Pedestal including vapor chamber for substrate processing systems
A substrate support for a substrate processing system includes a pedestal including an upper surface and a lower surface. A vapor chamber is arranged between the pedestal and a baseplate, defines a vapor chamber cavity and includes a plurality of capillary structures arranged on a surface inside of the vapor chamber cavity.
1 . A substrate support for a substrate processing system, comprising:
a pedestal including an upper surface and a lower surface;
a baseplate including fluid passages coupled to the lower surface of the pedestal;
a vapor chamber comprising a working fluid, the vapor chamber arranged between the pedestal and the baseplate, defining a vapor chamber cavity and including a plurality of capillary structures arranged on a surface inside of the vapor chamber cavity, the fluid passages in the baseplate being in thermal communication with a lower surface of the vapor chamber;
a cover that seals the fluid passages and that is flush with an upper surface of the baseplate and directly contacts the lower surface of the vapor chamber; and
a fluid supply configured to supply a fluid to the fluid passages at a first temperature to heat the lower surface of the vapor chamber and at a second temperature to cool the lower surface of the vapor chamber to control a temperature of the pedestal.
2 . The substrate support of claim 1 , wherein the fluid passages are arranged in a spiral pattern.
3 . The substrate support of claim 1 , wherein the plurality of capillary structures are arranged on the lower surface of the vapor chamber and wherein the fluid having a higher temperature than the working fluid causes the working fluid on the plurality of capillary structures to vaporize and condense on cooler surfaces in the vapor chamber cavity.
4 . The substrate support of claim 1 , wherein the plurality of capillary structures are arranged on an upper surface of the vapor chamber, and wherein heat from the pedestal causes the working fluid on the plurality of capillary structures to vaporize and condense on cooler surfaces in the vapor chamber cavity.
5 . The substrate support of claim 1 , wherein the plurality of capillary structures are arranged on at least one of a lower surface, an upper surface and sidewalls of the vapor chamber cavity.
6 . The substrate support of claim 1 , wherein the vapor chamber performs heating and the plurality of capillary structures are arranged on a lower surface of the vapor chamber cavity.
7 . The substrate support of claim 1 , wherein the vapor chamber performs cooling and the plurality of capillary structures are arranged on an upper surface of the vapor chamber cavity.
8 . The substrate support of claim 1 , wherein the plurality of capillary structures move the working fluid in the vapor chamber cavity by capillary action.
9 . The substrate support of claim 1 , wherein the plurality of capillary structures include a wicking material that moves the working fluid in the vapor chamber cavity by capillary action.
10 . The substrate support of claim 1 , wherein the plurality of capillary structures include fabric that moves the working fluid in the vapor chamber cavity by capillary action.
11 . The substrate support of claim 1 , wherein the plurality of capillary structures include a sintered powdered material that moves the working fluid in the vapor chamber cavity by capillary action.
12 . The substrate support of claim 1 , wherein the plurality of capillary structures include a grooved material that moves the working fluid in the vapor chamber cavity by capillary action.
13 . A vapor chamber for a substrate support of a substrate processing system, comprising:
a body including an upper surface, a lower surface and side walls defining a vapor chamber cavity; and
a plurality of capillary structures arranged on at least one of an upper surface, a lower surface and side walls inside of the vapor chamber cavity,
wherein the vapor chamber comprises a working fluid and is configured to be arranged between a pedestal and a baseplate of the substrate support,
wherein a lower surface of the vapor chamber is in thermal communication with fluid passages disposed in the baseplate;
a cover that seals the fluid passages and that is flush with an upper surface of the baseplate and directly contacts the lower surface of the vapor chamber; and
a fluid supplied to the fluid passages at a first temperature to heat the lower surface of the vapor chamber and at a second temperature to cool the lower surface of the vapor chamber to control a temperature of the pedestal.
14 . The vapor chamber of claim 13 , wherein:
the vapor chamber supplies heat to the pedestal, and
the plurality of capillary structures are arranged on the lower surface of the vapor chamber to vaporize the working fluid and condense the working fluid on cooler surfaces in the vapor chamber cavity.
15 . The vapor chamber of claim 13 , wherein:
the vapor chamber performs cooling of the pedestal, and
the plurality of capillary structures are arranged on an upper surface of the vapor chamber to vaporize the working fluid and condense the working fluid on cooler surfaces in the vapor chamber cavity.
16 . The vapor chamber of claim 13 , wherein the plurality of capillary structures include a wicking material that moves the working fluid in the vapor chamber cavity by capillary action.
17 . The vapor chamber of claim 13 , wherein the plurality of capillary structures include fabric that moves the working fluid in the vapor chamber cavity by capillary action.
18 . The vapor chamber of claim 13 , wherein the plurality of capillary structures include a sintered powdered material that moves the working fluid in the vapor chamber cavity by capillary action.
19 . The vapor chamber of claim 13 , wherein the plurality of capillary structures include a grooved material that moves the working fluid in the vapor chamber cavity by capillary action.
20 . A method for manufacturing a substrate support for a substrate processing system, comprising:
defining a vapor chamber cavity in a vapor chamber body;
arranging a plurality of capillary structures arranged on a surface inside of the vapor chamber cavity;
arranging the vapor chamber body between a pedestal and a baseplate;
defining fluid passages in the baseplate, wherein the fluid passages are in thermal communication with a lower surface of the vapor chamber body;
arranging a cover to seal the fluid passages, the cover being flush with an upper surface of the baseplate and directly contacting the lower surface of the vapor chamber body; and
supplying a fluid to the fluid passages at a first temperature to heat the lower surface of the vapor chamber body and at a second temperature to cool the lower surface of the vapor chamber body to control a temperature of the pedestal.
21 . The method of claim 20 , further comprising arranging the fluid passages in a spiral pattern.
22 . The method of claim 20 , further comprising:
arranging the plurality of capillary structures on the lower surface of the vapor chamber body; and
supplying a working fluid in the vapor chamber body.
23 . The method of claim 20 , further comprising:
arranging the plurality of capillary structures on an upper surface of the vapor chamber body; and
supplying a working fluid in the vapor chamber body.
24 . The method of claim 20 , wherein the plurality of capillary structures include a wicking material that moves a working fluid in the vapor chamber cavity by capillary action.
25 . The method of claim 20 , wherein the plurality of capillary structures include fabric that moves a working fluid in the vapor chamber cavity by capillary action.
26 . The method of claim 20 , wherein the plurality of capillary structures include a sintered powdered material that moves a working fluid in the vapor chamber cavity by capillary action.
27 . The method of claim 20 , wherein the plurality of capillary structures include a grooved material that moves a working fluid in the vapor chamber cavity by capillary action.