IP Library Granted Patent US 12669478
Granted Patent B2
US 12669478 · App. 18/168,728 · Granted Jun 30, 2026

Efficient ultrasonic phased array phase shift migration imaging method for defects in multi-layer structure

Inventors: Peng Zhao (Hangzhou, CN); Kaipeng Ji (Hangzhou, CN); Chaojie Zhuo (Hangzhou, CN); Haoran Jin (Hangzhou, CN); Jian Chen (Hangzhou, CN); Jianzhong Fu (Hangzhou, CN)
Assignee: ZHEJIANG UNIVERSITY
G01N29/069G01N29/262G01N29/46G01N2291/0231
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Quick Facts
Patent No.
US 12669478
App. No.
18/168,728
Granted
Jun 30, 2026
Kind
B2
Abstract

The present invention provides an efficient ultrasonic phased array phase shift migration imaging method for the defect in a multi-layer structure, including the following steps: (1) transforming full matrix capture data of a multi-layer structure to a frequency-wavenumber domain by means of three-dimensional fast Fourier transform; (2) for any non-traversed layer in the multi-layer structure, extrapolating a surface wave field of the multi-layer structure to an upper interface of the non-traversed layer, to obtain wave field information of the non-traversed layer; (3) according to the obtained wave field information, performing focus imaging on the non-traversed layer in the frequency-wavenumber domain; and (4) repeating the steps (2) and (3), until all layers are traversed, to obtain an imaging result of the multi-layer structure.

Claims (97)

1 . A method for detecting a defect in a multi-layer structure based on efficient ultrasonic phased array phase shift migration imaging, comprising the following steps:

(1) acquiring, by an ultrasonic phased-array sensor, full matrix capture data D (x r , x s , t) of a multi-layer structure, wherein x s represents a position of an s th transmitting element; x r represents a position of an r th receiving element, D (x r , x s , t) represents a signal transmitted from the s th transmitting element and received by the r th receiving element at a time t;

(2) transforming, by a processor, the full matrix capture data D (x r , x s , t) to a frequency-wavenumber domain wavefield data D (k rx , k sx , ω) by means of three-dimensional fast Fourier transform, wherein k rx represents a horizontal wavenumber of a receiving element, k sx represents a horizontal wavenumber of a transmitting element, and ω represents a frequency;

(3) for a non-traversed layer in the multi-layer structure, extrapolating, by the processor, a surface wave field of the multi-layer structure to an upper interface of the non-traversed layer, to obtain wave field information of the non-traversed layer;

(4) according to the obtained wave field information, performing, by the processor, focus imaging on the non-traversed layer in the frequency-wavenumber domain;

(5) repeating, by the processor, the steps (3) and (4), until all layers are traversed, to obtain an imaging result of the multi-layer structure; and

(6) determining a defect in a multi-layer structure based on the imaging result.

2 . The method according to claim 1 , wherein in the step (3), the multi-layer structure is traversed in sequence from top to bottom.

3 . The method according to claim 1 , wherein in the step (3), the surface wave field of the multi-layer structure is extrapolated with a double-square-root vertical wavenumber.

4 . The method according to claim 1 , wherein in the step (4), the non-traversed layer is subjected to focus imaging in the frequency-wavenumber domain with a time t=0 as an imaging condition.

5 . The method according to claim 4 , wherein an expression of an imaging result I(x, z) with the time t=0 as the imaging condition is as follows:

I

(

x

,

z

)

=

dk

rx

dk

sx

d

ω

[

D

(

k

rx

,

k

sx

,

ω

)

e

i

k

z

,

n

(

z

-

z

n

-

1

)

m

=

1

n

-

1

e

i

k

z

,

m

d

m

]

e

i

(

k

rx

-

k

sx

)

x

wherein k rx is the horizontal wavenumber of a receiving element; i is an imaginary unit; k sx is the horizontal wavenumber of a transmitting element; x represents an arrangement direction of an array of phased array sensors; ω represents a frequency; k z,n represents the wavenumber of an n th layer in a z direction; z represents an extrapolation depth; z n-1 represents a depth of a lower interface of an (n−1) th layer; n ranges from 1 to N, N representing the number of layers of the multi-layer structure; k z,m represents the wavenumber of an m th layer in the z direction; and d m represents a thickness of the m th layer.

6 . The method according to claim 1 , wherein in the step (4), specific operation of performing focus imaging on the non-traversed layer in the frequency-wavenumber domain according to the obtained wave field information comprises the following steps:

1) Performing layer-by-layer recursion of the obtained wave field information in an imaging region according to a resolution of a depth direction, to obtain discrete wave fields of the frequency-wavenumber domain;

2) Superposing the obtained discrete wave fields in frequency dimension, to obtain a wave field at a time 0;

3) Transforming the wave field at the time 0 from the wavenumber domain to a spatial domain by means of two-dimensional fast Fourier transform; and

4) Extracting a wave field corresponding to x r =x s =x from the spatial domain as an imaging result of the non-traversed layer, wherein x represents an arrangement direction of an array of phased array sensors, x s represents a position of a transmitting element, and x r represents a position of a receiving element.