IP Library Granted Patent US 12668882
Granted Patent B2
US 12668882 · App. 18/176,515 · Granted Jun 30, 2026

Fluid supply system, processing apparatus, recording medium, and method of manufacturing semiconductor device

Inventors: Kaoru Yamamoto (Toyama, JP); Kentaro Goshima (Toyama, JP)
Assignee: Kokusai Electric Corporation
C23C16/52C23C16/448C23C16/455C23C16/45561G05D7/0635H10P14/6682H10P14/69433
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Quick Facts
Patent No.
US 12668882
App. No.
18/176,515
Granted
Jun 30, 2026
Kind
B2
Abstract

There is provided a technique that includes: a flow rate controller configured to control a flow rate of fluid flowing in a pipe; an adjuster configured to supply an adjustment gas to at least a downstream side of the flow rate controller; and a controller configured to be capable of suppressing a phase change of the fluid, which is caused by a temperature drop due to adiabatic expansion, by supplying the adjustment gas from the adjuster according to a difference between an internal pressure of the flow rate controller and a pressure on the downstream side of the flow rate controller.

Claims (47)

1 . A fluid supply system comprising:

a flow rate controller configured to control a flow rate of fluid flowing in a pipe;

an adjuster configured to supply an adjustment gas to at least a downstream side of the flow rate controller; and

a controller configured to be capable of suppressing a phase change of the fluid, which is caused by a temperature drop due to adiabatic expansion, by supplying the adjustment gas from the adjuster according to a difference between an internal pressure of the flow rate controller and a pressure on the downstream side of the flow rate controller,

wherein the controller is further configured to:

compare the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller with a first predetermined value which is set in advance;

cause the adjustment gas to be supplied to a pipe on the downstream side of the flow rate controller when the difference is larger than the first predetermined value; and

cause the flow rate controller to supply the fluid into a process chamber when the difference is equal to or less than the first predetermined value.

2 . The fluid supply system claim 1 , wherein a supply time of the adjustment gas is a time required until the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller becomes equal to or less than the first predetermined value.

3 . The fluid supply system of claim 1 , wherein the controller is configured to be capable of adjusting the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller to fall within a controllable pressure range of the flow rate controller.

4 . The fluid supply system of claim 1 , further comprising: an opening/closing part configured to be capable of supplying the fluid into a process chamber,

wherein a valve characteristic value of the opening/closing part is set to 0.4 or more and 0.7 or less.

5 . The fluid supply system of claim 1 , wherein the controller is further configured to include a memory which stores characteristic data including a vapor pressure curve of a precursor that is a source of the fluid.

6 . The fluid supply system of claim 1 , wherein the controller is further configured to include a memory which stores characteristic data including a control limit range of the flow rate controller.

7 . The fluid supply system claim 1 , wherein the first predetermined value is a lower limit pressure which prevents the phase change of the fluid.

8 . The fluid supply system of claim 1 , wherein the controller is configured such that a pressure in a pipe directly connected to an output side of the flow rate controller is lower than a control limit value at which a controllable state of the flow rate controller is maintained.

9 . The fluid supply system of claim 8 , wherein the controller is configured such that a pressure in the pipe directly connected to the output side of the flow rate controller is higher than a pressure lower limit which prevents the phase change of the fluid.

10 . The fluid supply system of claim 1 , further comprising: a precursor source configured to generate the fluid,

wherein the precursor source is any one of a precursor tank configured to generate a precursor gas by sublimating a solid precursor and a vaporizer configured to generate a precursor gas by vaporizing a liquid precursor.

11 . The fluid supply system of claim 10 , wherein the precursor source includes a sub-heater configured to heat the precursor tank or the vaporizer, and is configured to be capable of being controlled to a temperature higher than a temperature at which the precursor gas is transformed into a gaseous state by heating the sub-heater.

12 . The fluid supply system of claim 4 , further comprising: a heater configured to heat the pipe, the flow rate controller, a pressure sensor, and the opening/closing part,

wherein a temperature of the heater is controlled to a temperature equal to or higher than a vaporization temperature of a precursor that is a source of the fluid.

13 . The fluid supply system of claim 10 , further comprising: a container configured to store the fluid between the flow rate controller and an opening/closing valve,

wherein the controller is configured to temporarily store the fluid, which is generated in the precursor source, in the container and flush-supply the fluid into a process chamber.

14 . The fluid supply system of claim 1 , further comprising a heater configured to heat the adjustment gas to a temperature equal to or higher than a sublimation temperature or a vaporization temperature of the fluid,

wherein the fluid is heated by being mixed with the adjustment gas.

15 . The fluid supply system of claim 1 , wherein the adjuster is installed to be directly connected to a downstream of the flow rate controller.

16 . A processing apparatus comprising:

a flow rate controller configured to control a flow rate of fluid flowing in a pipe;

an adjuster configured to supply an adjustment gas to at least a downstream side of the flow rate controller; and

a controller configured to be capable of suppressing a phase change of the fluid, which is caused by a temperature drop due to adiabatic expansion, by supplying the adjustment gas from the adjuster according to a difference between an internal pressure of the flow rate controller and a pressure on the downstream side of the flow rate controller,

wherein the controller is further configured to:

compare the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller with a first predetermined value which is set in advance;

cause the adjustment gas to be supplied to a pipe on the downstream side of the flow rate controller when the difference is larger than the first predetermined value; and

cause the flow rate controller to supply the fluid into a process chamber when the difference is equal to or less than the first predetermined value.

17 . A non-transitory computer-readable recording medium storing a program that is executed in a processing apparatus including a flow rate controller configured to control a flow rate of fluid flowing in a pipe, an adjuster configured to supply an adjustment gas to at least a downstream side of the flow rate controller, and a controller, and causes the controller to be capable of performing a process comprising:

suppressing a phase change of the fluid, which is caused by a temperature drop due to adiabatic expansion, by supplying the adjustment gas from the adjuster according to a difference between an internal pressure of the flow rate controller and a pressure on the downstream side of the flow rate controller;

comparing the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller with a first predetermined value which is set in advance;

causing the adjustment gas to be supplied to a pipe on the downstream side of the flow rate controller when the difference is larger than the first predetermined value; and

causing the flow rate controller to supply the fluid into a process chamber when the difference is equal to or less than the first predetermined value.

18 . A method of manufacturing a semiconductor device executed by using the fluid supply system of claim 1 , comprising:

adsorbing a precursor gas onto a surface of an object to be processed,

wherein adsorbing the precursor gas comprises:

suppressing a phase change of the precursor gas, which is caused by a temperature drop due to adiabatic expansion, by supplying an adjustment gas according to a difference between an internal pressure of a flow rate controller and a pressure on a downstream side of the flow rate controller;

comparing the difference between the internal pressure of the flow rate controller and the pressure on the downstream side of the flow rate controller with a first predetermined value which is set in advance;

causing the adjustment gas to be supplied to a pipe on the downstream side of the flow rate controller when the difference is larger than the first predetermined value; and

causing the flow rate controller to supply the precursor gas into a process chamber when the difference is equal to or less than the first predetermined value.