, the upper peripheral wall having an inner diameter surface and an outer diameter surface, the upper peripheral wall having a plurality of circumferentially spaced apertures extending through a thickness of the upper peripheral wall from an opening in the inner diameter surface to an opening in the outer diameter surface;

an upper channel formed in the upper portion of the ring-shaped body, the upper channel defined by a top surface of the annular partition, the outer diameter surface of the upper peripheral wall, and a bottom surface of the top wall,

the lower portion of the ring-shaped body having a lower peripheral wall and a bottom wall, the lower peripheral wall having an inner diameter surface and an outer diameter surface;

a lower channel formed in the lower portion of the ring-shaped body, the lower channel in fluid communication with the upper channel through at least one passage in the annular partition; and

a slit valve opening in the lower portion of the ring-shaped body extending from the inner diameter surface of the lower peripheral wall to the outer diameter surface of the lower peripheral wall, the slit valve opening extending a portion of a circumference of the ring-shaped body and, wherein the pump liner is configured for use in a processing chamber including:

a chamber body having a slit valve side and a pump port side; and

an edge ring having an outer diameter surface positioned within the pump liner so that there is an upper gap between an upper portion of the outer diameter surface of the edge ring and the inner diameter surface of the upper peripheral wall and a lower gap between a lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the lower peripheral wall,

wherein the pump liner is configured to be aligned with the slit valve opening aligned with the slit valve side, and the pump liner reduces side to side variation in gas flow when the upper gap and the lower gap between the upper portion and the lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the pump liner is greater on the slit valve side than the pump port side.

2 . The pump liner of claim 1 , wherein the annular partition has an inner diameter surface, an outer diameter surface, the top surface, and a bottom surface, and the inner diameter surface of the upper peripheral wall is concentric with the inner diameter surface of the annular partition.

3 . The pump liner of claim 2 , wherein a portion of the bottom surface of the annular partition is inside an inner diameter of the lower peripheral wall, the inner diameter defined by the inner diameter surface of the lower peripheral wall.

4 . The pump liner of claim 3 , wherein the portion of the bottom surface of the annular partition has a length greater than 10 mm.

5 . The pump liner of claim 1 , wherein the plurality of circumferentially spaced apertures allows a flow of gas to pass from within the ring-shaped body to the upper channel and each of the plurality of circumferentially spaced apertures has an independent height and independent width.

6 . The pump liner of claim 3 , wherein the top wall of the upper portion of the ring-shaped body has a bottom surface and a top surface defining a thickness of the top wall, the bottom wall has an outer diameter surface, a top surface, and a bottom surface, the inner diameter of the lower peripheral wall being greater than an inner diameter of the upper peripheral wall, the inner diameter of the upper peripheral wall defined by the inner diameter surface of the upper peripheral wall, and the lower channel is defined by the bottom surface of the annular partition, the outer diameter surface of the lower peripheral wall and the top surface of the bottom wall.

7 . The pump liner of claim 1 , wherein the slit valve opening has a height and width sufficient to permit a semiconductor wafer and a robot end effector supporting the semiconductor wafer to be transferred therethrough.

8 . The pump liner of claim 7 , wherein the slit valve opening in the lower portion of the ring-shaped body extends in a range of from 100 degrees to 140 degrees of the ring-shaped body.

9 . The pump liner of claim 1 , wherein there are in a range of from 4 to 256 circumferentially spaced apertures.

10 . The pump liner of claim 1 , wherein the pump liner reduces side to side variation in temperature of a surface positioned within 10 mm of the outer diameter surface of the ring-shaped body.

11 . The pump liner of claim 10 , wherein each of the plurality of circumferentially spaced apertures have a width ranging between a largest width and a smallest width, the smallest width adjacent the at least one passage in the annular partition.

12 . The pump liner of claim 1 , wherein each of the plurality of circumferentially spaced apertures is in a range of from 0.1 inch to 0.8 inches.

13 . The pump liner of claim 1 , wherein the at least one passage in the annular partition is an arc-shaped segment with a concave surface.

14 . A processing chamber comprising:

a chamber body having a top wall, a bottom wall and a sidewall containing an interior volume, the chamber body having a slit valve side and a pump port side;

a pump liner comprising:

a ring-shaped body having an upper portion and a lower portion separated by an annular partition, the upper portion of the ring-shaped body having an upper peripheral wall and a top wall, the upper peripheral wall having an inner diameter surface and an outer diameter surface, the upper peripheral wall having a plurality of circumferentially spaced apertures extending through a thickness of the upper peripheral wall from an opening in the inner diameter surface to an opening in the outer diameter surface;

an upper channel formed in the upper portion of the ring-shaped body, the upper channel defined by a top surface of the annular partition, the outer diameter surface of the upper peripheral wall, and a bottom surface of the top wall, the lower portion of the ring-shaped body having a lower peripheral wall and a bottom wall, the lower peripheral wall having an inner diameter surface;

a lower channel formed in the lower portion of the ring-shaped body, the lower channel in fluid communication with the upper channel through at least one passage in the annular partition; and

a slit valve opening in the lower portion of the ring-shaped body extending from the inner diameter surface of the lower peripheral wall to the outer diameter surface of the lower peripheral wall, the slit valve opening extending a portion of a circumference of the ring-shaped body, the pump liner aligned with the slit valve opening aligned with the slit valve side; and

an edge ring having an outer diameter surface positioned within the pump liner so that there is an upper gap between an upper portion of the outer diameter surface of the edge ring and the inner diameter surface of the upper peripheral wall and a lower gap between a lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the lower peripheral wall, wherein the pump liner reduces side to side variation in gas flow when the upper gap and the lower gap between the upper portion and the lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the pump liner is greater on the slit valve side than the pump port side.

15 . The processing chamber of claim 14 , wherein the upper gap is in a range of from 0.1 inches to 0.5 inches.

16 . The processing chamber of claim 14 , wherein the lower gap is in a range of from 0.5 inches to 1.0 inch.

17 . A pump liner comprising:

a ring-shaped body having an upper portion and a lower portion separated by an annular partition having an inner diameter surface annular partition, an outer diameter surface, a top surface, and a bottom surface

the upper portion of the ring-shaped body having an upper peripheral wall and a top wall, the upper peripheral wall having an inner diameter surface and an outer diameter surface, the inner diameter surface of the upper peripheral wall concentric with the inner diameter surface of the annular partition, the upper peripheral wall having in a range of from 4 to 256 circumferentially spaced apertures extending through a thickness of the upper peripheral wall from an opening in the inner diameter surface to an opening in the outer diameter surface;

an upper channel formed in the upper portion of the ring-shaped body, the upper channel defined by the top surface of the annular partition, the outer diameter surface of the upper peripheral wall, and a bottom surface of the top wall;

the lower portion of the ring-shaped body having a lower peripheral wall and a bottom wall, the lower peripheral wall having an inner diameter surface defining an inner diameter of the lower peripheral wall and an outer diameter surface;

a lower channel formed in the lower portion of the ring-shaped body, the lower channel in fluid communication with the upper channel through at least one passage in the annular partition, a portion of the bottom surface of the annular partition inside the inner diameter of the lower peripheral wall, the at least one passage comprising an arc-shaped segment with a concave surface; and

a slit valve opening in the lower portion of the ring-shaped body extending from the inner diameter surface of the lower peripheral wall to the outer diameter surface of the lower peripheral wall, the slit valve opening extending in a range of from 100 degrees to 140 degrees of the ring-shaped body, wherein the pump liner is configured for use in a processing chamber including:

a chamber body having a slit valve side and a pump port side; and

an edge ring having an outer diameter surface positioned within the pump liner so that there is an upper gap between an upper portion of the outer diameter surface of the edge ring and the inner diameter surface of the upper peripheral wall and a lower gap between a lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the lower peripheral wall,

wherein the pump liner is configured to be aligned with the slit valve opening aligned with the slit valve side, and the pump liner reduces side to side variation in gas flow when the upper gap and the lower gap between the upper portion and the lower portion of the outer diameter surface of the edge ring and the inner diameter surface of the pump liner is greater on the slit valve side than the pump port side.

18 . The pump liner of claim 17 , wherein the slit valve opening has a height and width sufficient to permit a semiconductor wafer and a robot end effector supporting the semiconductor wafer to be transferred therethrough.

19 . The pump liner of claim 17 , wherein the pump liner reduces side to side variation in temperature of a surface positioned within 10 mm of the outer diameter surface of the ring-shaped body.