IP Library › Granted Patent US 12669524
Granted Patent B2
US 12669524 · App. 18/622,179 · Granted Jun 30, 2026

Current sensing device

Inventors: Adrian Hozoi (Mannheim, DE); Jaromir Podzemny (Brno, CZ)
Assignee: ABB Schweiz AG
G01R15/181G01R15/207G01R19/0092H01F27/325
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Quick Facts
Patent No.
US 12669524
App. No.
18/622,179
Granted
Jun 30, 2026
Kind
B2
Abstract

A current sensing device includes sensor modules, each having a substrate segment and one or more coil elements and a holder structure; wherein the substrate segment comprises a plurality of retaining holes extending at least partially through the substrate segment from a first surface; each coil element comprises at least two locating pins; the one or more coil elements are mounted to the first surface of the substrate segment of that sensor module such that the two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the substrate segment; and wherein the plurality of sensor modules are mounted to the holder structure.

Claims (37)

1 . A current sensing device, comprising:

a plurality of sensor modules; and

a holder structure;

wherein each of the plurality of sensor modules comprises a substrate segment; and one or more coil elements;

wherein the substrate segment comprises a plurality of retaining holes projecting at least part way through the substrate segment from a first surface of the substrate segment;

wherein each of the one or more coil elements comprises a winding body; a length of wire; and at least two locating pins; wherein the winding body has an outer surface around an axis of the winding body, and wherein at least a portion of the length of wire is wound multiple times around the outer surface of the winding body in a generally circumferential direction with respect to the axis of the winding body;

wherein the one or more coil elements of a particular sensor module are mounted to the first surface of the substrate segment of the particular sensor module, wherein two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the substrate segment;

wherein the plurality of sensor modules is mounted to the holder structure; and

wherein the holder structure comprises a plurality of holder segments, and wherein each holder segment has two sensor modules mounted to it.

2 . The current sensing device according to claim 1 , wherein each sensor module is adjacent to two other sensor modules.

3 . The current sensing device according to claim 1 , wherein each sensor module is mounted to two holder segments.

4 . The current sensing device according to claim 1 , wherein each holder segment is adjacent to two other holder segments.

5 . The current sensing device according to claim 1 , wherein a boundary between two adjacent sensor modules is laterally spaced from a boundary between two adjacent holder segments.

6 . The current sensing device according to claim 1 , wherein the first surface of the substrate segment faces away from the holder structure.

7 . The current sensing device according to claim 1 , wherein the first surface of the substrate segment faces towards the holder structure.

8 . The current sensing device according to claim 7 , wherein the holder structure comprises a plurality of retaining holes, and wherein the two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the holder structure.

9 . The current sensing device according to claim 7 , wherein the holder structure comprises a plurality of retaining holes, wherein each coil element comprises one or more further locating pins of the at least two locating pins of each coil element, and wherein the one or more further locating pins are located in one or more retaining holes of the plurality of retaining holes of the holder structure.

10 . The current sensing device according to claim 8 , wherein the current sensing device comprises a second holder structure, and wherein the plurality of sensor modules are mounted to the second holder structure.

11 . The current sensing device according to claim 10 , wherein the second holder structure comprises a plurality of retaining holes, and wherein the two locating pins of the at least two locating pins of each coil element are located in the two retaining holes of the plurality of retaining holes of the substrate segment and located in two retaining holes of the plurality of retaining holes of the second holder structure.

12 . A current sensing device comprising,

a plurality of sensor modules; and

a holder structure;

wherein each of the plurality of sensor modules comprises a substrate segment; and one or more coil elements;

wherein the substrate segment comprises a plurality of retaining holes projecting at least part way through the substrate segment from a first surface of the substrate segment;

wherein each of the one or more coil elements comprises a winding body; a length of wire; and at least two locating pins; wherein the winding body has an outer surface around an axis of the winding body, and wherein at least a portion of the length of wire is wound multiple times around the outer surface of the winding body in a generally circumferential direction with respect to the axis of the winding body;

wherein the one or more coil elements of a particular sensor module are mounted to the first surface of the substrate segment of the particular sensor module, wherein two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the substrate segment; and

wherein the plurality of sensor modules is mounted to the holder structure;

wherein the substrate segment comprises one or more positioning holes, wherein the holder structure comprises a plurality of holding holes, and wherein one or more positioning pins are located in the one or more positioning holes of the substrate segment and in the one or more holding holes of the plurality of holding holes of the holder structure.

13 . A current sensing device comprising,

a plurality of sensor modules; and

a holder structure;

wherein each of the plurality of sensor modules comprises a substrate segment; and one or more coil elements;

wherein the substrate segment comprises a plurality of retaining holes projecting at least part way through the substrate segment from a first surface of the substrate segment;

wherein each of the one or more coil elements comprises a winding body; a length of wire; and at least two locating pins; wherein the winding body has an outer surface around an axis of the winding body, and wherein at least a portion of the length of wire is wound multiple times around the outer surface of the winding body in a generally circumferential direction with respect to the axis of the winding body;

wherein the one or more coil elements of a particular sensor module are mounted to the first surface of the substrate segment of the particular sensor module, wherein two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the substrate segment;

wherein the plurality of sensor modules is mounted to the holder structure;

wherein the plurality of retaining holes extend through the substrate segment, wherein the holder structure comprises a plurality of retaining holes, and wherein the two locating pins of the at least two locating pins of each coil element are located in two retaining holes of the plurality of retaining holes of the holder structure.