IP Library › Granted Patent US 12669353

Granted Patent B2

US 12669353 · App. 17/030,108 · Granted Jun 30, 2026

Systems and methods to increase sensor robustness

Inventors: Clark T. Olsen (Dassel, MN); Michael W. Davis (Rockford, MN); Douglas P. Riemer (Waconia, MN); Matthew S. Lang (Excelsior, MN)

Assignee: MOUND LASER & PHOTONICS CENTER, INC.

G01D11/245 H05K7/06 H05K7/2039 H05K9/0079 H05K10/00

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Quick Facts

Patent No.: US 12669353
App. No.: 17/030,108
Granted: Jun 30, 2026
Kind: B2

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Abstract

An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.

Claims (59)

1 . An apparatus comprising:

a substrate;

a first dielectric layer formed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;

a first metal layer disposed on at least one of the portions of the first dielectric layer, wherein the first metal layer is patterned to form one or more sensors in the first metal layer;

a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;

the second metal layer is positioned over the first metal layer and configured to provide a physical barrier covering the one or more sensors;

a third dielectric layer disposed on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;

a first gold plated pad disposed over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits; and

a second gold pad disposed on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits.

2 . The apparatus of claim 1 , wherein the physical barrier is configured to prevent moisture or oxygen from penetrating onto the sensor.

3 . The apparatus of claim 1 , wherein the second metal layer is plated copper.

4 . The apparatus of claim 3 , wherein the plated copper provides a thermal spreading effect to distribute heat over a top surface of the one or more sensors.

5 . The apparatus of claim 1 , wherein the second metal layer includes sputtered chromium.

6 . The apparatus of claim 5 , wherein the sputtered chromium includes one or more anti-static components that reduce electrostatic discharge.

7 . The apparatus of claim 1 , wherein the first metal layer includes a border feature around the one or more sensors.

8 . The apparatus of claim 7 , wherein the border feature is a physical barrier that is configured to prevent ingress of moisture onto the one or more sensors.

9 . The apparatus of claim 7 , wherein the border feature is a sacrificial anode that is consumed in the presence of moisture or oxygen to prevent corrosion of the one or more sensors.

10 . The apparatus of claim 1 , wherein at least one of the one or more sensors is a resistance temperature detector.

11 . The apparatus of claim 1 , wherein at least one of the one or more sensors includes an array of resistance temperature detectors.

12 . The apparatus of claim 1 , wherein at least one of the one or more sensors is a pressure sensor.

13 . The apparatus of claim 12 , wherein the pressure sensor is a strain gauge.

14 . The apparatus of claim 12 , wherein the pressure sensor is a capacitive sensor.

15 . The apparatus of claim 1 , wherein the apparatus is part of any one of an internet of things device, a medical device, a smart sensor, a home automation device, an industrial sensor, an automotive sensor, an environmental device, a security device, a public safety device, a retail device, a logistics device, and a consumer device.

16 . The apparatus of claim 1 , wherein the second metal layer includes one or more sensors formed in the second metal layer.

17 . The apparatus of claim 1 comprising a third metal layer disposed over the second metal layer.

18 . The apparatus of claim 17 , further comprising the third dielectric layer disposed between the second metal layer and the third metal layer.

19 . The apparatus of claim 17 , wherein the third metal layer includes one or more electrical circuits and at least one or more sensors, the third metal layer is positioned over the second metal layer and configured to provide a physical barrier.

20 . A sensor comprising:

a substrate;

a first dielectric layer disposed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;

a first metal layer disposed on at least one of the portions of the first dielectric layer, the first metal layer including one or more sensor components formed in the first metal layer;

a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;

a second metal layer disposed over the second dielectric layer, the second metal layer including one or more electrical circuits and a via to electrically couple the one or more electrical circuits to the at least one of the one or more sensors formed in the first metal layer through the second dielectric layer; a third dielectric layer disposed on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;

a border feature disposed around the one or more sensor components.

21 . The sensor of claim 20 , wherein the border feature is an extra ring of metallic material having the same composition as the metal layer.

22 . The sensor of claim 20 , wherein the border feature prevents the ingress of moisture onto the one or more sensor components or is a sacrificial anode that is consumed in the presence of moisture or oxygen to prevent corrosion of the one or more sensor components.

23 . A method for increasing sensor robustness comprising;

disposing a first dielectric layer over a first side of a substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;

forming a first metal layer on at least one of the portions of the first dielectric layer;

forming one or more sensors in the first metal layer;

forming a second dielectric layer with patterned portions of the second dielectric layer over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;

forming a second metal layer over the second dielectric layer, the second metal layer positioned over the one or more sensors to form a barrier that prevents moisture or oxygen from penetrating onto the one or more sensors, the second metal layer including one or more electrical circuits and a via to electrically couple the one or more electrical circuits to the at least one of the one or more sensors formed in the first metal layer through the second dielectric layer;

forming a third dielectric layer on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;

disposing a first gold plated pad over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits; and

disposing a second gold pad on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits.

24 . The method of claim 23 , further comprising forming a border feature around the one or more sensors.

25 . An apparatus comprising:

a substrate;

a first dielectric layer formed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;

a first metal layer disposed on at least one of the portions of the first dielectric layer, the first metal layer including one or more electrical circuits;

a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more electrical circuits of the first metal layer and the portions of the first dielectric layer;

a second metal layer disposed over the second dielectric layer, the second metal layer including one or more sensors;

a third metal layer is disposed over the second metal layer and configured to provide a physical barrier covering the one or more sensors;