IP Library Granted Patent US 12669211
Granted Patent B2
US 12669211 · App. 18/133,140 · Granted Jun 30, 2026

Moldable glass wool to pipe insulation

Inventor: Matthew Girolmo (Lakewood, CO)
Assignee: Johns Manville
F16L59/028F16L59/026F16L59/029F16L59/14
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Quick Facts
Patent No.
US 12669211
App. No.
18/133,140
Granted
Jun 30, 2026
Kind
B2
Abstract

A method of insulating a piping system. The method may comprise coupling an uncured insulation substrate to the piping system and setting the uncured insulation substrate to cure the uncured insulation substrate to a cured insulation substrate.

Claims (28)

1 . A method of insulating a piping system comprising:

coupling an uncured insulation substrate to the piping system;

securing the uncured insulation substrate to the piping system with a jacket by adhering an end of the jacket to a surface of the jacket; and

setting the uncured insulation substrate to cure the uncured insulation substrate to a cured insulation substrate.

2 . The method of claim 1 , wherein the jacket includes a corrugated geometry.

3 . The method of claim 1 , wherein coupling the uncured insulation substrate to the piping system includes wrapping the uncured insulation substrate to the piping system.

4 . The method of claim 1 , wherein coupling the uncured insulation substrate to the piping system includes adhering the uncured insulation substrate to the piping system.

5 . The method of claim 1 , wherein setting the uncured insulation substrate includes setting the uncured insulation substrate at ambient conditions.

6 . The method of claim 1 , further comprising, prior to coupling the uncured insulation substrate to the piping system, peeling off a release layer from the uncured insulation substrate.

7 . A method of insulating a piping system comprising:

coupling an uncured insulation substrate to the piping system;

securing the uncured substrate to the piping system with a jacket having a corrugated geometry; and

setting the uncured insulation substrate to cure the uncured insulation substrate to a cured insulation substrate.

8 . The method of claim 7 , wherein securing the jacket to the insulation substrate includes coupling an end of the jacket to a surface of the jacket.

9 . The method of claim 7 , wherein coupling the uncured insulation substrate to the piping system includes adhering the uncured insulation substrate to the piping system.

10 . The method of claim 7 , wherein setting the uncured insulation substrate includes setting the uncured insulation substrate at ambient conditions.

11 . The method of claim 7 , further comprising, prior to coupling the uncured insulation substrate to the piping system, peeling off a release layer from the uncured insulation substrate.

12 . A method of insulating a piping system comprising:

peeling off a release layer from an uncured insulation substrate;

after peeling off the release layer, coupling the uncured insulation substrate to the piping system; and

setting the uncured insulation substrate to cure the uncured insulation substrate to a cured insulation substrate.

13 . The method of claim 12 , further comprising securing the uncured substrate to the piping system with a jacket, a zip tie, adhesive, wire tie, or tape.

14 . The method of claim 13 , wherein securing the uncured substrate includes securing the jack to the uncured substrate with an additional securing element.

15 . The method of claim 14 , wherein the additional securing element includes at least one of a zip tie, adhesive, wire tie, or tape.

16 . The method of claim 13 , wherein the jacket includes a corrugated geometry.

17 . The method of claim 12 , wherein coupling the uncured insulation substrate to the piping system includes wrapping the uncured insulation substrate to the piping system.

18 . The method of claim 12 , wherein coupling the uncured insulation substrate to the piping system includes adhering the uncured insulation substrate to the piping system.

19 . The method of claim 12 , wherein setting the uncured insulation substrate includes setting the uncured insulation substrate at ambient conditions.