Annular clamp device
An apparatus including: a first clamp plate having an inner diameter defining an aperture, a first outer diameter, and a first thickness; a second clamp plate having: a second outer diameter, and a second thickness. The bottom clamp plate and the top clamp plate are configured to clamp a printed circuit board by penetrating the printed circuit board, the printed circuit board including at least one component positioned within the aperture during clamping of the printed circuit board by the first clamp plate and the second clamp plate.
1 . An apparatus comprising:
a first clamp plate having:
an inner diameter defining an aperture,
a first outer diameter, and
a first thickness;
a second clamp plate having:
a second outer diameter, and
a second thickness, wherein the second clamp plate and the first clamp plate are configured to clamp a printed circuit board by penetrating the printed circuit board, the printed circuit board including at least one component positioned within the aperture during clamping of the printed circuit board by the first clamp plate and the second clamp plate, wherein the first clamp plate is a low-thermal-resistance annular plate configured to mechanically connect with the second clamp plate.
2 . The apparatus of claim 1 , wherein the printed circuit board is a flexible printed circuit.
3 . The apparatus of claim 1 wherein the second clamp plate includes at least one feature that extends through the printed circuit board and mechanically attaches to the first clamp plate.
4 . The apparatus of claim 3 wherein the second clamp plate extends beyond a top surface of the first clamp plate and a mechanical connection between the first clamp plate and the second clamp plate is effectuated by bending, peining, pressing, soldering, welding, brazing, or heat staking of the feature of the second clamp plate.
5 . The apparatus of claim 1 wherein the first clamp plate and the second clamp plate are each configured to accept a fastener that passes through at least a portion of the first clamp plate, the printed circuit board, and at least a portion of the second clamp plate.
6 . The apparatus of claim 1 wherein a thermal paste or compound is installed at an interface between the printed circuit board and at least one of the first clamp plate or the second clamp plate.
7 . The apparatus of claim 1 wherein one or both of the first clamp plate and the second clamp plate comprises a non-plastic polymer or plastic.
8 . The apparatus of claim 1 wherein the second clamp plate includes a relief or cut-out providing clearance for a substrate plate.
9 . The apparatus of claim 1 wherein a substrate plate is installed on a bottom side of the printed circuit board under the at least one component.
10 . The apparatus of claim 9 wherein the substrate plate is integrated into the second clamp plate.
11 . The apparatus of claim 1 wherein the first clamp plate is formed from a rigid material.
12 . An apparatus comprising:
a first annular clamp plate including:
an inner diameter,
an outer diameter,
a thickness;
a printed circuit board in operable connectivity with the first annular clamp plate including one or more copper layers and one or more substrate layers;
at least one component configured to be installed on the printed circuit board at a position such that the inner diameter subtends the at least one component; and
a substrate plate installed on a side of the printed circuit board opposite the component.
13 . The apparatus of claim 12 wherein the first annular clamp plate is configured to reduce thermal resistance between or among the at least one component, the at least one printed circuit board, and the ambient environment.
14 . The apparatus of claim 12 wherein the first annular clamp plate is configured to provide mechanical support for the at least one component.
15 . The apparatus of claim 12 wherein the first annular clamp plate is configured to provide mechanical support for a point of attachment between the at least one component and the printed circuit board.
16 . The apparatus of claim 12 wherein the printed circuit board is a flexible printed circuit board.
17 . The apparatus of claim 12 wherein the thickness of the first annular clamp plate is greater than or equal to a height of the component on the printed circuit board.
18 . The apparatus of claim 12 wherein the first annular clamp plate is attached to the printed circuit board at least in part by means of solder, an adhesive, or a thermally-conductive adhesive.