Inspection apparatus and inspection method
An inspection apparatus for electrical inspection of a substrate is provided. The inspection apparatus includes: a probe card including a plurality of probes; a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes; and a controller configured to control a movement of the stage. The controller calculates, using a first displacement amount based on a vertical load of the probe card and a second displacement amount based on an unbalanced load of the probe card that is inclined with respect to the vertical load, a three-dimensional correction amount for the unbalanced load of the probe card, and the controller moves the stage based on the three-dimensional correction amount.
1 . An inspection apparatus for electrical inspection of a substrate, the inspection apparatus comprising:
a probe card including a plurality of probes;
a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes;
a jig disposed above the stage, the jig being configured to apply a vertical load in a vertical direction to the substrate placed on the stage; and
a controller configured to control a movement of the stage, wherein
the controller calculates, using a first displacement amount based on a vertical component of a load of the probe card and a second displacement amount based on a horizontal component of the load of the probe card, a three-dimensional correction amount for the probe card,
the controller moves the stage based on the three-dimensional correction amount,
the first displacement amount varies according to a contact position of the probe card relative to the substrate placed on the stage when the vertical load applied by the jig is aligned with the vertical direction, and
the second displacement amount is caused by an unbalanced load of the probe card regardless of the contact position of the probe card relative to the substrate placed on the stage.
2 . The inspection apparatus according to claim 1 , wherein
the first displacement amount includes an X-axis direction displacement amount Δx, a Y-axis direction displacement amount Δy, and a Z-axis direction displacement amount Δz,
the second displacement amount includes an X-axis component amount Δx′ and a Y-axis component amount Δy′ as the horizontal component of the load of the probe card, and
the controller calculates the three-dimensional correction amount by adding the X-axis component amount Δx′ to the X-axis direction displacement amount Δx, and adding the Y-axis component amount Δy′ to the Y-axis direction displacement amount Δy.
3 . The inspection apparatus according to claim 1 , further comprising:
a position detector configured to detect a position where the substrate contacts each of the probes, wherein
the controller stores in advance a set of first displacement amounts, each of which corresponds to each of coordinate positions where the probes contact the substrate, and
the controller extracts the first displacement amount from the set of the first displacement amounts, according to a coordinate position specified from information on the position detected by the position detector.
4 . The inspection apparatus according to claim 3 , wherein
the stage includes a mounting table for mounting the substrate, and
the controller calculates the set of the first displacement amounts in advance by subtracting coordinates of the mounting table when the vertical load is not applied to the mounting table from coordinates of the mounting table when the vertical load is applied to the mounting table, and stores the set of the first displacement amounts.
5 . The inspection apparatus according to claim 1 , wherein the second displacement amount is set for the probe card mounted on the inspection apparatus.
6 . The inspection apparatus according to claim 5 , wherein the controller continues to hold the second displacement amount in a storage while the probe card is mounted on the inspection apparatus, and deletes the second displacement amount from the storage when the probe card is removed from the inspection apparatus.
7 . The inspection apparatus according to claim 6 , wherein the controller is further configured to acquire the second displacement amount according to the probe card mounted on the inspection apparatus.
8 . The inspection apparatus according to claim 7 , wherein the second displacement amount acquired by the controller is input by a user via a user interface.
9 . The inspection apparatus according to claim 7 , wherein the second displacement amount acquired by the controller is based on information of the probe card mounted on the inspection apparatus.
10 . The inspection apparatus according to claim 2 , further comprising:
a position detector configured to detect a position where the substrate contacts each of the probes, wherein
the controller stores in advance a set of first displacement amounts, each of which corresponds to each of coordinate positions where the probes contact the substrate, and
the controller extracts the first displacement amount from the set of the first displacement amounts, according to a coordinate position specified from information on the position detected by the position detector.
11 . The inspection apparatus according to claim 10 , wherein
the stage includes a mounting table for mounting the substrate, and
the controller calculates the set of the first displacement amounts in advance by subtracting coordinates of the mounting table when the vertical load is not applied to the mounting table from coordinates of the mounting table when the vertical load is applied to the mounting table, and stores the set of the first displacement amounts.
12 . The inspection apparatus according to claim 11 , wherein the second displacement amount is set for the probe card mounted on the inspection apparatus.
13 . The inspection apparatus according to claim 12 , wherein the controller continues to hold the second displacement amount in a storage while the probe card is mounted on the inspection apparatus, and deletes the second displacement amount from the storage when the probe card is removed from the inspection apparatus.
14 . The inspection apparatus according to claim 13 , wherein the controller is further configured to acquire the second displacement amount according to the probe card mounted on the inspection apparatus.
15 . The inspection apparatus according to claim 13 , wherein the second displacement amount acquired by the controller is input by a user via a user interface.
16 . The inspection apparatus according to claim 13 , wherein the second displacement amount acquired by the controller is based on information of the probe card mounted on the inspection apparatus.
17 . An inspection method for electrical inspection of a substrate in an inspection apparatus, the inspection apparatus including: a probe card including a plurality of probes; a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes; and a jig disposed above the stage, the jig being configured to apply a vertical load in a vertical direction to the substrate placed on the stage, the inspection method comprising:
calculating, using a first displacement amount based on a vertical component of a load of the probe card and a second displacement amount based on a horizontal component of the load of the probe card, a three-dimensional correction amount for the probe card; and
moving the stage based on the three-dimensional correction amount, wherein
the first displacement amount varies according to a contact position of the probe card relative to the substrate placed on the stage when the vertical load applied by the jig is aligned with the vertical direction, and
the second displacement amount is caused by an unbalanced load of the probe card regardless of the contact position of the probe card relative to the substrate placed on the stage.